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    78 Products

    Heat-Transfer Compounds

    Image of ProductInUse. Front orientation. Contains Annotated. Thermal Paste. Heat-Transfer Compounds.
    Image of Product. Front orientation. Thermal Paste. Heat-Transfer Compounds, Cartridge.
    Image of Product. Front orientation. Thermal Paste. Heat-Transfer Compounds, Can.
    Image of Product. Front orientation. Thermal Paste. Heat-Transfer Compounds, Pail.

    Cartridge

    Can

    Pail

    Eliminate air gaps that cause heat loss and premature heater failure. These compounds mold around heat cable so it makes direct contact with pipes, pumps, and other parts.
    450° F Maximum Temperature—Compounds with a 450° F maximum temperature don’t harden, so they maintain a tight seal even as the surface you’re heating expands and contracts. Since they’re waterproof, they also shield the surface from corrosion.
    750° F Maximum Temperature—Compounds with a 750° F maximum temperature are often used with steam, hot oil, and glycol heat trace lines.
    1,250° F Maximum Temperature and 2,200° F Maximum Temperature—Compounds with a 1250° F or 2200° F maximum temperature are often used with steam heat trace lines, strip heaters, and ring heaters.
    Container
    Size
    Type
    Begins to
    Harden, hr.
    Reaches Full
    Strength, hr.
    For Surface Material
    For Use
    Outdoors
    Each
    450° F Maximum Temperature
     
    114 W/m² ° C
    10 fl. oz.CartridgeCeramic, Glass, Metal, PlasticYes3568K41000000
    32 fl. oz.CartridgeCeramic, Glass, Metal, PlasticYes3568K7100000
    1 qt.CanCeramic, Glass, Metal, PlasticYes3568K4200000
    1 gal.CanCeramic, Glass, Metal, PlasticYes3568K43000000
    5 gal.CanCeramic, Glass, Metal, PlasticYes3568K72000000
     
    750° F Maximum Temperature
     
    114 W/m² ° C
    10 fl. oz.Cartridge124Ceramic, Glass, Metal, PlasticNo3568K5100000
    32 fl. oz.Cartridge124Ceramic, Glass, Metal, PlasticNo3568K7400000
    1 qt.Can124Ceramic, Glass, Metal, PlasticNo3568K5200000
     
    151 W/m² ° C
    1 gal.Can624Ceramic, Glass, MetalNo3568K100000
    5 gal.Can624Ceramic, Glass, MetalNo3568K3000000
     
    1,250° F Maximum Temperature
     
    114 W/m² ° C
    10 fl. oz.Cartridge124Ceramic, Glass, Metal, PlasticNo3568K6100000
    32 fl. oz.Cartridge124Ceramic, Glass, Metal, PlasticNo3568K7600000
    1 qt.Can124Ceramic, Glass, Metal, PlasticNo3568K6200000
    1 gal.Can124Ceramic, Glass, Metal, PlasticNo3568K63000000
    5 gal.Can124Ceramic, Glass, Metal, PlasticNo3568K78000000
     
    2,200° F Maximum Temperature
     
    85 W/m² ° C
    1 gal.Pail124MetalYes6571N11000000
     

    Heat Sink Bonding Compounds

    Image of Product. Front orientation. Heat Sink Compounds. Heat Sink Bonding Compounds, Tube.
    Image of Product. Front orientation. Heat Sink Compounds. Heat Sink Bonding Compounds, Pail.
    Image of Product. Front orientation. Heat Sink Compounds. Heat Sink Bonding Compounds, Jar.
    Image of Product. Front orientation. Heat Sink Compounds. Heat Sink Bonding Compounds, Syringe.

