Easy Clean Solder | McMaster-Carr

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Flux Core

Leaded

Lead-Free

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Diameter

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Solder Alloy

Flux Type

For Joining

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Number of Flux Cores

Weight

1 lb.

For Use On

Electrical Components

RoHS

Specifications Met

DFARS Specialty Metals

Exempt

U.S.–Mexico–Canada Agreement (USMCA) Qualifying

Yes

Export Control Classification Number (ECCN)

Performance

REACH

29 Products

Easy-Clean Flux-Core Solder for Electronics and Electrical Applications

Wash away flux residue from this solder with water. It is electrically conductive, so it is good for electronics and electrical applications.

Leaded, Flux Core

Image of Product. Front orientation. Contains Inset, Border. Solder. Easy-Clean Flux-Core Solder for Electronics and Electrical Applications.

		Material Composition
	Solder Alloy	Tin	Lead	Dia.	Melting Temp., ° F	Wt., lb.	Specs. Met		Each
For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel



		Sn60Pb40	60%	40%	0.015"	365	1	IPC J-STD-006	4871N11	000000


		Sn60Pb40	60%	40%	0.020"	365	1	IPC J-STD-006	4871N12	00000
		Sn60Pb40	60%	40%	0.031"	365	1	IPC J-STD-006	4871N13	00000
		Sn60Pb40	60%	40%	0.040"	365	1	IPC J-STD-006	4871N14	00000
		Sn60Pb40	60%	40%	0.050"	365	1	IPC J-STD-006	4871N15	00000
		Sn60Pb40	60%	40%	0.062"	365	1	IPC J-STD-006	4871N16	00000
		Sn60Pb40	60%	40%	0.125"	365	1	IPC J-STD-006	4871N17	00000
		Sn63Pb37	63%	37%	0.015"	360	1	—	7756A3	00000
		Sn63Pb37	63%	37%	0.020"	360	1	—	7756A1	00000
		Sn63Pb37	63%	37%	0.031"	360	1	—	7756A2	00000
		Sn63Pb37	63%	37%	0.040"	365	1	IPC J-STD-006	4871N19	00000

Lead-Free, Flux Core

Lead-free solder is safer to use than leaded solder and helps meet industry regulations.

		Material Composition
	Solder Alloy	Tin	Silver	Copper	Lead	Dia.	Melting Temp., ° F	Wt., lb.	Specs. Met		Each
For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel



		Sn96.5Ag3Cu0.5	96.5%	3%	0.5%	0%	0.025"	365	1	IPC J-STD-006	4871N21	0000000


		Sn96.5Ag3Cu0.5	96.5%	3%	0.5%	0%	0.040"	365	1	IPC J-STD-006	4871N22	000000
		Sn96.5Ag3Cu0.5	96.5%	3%	0.5%	0%	0.125"	365	1	IPC J-STD-006	4871N23	000000
		Sn97Cu3	97%	—	3%	0%	0.025"	445	1	IPC J-STD-006	4871N24	00000
		Sn97Cu3	97%	—	3%	0%	0.031"	445	1	IPC J-STD-006	4871N25	00000
		Sn97Cu3	97%	—	3%	0%	0.050"	445	1	IPC J-STD-006	4871N26	00000
		Sn97Cu3	97%	—	3%	0%	0.125"	445	1	IPC J-STD-006	4871N27	00000

Quick-Flow Easy-Clean Flux-Core Solder for Electronics and Electrical Applications

Electrically conductive and with five flux cores, this solder speeds up the process of soldering electronics, so you use less solder and transmit less heat to the joint. Easily wash away the flux residue with just water.

Leaded, Flux Core

		Material Composition				1 lb.
	Solder Alloy	Tin	Lead	Dia.	Melting Temp., ° F		Each
For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel



		Sn60Pb40	60%	40%	0.025"	365	4873N11	000000


		Sn60Pb40	60%	40%	0.032"	365	4873N12	00000
		Sn60Pb40	60%	40%	0.050"	365	4873N13	00000
		Sn60Pb40	60%	40%	0.062"	365	4873N14	00000
		Sn60Pb40	60%	40%	0.125"	365	4873N15	00000
		Sn63Pb37	63%	37%	0.025"	365	4873N16	00000
		Sn63Pb37	63%	37%	0.032"	365	4873N17	00000
		Sn63Pb37	63%	37%	0.062"	365	4873N18	00000
		Sn63Pb37	63%	37%	0.125"	365	4873N19	00000

Easy-Clean Flux-Core Solder for High-Temperature Applications

The flux residue easily washes away with water. The solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment.

Lead-Free, Flux Core

Lead-free solder is safer to use than leaded solder and helps meet industry regulations.

		Material Composition					1 lb.
	Solder Alloy	Tin	Antimony	Lead	Dia.	Melting Temp., ° F		Each
For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel



		Sn95Sb5	95%	5%	0%	0.031"	460	7843A42	000000


		Sn95Sb5	95%	5%	0%	0.125"	460	7843A46	00000