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    10 Products

    No-Clean Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Syringe.
    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Jar.

    Pen

    Syringe

    Jar

    This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
    Pastes—Paste flux is easier to apply than liquid flux for precise applications.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Net Wt.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Features
    Cannot Be Sold To
    Each
    Nickel, Copper, Brass, Bronze0.3—Syringe——PasteNo CleanIPC J-STD-004Luer Lock Connection—7206N11000000
    Nickel, Copper, Brass, Bronze—3 1/2 oz.Jar——PasteNo CleanIPC J-STD-004——7206N1200000
    Nickel, Copper, Brass, Bronze—1 lb.Jar——PasteNo CleanIPC J-STD-004——7206N13000000
    Copper, Brass, Bronze0.3—PenChisel0.2"LiquidNo CleanIPC J-STD-004—Outside United States and Canada7893A210000

    Lead-Free No-Clean Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Lead-Free No-Clean Soldering Flux for Electronics.
    This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Copper, Brass, Bronze0.3PenChisel0.2"LiquidNo CleanIPC J-STD-0047893A24000000

    No-Clean Soldering Flux for Low-Melting-Point Solders

    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Low-Melting-Point Solders.
    Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Copper, Indium, Indium Alloy4/5SyringeNeedle0.096"LiquidNo CleanIPC J-STD-0048508N11000000
    Copper, Bismuth4/5SyringeNeedle0.096"LiquidNo CleanIPC J-STD-0048508N1200000

    No-Clean Brazing Flux for Joining Aluminum to Copper

    Image of Product. Front orientation. Brazing Flux. No-Clean Brazing Flux for Joining Aluminum to Copper.
    Clean and prepare surfaces before joining aluminum to copper. With minimal residue, this flux does not require cleanup.
    Container
    Max. Temp.,
    ° F
    Net
    Wt.
    Type
    Color
    Form
    Cleanup
    Method
    Each
    For Joining Aluminum, Copper
    9854 oz.JarGrayPasteNo Clean7214N11000000
    9858 oz.JarGrayPasteNo Clean7214N1200000
    9851 lb.JarGrayPasteNo Clean7214N13000000
     
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