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    8 Products

    Heat Sink Bonding Compounds

    Image of Product. Front orientation. Heat Sink Compounds. Heat Sink Bonding Compounds, Tube.
    Image of Product. Front orientation. Heat Sink Compounds. Heat Sink Bonding Compounds, Jar.
    Image of Product. Front orientation. Heat Sink Compounds. Heat Sink Bonding Compounds, Syringe.

    Tube

    Jar

    Syringe

    Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
    Zinc Oxide—Zinc-oxide compounds create a more secure bond than silicone compounds.
    Container
    Thermal Conductivity
    @ Temp.
    Temp. Range,
    ° F
    Type
    Size, fl.
    oz.
    Mil. Spec.
    Specs.
    Met
    Each
    Zinc Oxide
    0.92 W/(m⋅°C) @ 97° F-40 to 320Tube2MIL-C-47113—3883K24000000
    0.92 W/(m⋅°C) @ 97° F-40 to 320Syringe1MIL-C-47113—3883K10100000
    0.92 W/(m⋅°C) @ 97° F-40 to 390Tube4—ASTM D547076645A1200000
    0.92 W/(m⋅°C) @ 97° F-40 to 390Jar16—ASTM D547076645A1400000
    5 W/(m⋅°C) @ 97° F-40 to 500Tube2——3883K10300000
    5 W/(m⋅°C) @ 97° F-40 to 500Tube4——3883K10400000
    5 W/(m⋅°C) @ 97° F-40 to 500Jar16——3883K10500000
    5 W/(m⋅°C) @ 97° F-40 to 500Syringe1——3883K10200000
     
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