    Tube

    Pail

    Jar

    Syringe

    Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
    Zinc Oxide—Zinc-oxide compounds create a more secure bond than silicone compounds.
    Container
    Thermal Conductivity
    @ Temp.
    Temp. Range,
    ° F
    Type
    Size, fl.
    oz.
    Net Wt.,
    lb.
    Mfr.
    Mfr. Model
    No.
    Mil. Spec.
    Specs.
    Met
    Each
    Silicone Rubber
    0.68 W/(m⋅°C) @ 97° F-40 to 390Tube5Dow34010405K83000000
    0.75 W/(m⋅°C) @ 97° F-40 to 400Tube810405K7900000
    0.75 W/(m⋅°C) @ 97° F-40 to 400Pail8010405K15300000000
     
    Zinc Oxide
    0.92 W/(m⋅°C) @ 97° F-40 to 320Tube2MIL-C-471133883K2400000
    0.92 W/(m⋅°C) @ 97° F-40 to 320Syringe1MIL-C-471133883K10100000
    0.92 W/(m⋅°C) @ 97° F-40 to 390Tube4ASTM D547076645A1200000
    0.92 W/(m⋅°C) @ 97° F-40 to 390Jar16ASTM D547076645A1400000
    5 W/(m⋅°C) @ 97° F-40 to 500Tube23883K10300000
    5 W/(m⋅°C) @ 97° F-40 to 500Tube43883K10400000
    5 W/(m⋅°C) @ 97° F-40 to 500Jar163883K10500000
    5 W/(m⋅°C) @ 97° F-40 to 500Syringe13883K10200000
     

    Conductive Adhesives for Electronics

    An alternative to solder, these flexible, silver-filled adhesives accommodate joint movement. Use them to bond electrical components and repair circuits.
    Epoxy
    Image of Product. Single-Use Packet and  Syringe. Front orientation. Conductive Adhesives. Conductive Adhesives for Electronics, Loctite®, Single-Use Packet, Syringe.
    Image of Product. Front orientation. Conductive Adhesives. Conductive Adhesives for Electronics, Single-Use Packet.
    Image of Product. Can. Front orientation. Conductive Adhesives. Conductive Adhesives for Electronics, Can.

    Single-Use Packet and 

    Syringe

    Single-Use

    Packet

    Can

    Epoxy adhesives are two-part adhesives that need to be mixed together. The size listed is the combined total of the two parts.
    ASTM E595—Adhesives that meet ASTM E595, a standard used by NASA, produce almost no volatile emissions that could damage sensitive electronics, even in a vacuum.
    Container
    Mfr. Model
    No.
    Size, fl.
    oz.
    Net Wt.,
    oz.
    Type
    Surface
    Resistivity
    Begins to
    Harden
    Reaches Full
    Strength
    Thermal Conductivity,
    W/(m⋅°C)
    Mix
    Ratio
    Consistency
    Max. Temp.,
    ° F
    Specs.
    Met
    For Joining
    Each
    Loctite®
    29020.09Single-Use Packet, Syringe1× 10^-3Ω⋅cm60 min.24 hr.2.99100:6Paste230ASTM E595Ceramic, Glass, Metal7595A113000000
    29020.35Single-Use Packet, Syringe1× 10^-3Ω⋅cm60 min.24 hr.2.99100:6Paste230ASTM E595Ceramic, Glass, Metal7595A114000000
     
    Other Conductive Adhesives
    0.09Single-Use Packet5× 10^-2Ω⋅cm3 hr.24 hr.1.551:1.15Paste230Ceramic, Glass, Metal7661A1300000
    0.5Can4× 10^-4Ω⋅cm4 hr.5 day7.931:1Paste265Metal7595A33000000
    0.5Can9× 10^-5Ω⋅cm4 hr.5 day7.91:1Paste175ASTM E595Ceramic, Glass, Metal7595A111000000
    1Can4× 10^-4Ω⋅cm4 hr.5 day7.931:1Paste265Metal7595A34000000
    1Can9× 10^-5Ω⋅cm4 hr.5 day7.91:1Paste175ASTM E595Ceramic, Glass, Metal7595A112000000
     
    Plastic
    Image of Product. Front orientation. Conductive Adhesives. Conductive Adhesives for Electronics, Strip with Adhesive on One Side.

