For Joining For Joining |
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Solder Type Solder Type |
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Flux Type Flux Type |
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Melting Temperature Melting Temperature |
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RoHS (Restriction of Hazardous Substances) RoHS (Restriction ofHazardous Substances) |
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DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement) |
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REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) REACH (Registration,Evaluation, Authorization and Restriction of Chemicals) |
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Specifications Met Specifications Met |
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Rosin Flux-Core Lead-Free Solder for Electronics and Electrical Applications
Rosin flux is quick acting with strong cleaning action, but leaves residue that requires flux remover. This solder is electrically conductive. Product regulations restrict sales to the listed jurisdictions/areas.
Material Composition | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Tin | Silver | Antimony | Copper | Lead | Melting Temperature, ° F | Dia. | Wt. | Cannot Be Sold To | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys | ||||||||||
| 97% | 0.2% | 0.8% | 2% | 0% | 425° | 0.031" | 1 lbs. | __ | 0000000 | 000000 |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | ||||||||||
| 96.5% | 3% | __ | 0.5% | 0% | 420° | 0.020" | 1 lbs. | __ | 0000000 | 000000 |
| 96.5% | 3% | __ | 0.5% | 0% | 420° | 0.031" | 0.375 oz. | __ | 0000000 | 0000 |
| 96.5% | 3% | __ | 0.5% | 0% | 420° | 0.031" | 1 lbs. | __ | 0000000 | 000000 |
| 96.5% | 3% | __ | 0.5% | 0% | 420° | 0.040" | 0.625 oz. | Outside United States and Canada | 0000000 | 00000 |
| 96.5% | 3% | __ | 0.5% | 0% | 420° | 0.062" | 1 lbs. | __ | 0000000 | 000000 |
| 96.5% | 3% | __ | 0.5% | 0% | 420° | 0.093" | 1 lbs. | __ | 0000000 | 000000 |
| 97% | __ | __ | 3% | 0% | 445° | 0.031" | 1 lbs. | __ | 0000000 | 00000 |
| 97% | __ | __ | 3% | 0% | 445° | 0.062" | 1 lbs. | __ | 00000000 | 00000 |
| 97% | __ | __ | 3% | 0% | 445° | 0.093" | 1 lbs. | __ | 00000000 | 00000 |
| 97% | __ | __ | 3% | 0% | 445° | 0.125" | 1 lbs. | __ | 0000000 | 00000 |
| 99.3% | __ | __ | 0.7% | 0% | 440° | 0.015" | 1 lbs. | __ | 00000000 | 000000 |
| 99.3% | __ | __ | 0.7% | 0% | 440° | 0.020" | 1 lbs. | __ | 00000000 | 000000 |
| 99.3% | __ | __ | 0.7% | 0% | 440° | 0.032" | 1 lbs. | __ | 00000000 | 00000 |
| 99.3% | __ | __ | 0.7% | 0% | 440° | 0.062" | 1 lbs. | __ | 00000000 | 00000 |
| 99.3% | __ | __ | 0.7% | 0% | 440° | 0.093" | 1 lbs. | __ | 00000000 | 000000 |
No-Clean Flux-Core Lead-Free Solder for Electronics and Electrical Applications
This flux leaves minimal residue so there's no cleanup. This solder is electrically conductive.
Material Composition | ||||||||
|---|---|---|---|---|---|---|---|---|
| Tin | Silver | Copper | Lead | Melting Temperature, ° F | Dia. | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | ||||||||
| 96.5% | 3% | 0.5% | 0% | 420° | 0.015" | 1 | 0000000 | 0000000 |
| 96.5% | 3% | 0.5% | 0% | 420° | 0.020" | 1 | 0000000 | 000000 |
| 96.5% | 3% | 0.5% | 0% | 420° | 0.031" | 1 | 0000000 | 000000 |
| 96.5% | 3% | 0.5% | 0% | 420° | 0.062" | 1 | 0000000 | 000000 |
| 96.5% | 3% | 0.5% | 0% | 420° | 0.093" | 1 | 0000000 | 000000 |
Fast-Flowing Rosin Flux-Core Lead-Free Solder
for Electronics and Electrical Applications
With five rosin flux cores, this solder joins faster, uses less material, and transmits less heat than single-flux-core solder. Rosin flux is quick acting with a strong cleaning action and is electrically conductive, but leaves residue that requires flux remover. This solder is a safer alternative to leaded solder.
