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Heat Sink Bonding Compounds
Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
Zinc-oxide compounds create a more secure bond than silicone compounds.
Container | ||||||
|---|---|---|---|---|---|---|
| Thermal Conductivity | Temp. Range, °F | Type | Size, fl. oz. | Specifications Met | Each | |
Zinc Oxide | ||||||
| 0.92 W/m-K @ 97° F | -40° to 320° | Tube | 2 | MIL-C-47113 | 0000000 | 000000 |
| 0.92 W/m-K @ 97° F | -40° to 320° | Syringe | 1 | MIL-C-47113 | 00000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 390° | Tube | 4 | ASTM D5470 | 00000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 390° | Jar | 16 | ASTM D5470 | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Tube | 2 | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Tube | 4 | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Jar | 16 | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Syringe | 1 | __ | 00000000 | 00000 |