    Strip with Adhesive on

    One Side

    Plastic adhesives are one-part adhesives that don’t need to be mixed. Dry to the touch and faster and easier to apply than two-part adhesives, they’re best for use on automated assembly lines. Often used to join solar cells in solar panels, these adhesives make instant electrical connections without flux at lower temperatures than soldering. Since they attach to solar cells with heat and slight pressure, they limit stress cracks that can form when soldering. These adhesives can also be used as a bridge between multiple solar panels.
    Lg.
    Wd.
    Thk.
    Melting
    Temp., ° F
    Max. Temp.,
    ° F
    Surface
    Resistivity
    Begins to
    Harden, sec.
    Reaches Full
    Strength, sec.
    Thermal Conductivity,
    W/(m⋅°C)
    Consistency
    For
    Joining
    Each
    Strip with Adhesive on One Side
    12"1/16"0.002"2503001× 10^-4Ω⋅cm5512FilmMetal7661A11100000
     

    Non-Bonding Heat Transfer Compounds

    Image of Product. Front orientation. Thermal Paste. Non-Bonding Heat Transfer Compounds.
    Also known as thermal paste, these boron-nitride compounds increase heat transfer between parts while preventing them from sticking. Unlike antiseize compounds, they don't conduct electricity, so you won't risk shorting out sensitive electronics. They're often used on thermocouple probes to improve accuracy. You can also use them in 3D printer heating blocks and other high-temperature areas to keep parts from fusing together.
    Container
    Size, fl.
    oz.
    Type
    Chemical
    Max.
    Temp.
    Thermal Conductivity
    @ Temp.
    Color
    Includes
    For Use On
    For Use With
    Each
    0.2SyringeBoron Nitride1,562° F
    850° C
    31.4 W/(m⋅°C) @ 212° FWhiteThree Applicator Brushes3D Printer Extruder Heating Elements, Electrical ComponentsAluminum, Brass, Copper, Iron, Nickel, Stainless Steel, Steel, Titanium3715N11000000
    1SyringeBoron Nitride1,562° F
    850° C
    31.4 W/(m⋅°C) @ 212° FWhite3D Printer Extruder Heating Elements, Electrical ComponentsAluminum, Brass, Copper, Iron, Nickel, Stainless Steel, Steel, Titanium3715N1200000
     

    Conductive Surface Fillers for Electronics

    Image of Product. Front orientation. Surface Fillers. Conductive Surface Fillers for Electronics , Epoxy, Jar.
    Image of Product. Front orientation. Epoxy. Conductive Surface Fillers for Electronics , Single-Use Packet.

    Epoxy

    Jar

    Single-Use

    Packet

    A high silver content allows these surface fillers to conduct electricity and heat. Use them to fill gaps and rebuild missing material on electrical connections or to assemble new components. They come as two parts. The size listed is the combined total of the two parts.
    Thermal Conductivity—Thermal conductivity measures a material’s ability to transfer heat. The higher the rating, the more heat it transfers.
    Electrical Volume Resistivity—Electrical volume resistivity measures how well a material opposes the flow of electricity. The lower the rating, the more electricity it conducts.
    Container
    Temp.
    Range, ° F
    Mfr. Model
    No.
    Size, fl.
    oz.
    Net Wt.,
    oz.
    Type
    Begins to
    Harden
    Reaches Full
    Strength
    Consistency
    Mixing
    Req.
    Thermal Conductivity,
    W/(m⋅°C)
    Electrical Volume
    Resistivity
    Mix
    Ratio
    Max.
    Thk.
    For Use
    Outdoors
    Min.
    Max.
    Color
    For Use On
    Each
    Loctite® Surface Fillers
    38880.09Single-Use Packet90 min.24 hr.PasteYes1.440.001Ω⋅cm100:61/4"Yes-40170SilverAluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Titanium, Polycarbonate7366A55000000
     
    Surface Fillers
    0.09Single-Use Packet90 min.24 hr.PasteYes6.050.009Ω⋅cm100:61/4"Yes-75250SilverAluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Titanium, Ceramic, Glass7661A1100000
    0.35Single-Use Packet90 min.24 hr.PasteYes6.050.009Ω⋅cm100:61/4"Yes-75250SilverAluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Titanium, Ceramic, Glass7661A12000000
    0.5Jar4 hr.5 dayPasteYes5.770.0004Ω⋅cm1:1Not RatedNoNot Rated300SilverAluminum, Brass, Copper, Steel, Stainless Steel7595A31000000
    1Jar4 hr.5 dayPasteYes5.770.0004Ω⋅cm1:1Not RatedNoNot Rated300SilverAluminum, Brass, Copper, Steel, Stainless Steel7595A32000000
     