Material Composition | ||||||||
|---|---|---|---|---|---|---|---|---|
| Tin | Silver | Copper | Lead | Melting Temperature, ° F | Diameter | Weight, lbs. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | ||||||||
| 96% | 4% | __ | 0% | 470° | 0.032" | 1 | 0000000 | 0000000 |
| 96% | 4% | __ | 0% | 470° | 0.062" | 1 | 0000000 | 000000 |
| 97% | __ | 3% | 0% | 445° | 0.032" | 1 | 0000000 | 00000 |
| 97% | __ | 3% | 0% | 445° | 0.062" | 1 | 0000000 | 00000 |
| 97% | __ | 3% | 0% | 445° | 0.125" | 1 | 0000000 | 00000 |
Acid Flux-Core Lead-Free Solder for Electronics and Electrical Applications
Acid flux has strong cleaning action, but leaves corrosive residue that washes away with water. This solder is electrically conductive.
Lead-Free Solder for Electronics and Electrical Applications
This solder is electrically conductive. Without a flux core, it allows you to choose the flux that works best for your application.
Material Composition | ||||||||
|---|---|---|---|---|---|---|---|---|
| Tin | Silver | Copper | Lead | Melting Temperature, ° F | Dia. | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | ||||||||
| 96.5% | 3% | 0.5% | 0% | 420° | 0.020" | 1 | 0000000 | 0000000 |
| 96.5% | 3% | 0.5% | 0% | 420° | 0.032" | 1 | 0000000 | 000000 |
| 96.5% | 3% | 0.5% | 0% | 420° | 0.062" | 1 | 0000000 | 000000 |
| 96.5% | 3% | 0.5% | 0% | 420° | 0.093" | 1 | 0000000 | 000000 |
| 97% | __ | 3% | 0% | 445° | 0.031" | 1 | 0000000 | 00000 |
| 97% | __ | 3% | 0% | 445° | 0.125" | 1 | 0000000 | 00000 |
| 99.3% | __ | 0.7% | 0% | 440° | 0.015" | 1 | 0000000 | 00000 |
| 99.3% | __ | 0.7% | 0% | 440° | 0.020" | 1 | 0000000 | 00000 |
| 99.3% | __ | 0.7% | 0% | 440° | 0.032" | 1 | 0000000 | 00000 |
| 99.3% | __ | 0.7% | 0% | 440° | 0.062" | 1 | 0000000 | 00000 |
| 99.3% | __ | 0.7% | 0% | 440° | 0.125" | 1 | 0000000 | 00000 |
Lead-Free Bar Solder for Electronics and Electrical Applications
This solder is commonly used in solder melting pots. It is electrically conductive. Without a flux core, it allows you to choose the flux that works best for your application.
Material Composition | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Tin | Silver | Antimony | Copper | Lead | Melting Temperature, ° F | Shape | Lg. | Wd. | Ht. | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper | ||||||||||||
| 97% | 0.2% | 0.8% | 2% | 0% | 465° | Rectangular Bar | 14" | 1/2" | 1/2" | 1 | 00000000 | 000000 |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | ||||||||||||
| 96% | 4% | __ | __ | 0% | 450° | Triangular Bar | 12" | 1" | 1/2" | 1 | 00000000 | 00000 |
| 96.5% | 3% | __ | 0.5% | 0% | 430° | Triangular Bar | 12" | 1" | 1/2" | 1 | 00000000 | 00000 |
| 97% | __ | __ | 3% | 0% | 365° | Triangular Bar | 12" | 1" | 1/2" | 1 | 00000000 | 00000 |
| 99.3% | __ | __ | 0.7% | 0% | 440° | Triangular Bar | 12" | 1" | 1/2" | 1 | 00000000 | 00000 |
No-Clean Flux-Core Lead-Free Solder for High-Temperature Applications
The flux leaves minimal residue so there's no cleanup. The solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment.
Easy-Clean Flux-Core Lead-Free Solder for High-Temperature Applications
The flux residue easily washes away with water. The solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment.
Rosin Flux-Core Lead-Free Solder for High-Temperature Applications
Rosin flux is quick acting with strong cleaning action, but leaves residue that requires flux remover. The solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment.
Lead-Free Solder for High-Temperature Applications
This solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment. It does not have a flux core, so you can choose the flux that works best for your application.
