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Heating Requirements to Reach Full Strength Heating Requirementsto Reach Full Strength |
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Minimum Temperature Minimum Temperature |
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Tensile Strength Tensile Strength |
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Thermal Conductivity Thermal Conductivity |
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Consistency Consistency |
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Dielectric Strength Dielectric Strength |
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Overall Dry Time Overall Dry Time |
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Specifications Met Specifications Met |
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Container Size Container Size |
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Hardness Rating Hardness Rating |
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Mix Ratio Mix Ratio |
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Mixing Required Mixing Required |
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Touch Dry Time Touch Dry Time |
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Encase electronic assemblies in a layer of silicone for protection from dust, moisture, mechanical shock, and vibration. Softer and more flexible than epoxies and urethanes with the widest temperature range, silicone potting compounds are the best choice for high-temperature applications and electronics exposed to thermal cycling. They have good moisture resistance but poor chemical and abrasion resistance. Silicones provide excellent electrical insulation. They’re also known as RTV (room-temperature vulcanizing).
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Mfr. Model No. | Container Size, oz. | Consistency | Touch, hrs. | Overall, days | Dielectric Strength, V/mil | Thermal Conductivity, W/m-K | Temp. Range, °F | Heating Requirements to Reach Full Strength | Specifications Met | For Use On | Color | Each | |
Dow Corning Compounds—Medium | |||||||||||||
182 | 17.6 | Thick Liquid | 8 | 14 | 475 | 0.16 | -45° to 390° | 30 min. @ 260° F | UL 94V1 | Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel | Clear | 0000000 | 0000000 |