    Conductive Gallium

    Image of Product. Front orientation. Gallium. Conductive Gallium.
    A safe alternative to mercury in thermometers and thermostats, gallium transfers heat and electricity without toxic vapor that can be inhaled. Also known as Galinstan. Its low melting point means it's liquid at room temperature. When used next to parts that generate concentrated heat, it dissipates the heat quickly, making it good thermal interface material. It also allows electricity to pass throughout it, so it's often used in switches and electronics that must bend and flex.
    Gallium clings to both metallic and nonmetallic surfaces such as glass and quartz. However, it eats away at most metal when used at high temperatures and dissolves aluminum even at ambient temperatures.
    When choosing gallium, keep in mind its composition. The higher the gallium and indium content, the better it is at transferring heat. Gallium with tin reduces the melting point, but also decreases how well it transfers heat.
    Material
    Composition
    Container
    Gallium
    Indium
    Tin
    Size, fl.
    oz.
    Type
    Melting
    Temp., ° F
    Max. Temp.,
    ° F
    For Use On
    Each
    66.5%20.5%13%0.1Syringe50930Glass, Nickel, Quartz, Stainless Steel, Steel6244N110000000
    75.5%24.5%0.1Syringe60930Glass, Nickel, Quartz, Stainless Steel, Steel6244N12000000

    Electrically and Thermally Conductive Grease

    Image of Product. Front orientation. Grease. Electrically and Thermally Conductive Grease, Syringe.

    Syringe

    Image of Product. Front orientation. Grease. Electrically and Thermally Conductive Grease, Jar.

    Jar

    A high silver content gives this grease excellent conductivity for applications where electricity and heat transfer are required. It is suitable for ESD (electrostatic discharge) and EMI (electromagnetic interference) shielding applications.
    Grease lubricates most efficiently within the listed temperature range.
    2 NLGI Grade—NLGI 2 is about the consistency of peanut butter.
    Melting Temperature—Melting temperature is the point at which grease will fail and run out of equipment, leaving it to run dry.
    Electrical Resistivity—Electrical resistivity is a measure of how well a material opposes the flow of electricity. The lower the rating, the more electricity it conducts.
    Thermal Conductivity—Thermal conductivity measures a material’s ability to transfer heat. The higher the rating, the more heat it transfers.
    Cannot Be Sold To—Product regulations restrict sales to the listed jurisdictions/areas.
    Container
    Temp.,
    ° F
    NLGI Consistency
    Grade
    Base Oil
    Additive
    Size, fl.
    oz.
    Type
    Min.
    Max.
    Melting Temp.,
    ° F
    Electrical
    Resistivity
    Thermal Conductivity,
    BTU⋅in/(hr⋅ft²⋅°F)
    Color
    Cannot Be Sold To
    Each
    Silicone Rubber Thickener
    Not Rated
    Synthetic OilSilver (100% Concentration)0.2Syringe-704854900.010Ω⋅cm40SilverOutside United States and Canada1219K55000000
     
    Other Grease
    2
    Synthetic OilSilver (75% Concentration)1Jar-70500Not Rated0.005Ω⋅cm60Silver1219K53000000
    2
    Synthetic OilSilver (85% Concentration)0.5Jar-40300Not Rated0.005Ω⋅cm60Silver1219K57000000
    2
    Synthetic OilSilver (85% Concentration)1Jar-40300Not Rated0.005Ω⋅cm60Silver1219K59000000
     

