Thermal Conductivity Thermal Conductivity |
|---|
|
Shape Shape |
|---|
|
Material Material |
|---|
|
DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement)  |
|---|
For Use On For Use On |
|---|
|
RoHS (Restriction of Hazardous Substances) RoHS (Restriction ofHazardous Substances) |
|---|
|
Approximate Weight Approximate Weight |
|---|
|
Electrical Resistivity Electrical Resistivity |
|---|
|
Shear Strength Shear Strength |
|---|
|
Density Density |
|---|
|
Surface Resistivity (Text) Surface Resistivity (Text) |
|---|
|
Casting Metals
Melt and pour these alloys into molds to create metal parts and prototypes.
Bismuth and indium alloys expand slightly as they solidify, pushing into the crevices of a mold to produce detailed replicas. These alloys are useful for repairing dies, creating fusible links, and holding delicate parts for machining. Indium alloys have a low melting temperature so they can be cast in molds made from glass, quartz, mica, and ceramic.
Material Composition | Approximate | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Melting Temperature, °F | Bismuth | Lead | Indium | Tin | Cadmium | Thick. | Wd. | Lg. | Dia. | Wt., lbs. | Shape | Each | |
| 117° | 45% | 23% | 19% | 8% | 5% | 1/4" | 2" | 4 1/2" | __ | 1/2 | Sheet and Bar | 0000000 | 0000000 |
| 134° | 48% | 25% | 5% | 13% | 9% | 1/2" | __ | __ | 3 1/2" | 1 1/2 | Rod and Disc | 00000000 | 000000 |
| 136° | 49% | 18% | 21% | 12% | __ | 1/4" | 1 7/8" | 4 1/2" | __ | 1/2 | Sheet and Bar | 0000000 | 000000 |
| 142° | 48% | 25% | 4% | 13% | 10% | 1/2" | __ | __ | 3 1/2" | 1 1/2 | Rod and Disc | 00000000 | 000000 |
Low-Melting-Point Lead-Free Solder Ribbon for Low-Temperature Applications
For use on large, flat areas, this indium ribbon solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 12" | 1" | 0.002" | 0.1 | 0000000 | 000000 |
Low-Melting-Point Lead-Free Solder for Low-Temperature Applications
Made of indium, this solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 0.030" | 0.11 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 0.030" | 0.11 | 0000000 | 000000 |
Low-Melting-Point Solder Ribbon for Low-Temperature Applications
Made with lead and silver, this solder ribbon has greater tensile strength and density than other indium-based solders, giving it a stronger hold. Solder ribbon is more easily used on large, flat areas than wire solder. Indium is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity, although not as good as solder with greater indium content. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 80% | 15% | 5% | 310° | 43 | 2,550 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
Low-Melting-Point Solder for Low-Temperature Applications
Made with lead and silver, this solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold. Indium is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity, although not as good as solder with greater indium content. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 80% | 15% | 5% | 310° | 43 | 2,550 | 0.030" | 0.01 | 0000000 | 0000000 |
Heat-Transfer Foil
Made of indium, this foil is more thermally conductive than thermal interface materials (TIMs) made of plastic. By efficiently pulling heat away from components that produce heat, such as CPUs, this foil lets you use smaller forced cooling systems to extend battery life. It’s also softer and more ductile than paste and putty, covering surfaces better to minimize airflow gaps and increase heat flow. Unlike paste and grease, this foil won’t leach out from between surfaces over time, nor will it dry out and lose effectiveness. It’s clean, easy to install and reposition, and requires no surface preparation. Foil is corrosion resistant and doesn’t need special storage.
Foil with 48% tin has greater tensile and shear strength than foil without tin, but is less thermally conductive.
Each | Package | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Thickness | Tensile Strength, psi | Shear Strength, lbs./sq. in. | Maximum Temperature, °F | Thermal Conductivity @ Temperature | Electrical Resistivity | For Use Outdoors | Each | Pkg. Qty. | Pkg. | ||
2" × 2" | |||||||||||
Indium | |||||||||||
| 0.004" | 270 | 890 | 255° | 86 W/m-K @ 185° F | 7.2×106 ohms-cm | No | 0000000 | 000000 | 20 | 0000000 | 0000000 |
| 0.01" | 270 | 890 | 255° | 86 W/m-K @ 185° F | 7.2×106 ohms-cm | No | 0000000 | 00000 | 20 | 0000000 | 000000 |
Indium Alloy (48% Tin) | |||||||||||
| 0.004" | 1,730 | 1,620 | 190° | 34 W/m-K @ 185° F | 1.5×105 ohms-cm | No | 0000000 | 00000 | 20 | 0000000 | 000000 |
| 0.01" | 1,730 | 1,620 | 190° | 34 W/m-K @ 185° F | 1.5×105 ohms-cm | No | 0000000 | 00000 | 20 | 0000000 | 000000 |
Conductive Liquid Gallium
A safe alternative to mercury in thermometers and thermostats, gallium transfers heat and electricity without toxic vapor that can be inhaled. Also known as Galinstan. Its low melting point means it's liquid at room temperature. When used next to parts that generate concentrated heat, it dissipates the heat quickly, making it good thermal interface material. It also allows electricity to pass throughout it, so it's often used in switches and electronics that must bend and flex.
Gallium clings to both metallic and nonmetallic surfaces such as glass and quartz. However, it eats away at most metal when used at high temperatures and dissolves aluminum even at ambient temperatures.
When choosing gallium, keep in mind its composition. The higher the gallium and indium content, the better it is at transferring heat. Gallium with tin reduces the melting point, but also decreases how well it transfers heat.
Material Composition | Container | ||||||||
|---|---|---|---|---|---|---|---|---|---|
| Gallium | Indium | Tin | Size, fl. oz. | Type | Melting Temperature, °F | Maximum Temperature, °F | For Use On | Each | |
| 66.5% | 20.5% | 13% | 0.1 | Syringe | 50° | 930° | Glass, Nickel Alloys, Quartz, Stainless Steel, Steel | 0000000 | 0000000 |
| 75.5% | 24.5% | __ | 0.1 | Syringe | 60° | 930° | Glass, Nickel Alloys, Quartz, Stainless Steel, Steel | 0000000 | 000000 |