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DFARS Specialty Metals
Heat Sink Bonding Compounds
Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
Container | ||||||||
|---|---|---|---|---|---|---|---|---|
| Thermal Conductivity | Temp. Range, °F | Type | Size, fl. oz. | Net Weight, lbs. | Manufacturer | Manufacturer Model Number | Each | |
Silicone | ||||||||
| 0.68 W/m-K @ 97° F | -40° to 390° | Tube | 5 | __ | Dow Corning | 340 | 00000000 | 000000 |
| 0.75 W/m-K @ 97° F | -40° to 400° | Tube | 8 | __ | __ | __ | 00000000 | 00000 |
| 0.75 W/m-K @ 97° F | -40° to 400° | Pail | __ | 80 | __ | __ | 000000000 | 00000000 |