    Heat-Transfer Epoxy Potting Compounds

    Formulated to draw heat away from sensitive electronic components, these potting compounds have higher thermal conductivity than standard potting compounds. Use them to encase electronic assemblies for protection from dust, chemicals, moisture, mechanical shock, and vibration. Rigid and wear resistant, epoxies are the strongest of the potting compounds. They have excellent chemical and moisture resistance, withstand a wide range of temperatures, and provide excellent electrical insulation.
    Jar and Syringe Potting Compounds—Extra Hard
    Image of Product. Front orientation. Potting Compounds. Heat-Transfer Epoxy Potting Compounds, Jar, Syringe.
    Dry Time
    Temp.
    Container
    Size, fl. oz.
    Consistency
    Touch
    Overall,
    hr.
    Dielectric Strength,
    V/mil
    Thermal Conductivity,
    W/(m⋅°C)
    Min.
    Max.,
    ° F
    Heating Req. to Reach
    Full Strength
    For Use On
    Color
    Each
    0.9Thick Liquid25 min.244501.87Not Rated5001 hr. @ 250°F Then 1 hr. @ 350°FAluminum, Brass, Bronze, Cast Iron, Copper, Iron, Steel, Stainless Steel, Silver, Titanium, Plastic, Composite, Ceramic, GlassBlack7563A55000000
    1Gel4 hr.6Not Rated1.87Not Rated6004 Hrs. @ 250°F Then 2 Hrs. @ 350°FAluminum, Brass, Bronze, Cast Iron, Copper, Iron, Steel, Stainless Steel, Silver, Titanium, Plastic, Composite, Ceramic, GlassBlack7563A5700000
    1.5Thin Liquid30 min.264500.21Not Rated5001 hr. @ 250°F Then 1 hr. @ 350°FAluminum, Brass, Bronze, Cast Iron, Copper, Iron, Steel, Stainless Steel, Silver, Titanium, Plastic, Composite, Ceramic, GlassAmber7563A5200000
    Pail and Bottle Potting Compounds—Extra Hard
    Image of Product. Front orientation. Potting Compounds. Heat-Transfer Epoxy Potting Compounds, Pail, Bottle.
    Dry Time
    Temp.
    Container
    Size, gal.
    Consistency
    Touch,
    min.
    Overall,
    hr.
    Dielectric Strength,
    V/mil
    Thermal Conductivity,
    W/(m⋅°C)
    Min.
    Max.,
    ° F
    For Use On
    Color
    Each
    1Thick Liquid25244501.87Not Rated500Steel, Ceramic, GlassBlack7563A260000000
    Cartridge Potting Compounds—Extra Hard
    Image of Product. Front orientation. Potting Compounds. Heat-Transfer Epoxy Potting Compounds, Cartridge.
    Cartridge potting compounds require a gun and mixer nozzle (each sold separately) to dispense.
    Dry Time
    Temp.,
    ° F
    Container
    Size, fl. oz.
    Consistency
    Touch,
    min.
    Overall,
    hr.
    Dielectric Strength,
    V/mil
    Thermal Conductivity,
    W/(m⋅°C)
    Min.
    Max.
    For Use On
    Color
    Each
    1.7Thick Liquid1585201.01-40210Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Silver, Titanium, Plastic, Composite, FiberglassBlack7548A11000000
    Accessories for Potting Compounds
    Jar and Bottle Potting Compounds—Extra Hard
    Image of Product. Front orientation. Potting Compounds. Heat-Transfer Epoxy Potting Compounds, Bottle, Jar.
    Dry Time
    Temp.
    Container
    Size, fl. oz.
    Consistency
    Touch
    Overall,
    hr.
    Dielectric Strength,
    V/mil
    Thermal Conductivity,
    W/(m⋅°C)
    Min.
    Max.,
    ° F
    Heating Req. to Reach
    Full Strength
    For Use On
    Color
    Each
    16Thin Liquid30 min.264500.21Not Rated5001 hr. @ 250°F Then 1 hr. @ 350°FAluminum, Brass, Bronze, Cast Iron, Copper, Iron, Steel, Stainless Steel, Silver, Titanium, Plastic, Composite, Ceramic, GlassAmber7563A510000000
    19Thick Liquid25 min.244501.87Not Rated500Steel, Ceramic, GlassBlack7563A24000000
    20Gel4 hr.6Not Rated1.87Not Rated6004 Hrs. @ 250°F Then 2 Hrs. @ 350°FSteel, Ceramic, GlassBlack7563A27000000

    Insulating Adhesives for Electronics

    Secure hardware on circuit boards while insulating current.
    Epoxy
    Image of Product. Front orientation. Electrically Insulating Adhesives. Insulating Adhesives for Electronics, Epoxy, Single-Use Packet.
    Image of Product. Front orientation. Electrically Insulating Adhesives. Insulating Adhesives for Electronics, Epoxy, Jar.