Lead-Free Bar Solder for High-Temperature Applications
This solder is commonly used in solder melting pots. It keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment. It does not have a flux core, so you can choose the flux that works best for your application.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Tin | Antimony | Lead | Melting Temperature, ° F | Lg. | Wd. | Ht. | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | |||||||||
| 95% | 5% | 0% | 460° | 12" | 1" | 1/2" | 1 | 0000000 | 000000 |
Solder for Drinking Water
This solder meets NSF/ANSI Standard 61 for drinking water.
Lead-Free Solder for HVAC Applications
This solder resists vibration to form strong joints in HVAC systems. It does not have a flux core, so you can choose the flux that works best for your application.
Rosin Flux-Core Lead-Free Solder for HVAC Applications
Rosin flux is quick acting with strong cleaning action, but leaves residue that requires flux remover. This solder resists vibration to form strong joints in HVAC systems.
Material Composition | |||||||
|---|---|---|---|---|---|---|---|
| Tin | Silver | Lead | Melting Temperature, °F | Dia. | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys | |||||||
| 95% | 5% | 0% | 430° | 0.031" | 1 | 0000000 | 0000000 |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | |||||||
| 96% | 4% | 0% | 430° | 0.031" | 1 | 0000000 | 000000 |
| 96% | 4% | 0% | 430° | 0.062" | 1 | 0000000 | 000000 |
| 96% | 4% | 0% | 430° | 0.125" | 1 | 0000000 | 000000 |
Acid Flux-Core Lead-Free Solder for HVAC Applications
Acid flux has strong cleaning action, but leaves corrosive residue that washes away with water. This solder resists vibration to form strong joints in HVAC systems.
Material Composition | |||||||
|---|---|---|---|---|---|---|---|
| Tin | Silver | Lead | Melting Temperature, ° F | Dia. | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel | |||||||
| 96% | 4% | 0% | 430° | 0.125" | 1 | 0000000 | 0000000 |
Lead-Free Solder for Food Service Equipment
Composed of pure tin, this solder is safe for use with food service equipment.
Material Composition | |||||||
|---|---|---|---|---|---|---|---|
| Tin | Lead | Melting Temperature, °F | Solder Type | Dia. | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Stainless Steel, Steel | |||||||
| 100% | 0% | 450° | Flux Required | 0.125" | 1 | 000000 | 000000 |
Lead-Free Bar Solder for Food Service Equipment
This solder is commonly used in solder melting pots. It's composed of pure tin, so it is safe for use with food service equipment.
Material Composition | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Tin | Lead | Melting Temperature, °F | Solder Type | Lg. | Wd. | Ht. | Wt., lbs. | Specifications Met | Each | |
For Joining Brass, Bronze, Copper, Stainless Steel, Steel | ||||||||||
| 100% | 0% | 450° | Flux Required | 11 1/2" | 1" | 1/2" | 1 | NSF/ANSI 372 | 0000000 | 000000 |
High-Density Low-Melting-Point Lead-Free Solder
This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. Do not use this solder on drinking water pipes.
Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
Low-Melting-Point Lead-Free Solder for Low-Temperature Applications
Made of indium, this solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 0.030" | 0.01 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 0.030" | 0.01 | 0000000 | 000000 |
Low-Melting-Point Lead-Free Solder Ribbon for Low-Temperature Applications
For use on large, flat areas, this indium ribbon solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 12" | 1" | 0.002" | 0.1 | 0000000 | 000000 |
Solder for Aluminum
Without a flux core, this solder allows you to choose the flux that works best for your application.
No-Flux Solder for Aluminum
Flux is not required for this solder to form strong joints.
Material Composition | ||||||||
|---|---|---|---|---|---|---|---|---|
| Zinc | Aluminum | Lead | Melting Temperature, ° F | Dia. | Lg. | Wt., lbs. | Pkg. of 37 | |
| 98% | 2% | 0% | 760° | 0.125" | 18" | 2 | 000000 | 000000 |
Lead-Free Paste Solder
Use this paste in hard-to-reach areas—apply a thin coat of paste to the surfaces you want joined, apply heat, and wipe with a damp cloth. Paste is made of finely powdered solder combined with a flux paste.
Material Composition | ||||||||
|---|---|---|---|---|---|---|---|---|
| Tin | Antimony | Lead | Melting Temperature, ° F | Solder Type | Form | Wt., lbs. | Each | |
For Joining Brass, Copper, Nickel Alloys, Steel, Zinc | ||||||||
| 71.3% | 3.8% | 0% | 470° | No Flux Required | Paste | 1 | 0000000 | 000000 |