Cleanup Method Cleanup Method |
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For Joining For Joining |
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Container Size Container Size |
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Tip Shape Tip Shape |
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RoHS (Restriction of Hazardous Substances) RoHS (Restriction ofHazardous Substances) |
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REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) REACH (Registration,Evaluation, Authorization and Restriction of Chemicals) |
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Activation Activation |
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DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement)  |
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Easy-Clean Soldering Flux for Electronics
The flux residue easily washes away with water. The flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Container | Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| For Joining | Size | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 fl. oz. | Pen | Chisel | 0.2" | Liquid | Water | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
| Nickel Alloys, Copper, Brass | 0.3 fl. oz. | Pen | Chisel | 0.157" | Liquid | Water | IPC J-STD-004 | __ | 000000 | 0000 |
| Nickel Alloys, Copper, Brass | 0.3 fl. oz. | Syringe | Needle Point | 0.031" | Paste | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | 2 fl. oz. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 0000 |
| Nickel Alloys, Copper, Brass | 4 fl. oz. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 0000 |
| Nickel Alloys, Copper, Brass | 16 fl. oz. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | 32 fl. oz. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
| Nickel Alloys, Copper, Brass | 1 gal. | Bottle | __ | __ | Liquid | Water | IPC J-STD-004 | __ | 000000 | 00000 |
No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| For Joining | Container Size, fl. oz. | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 00000 |
Lead-Free No-Clean Soldering Flux for Electronics
This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| For Joining | Container Size, fl. oz. | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Copper, Brass, Bronze | 0.3 | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 000000 |
Mildly-Activated Rosin Soldering Flux for Electronics
This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
Fully-Activated Rosin Soldering Flux for Electronics
Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
| For Joining | Container Size, gal. | Form | Cleanup Method | Specifications Met | Each | |
| Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Nonactivated Rosin Soldering Flux for Electronics
This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Container | Tip | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| For Joining | Size | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
| Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 gal. | Bottle | __ | __ | Liquid | Flux Remover | IPC J-STD-004 | __ | 0000000 | 000000 |
| Copper, Brass, Bronze | 0.3 fl. oz. | Pen | Chisel | 0.2" | Liquid | Flux Remover | IPC J-STD-004 | Outside United States and Canada | 0000000 | 0000 |