    Single-Use

    Packet

    Jar

    Epoxy adhesives are two-part adhesives that need to be mixed. The size listed is the combined total of the two parts.
    Model Number 2151—Loctite® 2151 resist salts, mild acids, and oils. They can also handle sudden impacts and shocks.
    120 hr. Reaches Full Strength—Epoxy adhesives that reach full strength in 120 hrs. are flexible, making them ideal for bonding dissimilar materials that may shift or expand differently under heat.
    ASTM E595—Adhesives that meet ASTM E595, a standard used by NASA, release almost no volatile emissions that could damage sensitive electronics, even in a vacuum.
    Container
    Temp.,
    ° F
    Mfr. Model
    No.
    Size, fl.
    oz.
    Type
    Begins to
    Harden
    Reaches Full
    Strength, hr.
    Thermal Conductivity,
    W/(m⋅°C)
    Mix
    Ratio
    Consistency
    Min.
    Max.
    Color
    Clarity
    Specs.
    Met
    For Joining
    Each
    Loctite® Adhesive
    21510.1Single-Use Packet45 min.40.95100:9.5Paste-90235BlueOpaqueASTM E595Metal, Plastic74755A111000000
    21510.4Single-Use Packet45 min.40.95100:9.5Paste-90235BlueOpaqueASTM E595Metal, Plastic74755A11200000
     
    Adhesive
    0.5Jar4 hr.241.71:1PasteNot Rated300WhiteOpaqueASTM E595Metal74755A11300000
    0.5Jar4 hr.1201.71:1PasteNot Rated300WhiteOpaqueASTM E595Metal74755A11500000
    1Jar4 hr.241.71:1PasteNot Rated300WhiteOpaqueASTM E595Metal74755A11400000
    1Jar4 hr.1201.71:1PasteNot Rated300WhiteOpaqueASTM E595Metal74755A11600000
     
    Plastic
    Image of Product. Front orientation. Electrically Insulating Adhesives. Insulating Adhesives for Electronics, Plastic.
    Plastic adhesives create an instant bond, so they’re the best choice for automated assembly lines. The bond is weaker than that of epoxy and cyanoacrylate adhesives, but it’s sufficient for attaching heat sinks. Since they remain tacky, you can detach and reposition parts.
    ASTM E595—Adhesives that meet ASTM E595, a standard used by NASA, release almost no volatile emissions that could damage sensitive electronics, even in a vacuum.
    Material Certificate Icon
    Certificates with a traceable lot number and product shelf life are available for these products. Download certificates from ORDER HISTORY after your order ships.
    Temp.,
    ° F
    Lg.
    Wd.
    Thk.
    Thermal Conductivity,
    W/(m⋅°C)
    Consistency
    Min.
    Max.
    Color
    Clarity
    Specs.
    Met
    For
    Joining
    Each
    Adhesive
    6"6"0.004"1.7Film-85300WhiteOpaqueASTM E595Metal74755A117000000
    6"6"0.006"1.7Film-85300WhiteOpaqueASTM E595Metal74755A11800000
     

    Low-Outgassing Heat-Transfer Epoxy Potting Compounds

    Image of Product. Front orientation. Potting Compounds. Low-Outgassing Heat-Transfer Epoxy Potting Compounds.
    Tested to meet ASTM E595, a standard used by NASA, these potting compounds release almost no volatile emissions that could damage sensitive electronics, even in a vacuum. Use them to draw heat away from your components—they conduct heat better than standard potting compounds. Made of epoxy, they’re the strongest of the potting compounds, so they’re rigid and wear resistant. They’ll also resist breaking down from chemicals and moisture. These compounds are excellent at insulating current, and they’ll shield against dust, vibration, and shock.
    To apply, mix the two parts together and pour them over components inside a container, such as a potting box.
    Dry Time
    Container
    Size, fl. oz.
    Consistency
    Touch
    Overall,
    hr.
    Mix
    Ratio
    Dielectric Strength,
    V/mil
    Thermal Conductivity,
    W/(m⋅°C)
    Temp. Range,
    ° F
    Heating Req. to Reach
    Full Strength
    Specs.
    Met
    For Use On
    Color
    Clarity
    Each
    Pail and Can Potting Compounds—Extra Hard
    32Thick Liquid45 min.24100:8.53651.25-40 to 265ASTM E595Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, PlasticBlackOpaque9263N130000000
    32Thick Liquid4 hr.12100:144500.55-65 to 31012 Hrs. @ 175°FASTM E595Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, PlasticBlackOpaque9263N15000000
     

