For Joining For Joining |
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DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement) |
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Tip Shape Tip Shape |
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REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) REACH (Registration,Evaluation, Authorization and Restriction of Chemicals) |
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RoHS (Restriction of Hazardous Substances) RoHS (Restriction ofHazardous Substances) |
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No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
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| For Joining | Container Size, oz. | Shape | Size | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 | Chisel | 0.200" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
Lead-Free No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| For Joining | Container Size, oz. | Shape | Size | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 | Chisel | 0.200" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
No-Clean Soldering Flux for Low-Melting-Point Solders
Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.