Search Results
Material Material |
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Thermal Conductivity Thermal Conductivity |
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For Use On For Use On |
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Heat Sink Compounds
Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
Zinc oxide compounds create a more secure bond than silicone compounds.
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| Thermal Conductivity | Temp. Range, °F | Type | Size, oz. | Manufacturer | Manufacturer Model Number | Specifications Met | Each | |
Silicone | ||||||||
| 0.68 W/m-K @ 97° F | -40° to 390° | Tube | 5 | Dow Corning | 340 | __ | 00000000 | 000000 |
| 0.75 W/m-K @ 97° F | -40° to 400° | Tube | 8 | __ | __ | __ | 00000000 | 00000 |
Zinc Oxide | ||||||||
| 0.92 W/m-K @ 97° F | -40° to 320° | Tube | 2 | __ | __ | __ | 0000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 390° | Tube | 4 | __ | __ | ASTM D5470 | 00000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 390° | Jar | 16 | __ | __ | ASTM D5470 | 00000000 | 00000 |
Non-Bonding Heat Transfer Compounds
Heat Transfer Compound
Also known as thermal paste, these boron-nitride compounds increase heat transfer between parts while preventing them from sticking. Unlike antiseize compounds, they don't conduct electricity, so you won't risk shorting out sensitive electronics. They're often used on thermocouple probes to improve accuracy. You can also use them in 3D printer heating blocks and other high-temperature areas to keep parts from fusing together.
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| Size, oz. | Type | Chemical | Max. Temp., °F | Thermal Conductivity | Color | Includes | For Use On | Compatible With | Each | |
| 0.2 | Syringe | Boron Nitride | 1830° | 31.4 W/m-K @ 212° F | White | Three Applicator Brushes | 3D Printer Extruder Heating Elements, Electrical Components | Aluminum, Brass, Copper, Iron, Nickel, Stainless Steel, Steel, Titanium | 0000000 | 000000 |