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Thermal Conductivity Thermal Conductivity |
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Container Type Container Type |
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| Single-Use Packet | Can |
Adhesive Type Adhesive Type | Show |
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Adhesive Type Adhesive Type | Hide |
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Type Type |
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Maximum Temperature Maximum Temperature |
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Surface Resistivity Surface Resistivity |
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Consistency Consistency |
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Formulation Formulation |
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Cure Type Cure Type |
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Mixing Required Mixing Required |
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RoHS (Restriction of Hazardous Substances) RoHS (Restriction ofHazardous Substances) |
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Container Size Container Size |
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Viscosity Viscosity |
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Elongation Elongation |
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Color Color |
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 | Silver |
Minimum Temperature Minimum Temperature |
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Clarity Clarity |
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DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement)  |
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REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) REACH (Registration,Evaluation, Authorization and Restriction of Chemicals) |
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About Structural Adhesives
More
Conductive Adhesives for Electronics
An alternative to solder, these flexible, silver-filled adhesives accommodate joint movement. Use them to bond electrical components and repair circuits.
Epoxy adhesives are two-part adhesives that need to be mixed together. The size listed is the combined total of the two parts.
Epoxy Adhesives
One-Time-Use Packet
Can
Container | |||||||||||
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| Size, fl. oz. | Net Weight, oz. | Begins to Harden | Reaches Full Strength | Thermal Conductivity, W/m-K | Surface Resistivity, ohms-cm | Mix Ratio | Consistency | Temp. Range, °F | For Joining | Each | |
One-Time-Use Packet | |||||||||||
| __ | 0.09 | 3 hrs. | 24 hrs. | 1.55 | 0.05 | 1:1.15 | Paste | -75° to 230° | Ceramic, Glass, Metal | 0000000 | 000000 |
Can | |||||||||||
| 0.5 | __ | 4 hrs. | 5 days | 7.93 | 0.0004 | 1:1 | Paste | 80° to 265° | Metal | 0000000 | 000000 |
| 1 | __ | 4 hrs. | 5 days | 7.93 | 0.0004 | 1:1 | Paste | 80° to 265° | Metal | 0000000 | 000000 |