For Joining For Joining |
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Container Size Container Size |
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Cleanup Method Cleanup Method |
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Specifications Met Specifications Met |
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RoHS (Restriction of Hazardous Substances) RoHS (Restriction ofHazardous Substances) |
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REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) REACH (Registration,Evaluation, Authorization and Restriction of Chemicals) |
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DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement) |
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Tip Shape Tip Shape |
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Activation Activation |
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Soldering Flux Paste for Plumbing

This flux meets NSF/ANSI Standard 61 for drinking water. Do not use it on magnesium or electronics.
For Joining | Container Size, fl. oz. | Form | Cleanup Method | Environment | Specifications Met | Each | |
Steel, Copper, Brass, Zinc | 2 | Paste | Water | Food Industry | MIL-F-4995 Type II; NSF/ANSI 61 | 0000000 | 00000 |
Steel, Copper, Brass, Zinc | 4 | Paste | Water | Food Industry | MIL-F-4995 Type II; NSF/ANSI 61 | 0000000 | 0000 |
Steel, Copper, Brass, Zinc | 16 | Paste | Water | Food Industry | MIL-F-4995 Type II; NSF/ANSI 61 | 0000000 | 00000 |
Soldering Flux Liquid for Plumbing

Use this flux for non-potable (nondrinking) water applications. Do not use it on magnesium or electronics.
Nokorode Soldering Flux

Protect the solder joint from corrosion with this flux paste. Do not use it on magnesium or electronics.
Fast-Flushing Soldering Flux for Plumbing

This flux paste provides the fastest removal of flux from pipe lines. It meets NSF/ANSI 61 safety standards for use with drinking water systems. Do not use it on magnesium or electronics.
For Joining | Container Size, fl. oz. | Form | Cleanup Method | Specifications Met | Each | |
Steel, Copper, Brass, Zinc | 4 | Paste | Water | ASTM B813, NSF/ANSI 61 | 00000000 | 000000 |
Rubyfluid Soldering Flux

This flux causes solder to flow in a thin film to create strong joints with minimal solder use. Do not use it on magnesium or electronics.
Easy-Clean Soldering Flux for Electronics



The flux residue easily washes away with water. The flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Container | Tip | |||||||||
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For Joining | Size | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 fl. oz. | Pen | Chisel | 0.2" | Liquid | Water | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
Nickel Alloys, Copper, Brass | 0.3 fl. oz. | Pen | Chisel | 0.157" | Liquid | Water | IPC J-STD-004 | __ | 000000 | 0000 |
Nickel Alloys, Copper, Brass | 0.3 fl. oz. | Syringe | Needle Point | 0.031" | Paste | Water | IPC J-STD-004 | __ | 000000 | 00000 |
Nickel Alloys, Copper, Brass | 2 fl. oz. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 0000 |
Nickel Alloys, Copper, Brass | 4 fl. oz. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 0000 |
Nickel Alloys, Copper, Brass | 16 fl. oz. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
Nickel Alloys, Copper, Brass | 32 fl. oz. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
Nickel Alloys, Copper, Brass | 1 gal. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
No-Clean Soldering Flux for Electronics

This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
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For Joining | Container Size, fl. oz. | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
Lead-Free No-Clean Soldering Flux for Electronics

This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
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For Joining | Container Size, fl. oz. | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 000000 |
Mildly-Activated Rosin Soldering Flux for Electronics


This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
Fully-Activated Rosin Soldering Flux for Electronics

Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
For Joining | Container Size, gal. | Form | Cleanup Method | Specifications Met | Each | |
Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Nonactivated Rosin Soldering Flux for Electronics


This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Container | Tip | |||||||||
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For Joining | Size | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 gal. | Bottle | __ | __ | Liquid | Flux Remover | IPC J-STD-004 | __ | 0000000 | 000000 |
Copper, Brass, Bronze | 0.3 fl. oz. | Pen | Chisel | 0.2" | Liquid | Flux Remover | IPC J-STD-004 | Outside United States and Canada | 0000000 | 0000 |
Empty Needle-Point Pen Dispenser for Soldering Flux

Fill this dispenser with the flux of your choice to prepare electrical assemblies and printed circuit boards for soldering.
Tip | ||||
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Container Size, fl. oz. | Shape | Diameter | Each | |
1/5 | Needle Point | 0.013" | 0000000 | 00000 |
No-Clean Soldering Flux for Low-Melting-Point Solders

Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.
Brazing Flux

Use this flux with silver brazing alloys to clean and prepare surfaces. Residue washes off with hot water. Do not use it with titanium.
Max. Temperature, ° F | Color | Form | Cleanup Method | Specifications Met | Each | |
1/2 lbs. | ||||||
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For Joining Brass, Bronze, Copper, Stainless Steel, Steel | ||||||
1600° | White | Paste | Water | AWS A5.31-92, Type FB3A; Fed. Spec. O-F-499, Type B; SAE AMS3410 | 000000 | 00000 |
1 lbs. | ||||||
For Joining Brass, Bronze, Copper, Stainless Steel, Steel | ||||||
1600° | White | Paste | Water | AWS A5.31-92, Type FB3A; Fed. Spec. O-F-499, Type B; SAE AMS3410 | 000000 | 00000 |
Brazing Flux for Nickel Alloys and Carbide

Use this flux with silver brazing alloys to clean and prepare surfaces. It is boron modified and residue washes off with hot water. Do not use it with titanium.
Max. Temperature, ° F | Color | Form | Cleanup Method | Specifications Met | Each | |
1/2 lbs. | ||||||
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For Joining Carbide, Nickel Alloys | ||||||
1700° | Black | Paste | Water | AWS A5.31-91, Type FB3C; Fed. Spec. O-F-499, Type B; SAE AMS3411 | 0000000 | 000000 |
1 lbs. | ||||||
For Joining Carbide, Nickel Alloys | ||||||
1700° | Black | Paste | Water | AWS A5.31-91, Type FB3C; Fed. Spec. O-F-499, Type B; SAE AMS3411 | 0000000 | 00000 |
Babbitt Paste for Casting Metals

An integral component of casting babbitt bearings, apply a thin coat of this paste to bronze, cast iron, and steel bearing housings before casting to prevent separation.
Material Composition | |||||
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Lead | Tin | Zinc Chloride | Wt., lbs. | Each | |
40% | 40% | 10% | 1 | 0000000 | 0000000 |