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    Manufacturer
    Manufacturer
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    Devcon
    Formulation
    Formulation
    Acrylic
    Ceramic
    Clay
    Epoxy
    Urethane
    Consistency
    Consistency
    Thick Liquid
    Paste
    Gel
    Putty
    Mixing Required
    Mixing Required
    Yes
    No
    Maximum Temperature
    Maximum Temperature
    Less than 500° F
    Minimum Temperature
    Minimum Temperature
    -74° to -50° F
    -49° to 0° F
    Greater than 0° F
    Clarity
    Clarity
    Clear
    Opaque
    Finishing Method
    Finishing Method
    Sand
    Drill
    Tap
    Machine
    Saw
    Elongation
    Elongation
    1%
    2%
    5%
    10%
    20%
    25%
    200%
    DFARS (Defense Acquisition Regulations Supplement)
    DFARS (Defense Acquisition
    Regulations Supplement)
    Adhesive Type
    Adhesive Type
    Structural
    Cure Type
    Cure Type
    Room Temperature
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    40 Products