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    Devcon
    Formulation
    Formulation
    Acrylic
    Ceramic
    Clay
    Epoxy
    Urethane
    Consistency
    Consistency
    Thick Liquid
    Paste
    Gel
    Putty
    Adhesive Type
    Adhesive Type
    Structural
    Maximum Temperature
    Maximum Temperature
    0° F or less
    1° to 999° F
    Cure Type
    Cure Type
    Room Temperature
    Clarity
    Clarity
    Clear
    Opaque
    Elongation
    Elongation
    1%
    2%
    5%
    10%
    20%
    25%
    200%
    Mixing Required
    Mixing Required
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    42 Products