    Conductive Surface Filler Pens for Electronics

    Image of Product. Front orientation. Surface Fillers. Conductive Surface Filler Pens for Electronics, Acrylic Plastic.

    Acrylic Plastic

    Image of Product. Front orientation. Surface Fillers. Conductive Surface Filler Pens for Electronics, Epoxy.

    Epoxy

    Dispense ready-to-use conductive liquid to fill pits and small gaps on circuit board components. These pens are also used to sketch and repair conductive pathways.
    Carbon Filled—Carbon acrylic plastic pens should be used where only a small amount of conductivity is needed, such as circuit boards in keyboards. Their high surface resistivity only allows a small current to pass.
    Nickel Filled—Nickel acrylic plastic pens are best for general purpose repairs, such as bridges and traces in printed circuit boards. They have a medium surface resistivity, so they're a good balance between carbon acrylic and silver epoxy pens.
    Silver Filled—Silver epoxy pens are the most versatile—use them for any type of repair as well as for repairs that require excellent conductivity, such as connecting through holes on circuit boards without adding jumpers, wiring, or solder. Since they have the lowest surface resistivity, they allow the most current to pass.
    Cannot Be Sold To—Product labeling requirements restrict sales to the listed areas.
    Container
    Tip
    Temp.
    Range, ° F
    Size, fl.
    oz.
    Type
    Dia.
    Shape
    Begins to
    Harden, min.
    Reaches Full
    Strength
    Surface Resistivity,
    ohm/sq.
    Consistency
    Mixing
    Req.
    Thermal
    Conductivity
    Max.
    Thk.
    For Use
    Outdoors
    Min.
    Max.
    Color
    For Use On
    Cannot Be Sold To
    Each
    Carbon Acrylic Plastic
    0.2Pen0.06"Point224 hr.100Thin LiquidNoNot Rated0.003"Yes-40245BlackPlasticCanada7502N11000000
     
    Nickel Acrylic Plastic
    0.2Pen0.06"Point224 hr.0.49Thin LiquidNoNot Rated0.004"Yes-40245GrayPlasticCanada7502N1200000
     
    Silver Epoxy
    0.2Pen0.03"Point360 min.0.050Thin LiquidNoNot RatedNot RatedNo-65300SilverAluminum, Brass, Bronze, Copper, Steel, Stainless Steel, TitaniumOutside United States and Canada7365A4400000
     

    Heavy Duty Heat-Transfer Conformal Coatings

    Image of Product. Front orientation. Conformal Coatings. Heavy Duty Heat-Transfer Conformal Coatings.
    These thermally conductive coatings keep electrical components cool by dissipating heat. Use them to bond transformers, transistors, and other heat-generating components to printed circuit boards and heat sinks. They require a gun (sold separately) to dispense.
    Dry Time
    Container
    Size, fl. oz.
    Consistency
    Touch,
    min.
    Overall,
    hr.
    Mixing
    Req.
    Dielectric Strength,
    V/mil
    Thermal Conductivity,
    W/(m⋅°C)
    Temp. Range,
    ° F
    For Use On
    Color
    Each
    Acrylic Plastic—Extra Hard
     
    Syringe
    1Paste52No7500.864-85 to 347Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Cast Iron, Iron, Silver, Plastic, Rubber, Composite, FiberglassWhite1688N12000000
     
    Guns

    High-Temperature Epoxy Potting Compounds

    Image of Product. Jar and Syringe. Front orientation. Potting Compounds. High-Temperature Epoxy Potting Compounds, Jar, Syringe.

    Jar and Syringe

    Image of Product. Front orientation. Potting Compounds. High-Temperature Epoxy Potting Compounds, Bottle.

    Bottle

    Protect circuit boards and other electronics where high heat is a concern but you don’t need to transfer that heat elsewhere. These compounds are a good middle ground between standard epoxy compounds and heat-transfer compounds. They work at temperatures twice as high as standard epoxy compounds. However, they don't conduct heat as well as heat-transfer compounds so they're not the best choice for circuit boards that run for long periods of time. Harden these compounds at room temperature—they don’t require an oven to harden like heat-transfer compounds do.
    Since they’re an epoxy compound, they won’t break down from chemicals or moisture. They’re also excellent electrical insulators and withstand a wide range of temperatures. Use them to shield components from dust, moisture, chemicals, mechanical shock, and vibration.
    Jar and Syringe—Jar and syringe compounds are the consistency of honey once they’re mixed, so they’ll seep into the crevices of a circuit board and encapsulate intricate components. Use the syringe for precise application.
    Bottle—Bottle compounds are easier to apply in higher volumes than jar and syringe compounds. Mix them together and pour them over components inside containers, such as a potting box. If air bubbles occur after mixing, you can put the mixture in a vacuum chamber to remove them.
    Cannot Be Sold to Canada—Some compounds cannot be sold to Canada due to product labeling requirements.
    Dry Time
    Container
    Size, fl. oz.
    Consistency
    Viscosity,
    cP
    Touch
    Overall,
    hr.
    Dielectric Strength,
    V/mil
    Thermal Conductivity,
    W/(m⋅°C)
    Max. Temp.,
    ° F
    For Use On
    Cannot Be
    Sold To
    Each
    Jar and Syringe Potting Compounds—Extra Hard
    1Thick Liquid3,60012 hr.244500.22500Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Plastic, Rubber, Composite, Fiberglass, Ceramic, Glass5996N11000000
     
    Bottle Potting Compounds—Extra Hard
    12.6Paste22,00060 min.244700.3435Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Plastic, Rubber, Composite, Fiberglass, Ceramic, GlassCanada5996N1200000
     

    Adjustable-Hardness Heat-Transfer Epoxy Potting Compounds

    Image of Product. Front orientation. Potting Compounds. Adjustable-Hardness Heat-Transfer Epoxy Potting Compounds, Jars.
    Image of Product. Front orientation. Potting Compounds. Adjustable-Hardness Heat-Transfer Epoxy Potting Compounds, Jars and Syringes.

    Jars

    Jars and Syringes

    Mixing required—resin and hardener come in two separate jars or in a jar and syringe and must be combined before applying. Change the mix ratio of these heat-transfer potting compounds to achieve the right hardness for your application. They're formulated to draw heat away from sensitive electronic components, so they have higher thermal conductivity than standard potting compounds. Use them to encase electronic assemblies for protection from dust, chemicals, moisture, mechanical shock, and vibration. Rigid and wear resistant, epoxies are the strongest of the potting compounds. They have excellent chemical and moisture resistance, withstand a wide range of temperatures, and provide excellent electrical insulation.
    The size listed is the combined total of the two parts.
    Dry Time
    Container
    Size, fl. oz.
    Consistency
    Touch,
    min.
    Overall,
    hr.
    Hardness Rating
    Dielectric Strength,
    V/mil
    Thermal Conductivity,
    W/(m⋅°C)
    Temp. Range,
    ° F
    Heating Req. to Reach
    Full Strength
    For Use On
    Color
    Each
    Jars
    12Thick Liquid3024Extra Hard, Medium Hard, Medium Soft, Soft4501-100 to 450Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Plastic, Ceramic, GlassTan6196T10000000
    24Thick Liquid3024Extra Hard, Medium Hard, Medium Soft, Soft4501-100 to 450Aluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Plastic, Ceramic, GlassTan6196T2000000
     
    Jars and Syringes
    1.6Thick Liquid3026Extra Hard, Medium Hard, Medium Soft, Soft4501.01-100 to 4502 Hrs. @ 250°FAluminum, Brass, Bronze, Copper, Steel, Stainless Steel, Plastic, Ceramic, GlassTan6196T300000
     
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