Liquid Flux | McMaster-Carr

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Fed. Spec. A-A-51145 Type II Form B

IPC J-STD-004

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1C995

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32 Products

Easy-Clean Soldering Flux for Electronics


Pen	Bottle

The flux residue easily washes away with water. The flux cleans and prepares electrical assemblies and printed circuit boards for soldering.

	Container		Tip
For Joining	Size	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Nickel, Copper, Brass	0.3 fl. oz.	Pen	Chisel	0.157"	Liquid	Water	IPC J-STD-004	7755A5	000000
Nickel, Copper, Brass	2 fl. oz.	Bottle	—	—	Liquid	Water	IPC J-STD-004	7755A4	0000
Nickel, Copper, Brass	4 fl. oz.	Bottle	—	—	Liquid	Water	IPC J-STD-004	7755A7	00000
Nickel, Copper, Brass	16 fl. oz.	Bottle	—	—	Liquid	Water	IPC J-STD-004	7755A1	00000
Nickel, Copper, Brass	32 fl. oz.	Bottle	—	—	Liquid	Water	IPC J-STD-004	7755A2	00000
Nickel, Copper, Brass	1 gal.	Bottle	—	—	Liquid	Water	IPC J-STD-004	7755A3	00000
Copper, Brass, Bronze	0.3 fl. oz.	Pen	Chisel	0.2"	Liquid	Water	IPC J-STD-004	7893A23	0000

Mildly-Activated Rosin Soldering Flux for Electronics


Pen	Bottle

This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Use this flux to clean and prepare electrical assemblies and printed circuit boards for soldering.

	Container		Tip
For Joining	Size	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Nickel, Copper, Brass, Bronze, Zinc Alloy	1 gal.	Bottle	—	—	Liquid	Flux Remover	IPC J-STD-004	7798A16	000000
Copper	1/5 fl. oz.	Pen	Needle	0.013"	Liquid	Flux Remover	IPC J-STD-004	7799A11	00000

Soldering Flux for Stainless Steel

Bottle

Often used on metal that is difficult to solder, this flux works with stainless steel, Monel, and Inconel. Easily wash away residue with water.

	Container
For Joining	Size, fl. oz.	Type	Form	Cleanup Method	Specs. Met		Each
Stainless Steel	16	Bottle	Liquid	Water	Fed. Spec. A-A-51145 Type II Form B	7695A5	000000
Stainless Steel	32	Bottle	Liquid	Water	Fed. Spec. A-A-51145 Type II Form B	7695A6	00000

No-Clean Soldering Flux for Low-Melting-Point Solders

Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.

	Container		Tip
For Joining	Size, fl. oz.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Copper, Indium, Indium Alloy	4/5	Syringe	Needle	0.096"	Liquid	No Clean	IPC J-STD-004	8508N11	000000
Copper, Bismuth	4/5	Syringe	Needle	0.096"	Liquid	No Clean	IPC J-STD-004	8508N12	00000

Empty Needle-Point Pen Dispenser for Soldering Flux

Fill this dispenser with the flux of your choice to prepare electrical assemblies and printed circuit boards for soldering.

Container		Tip
Size, fl. oz.	Type	Shape	Dia.		Each
1/5	Pen	Needle	0.013"	7799A12	00000

No-Clean Soldering Flux for Electronics

Pen

This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.

	Container		Tip
For Joining	Size, fl. oz.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met	Cannot Be Sold To		Each
Copper, Brass, Bronze	0.3	Pen	Chisel	0.2"	Liquid	No Clean	IPC J-STD-004	Outside United States and Canada	7893A21	00000

Soldering Flux for Plumbing

Bottle

Use this flux for plumbing applications. The residue easily washes away with just water. Do not use it on magnesium or electronics.

	Container
For Joining	Size	Type	Form	Cleanup Method		Each
Steel, Nickel, Copper, Brass, Zinc Alloy	16 fl. oz.	Bottle	Liquid	Water	7765A21	000000
Steel, Nickel, Copper, Brass, Zinc Alloy	32 fl. oz.	Bottle	Liquid	Water	7765A22	00000
Steel, Nickel, Copper, Brass, Zinc Alloy	1 gal.	Bottle	Liquid	Water	7765A23	00000

Fully-Activated Rosin Soldering Flux for High-Temperature Electronics

With the strongest cleaning power, this flux is fully activated to clean and prepare electrical assemblies and printed circuit boards for high-temperature soldering applications. However, it requires flux remover to clean residue for a reliable joint.

					4 fl. oz. Container		16 fl. oz. Container
For Joining	Form	Cleanup Method	Application Temp. Range, ° F	Specs. Met		Each		Each
Nickel, Copper, Brass, Bronze, Zinc Alloy	Liquid	Flux Remover	390 to 840	IPC J-STD-004	7158N11	000000	7158N12	000000

Lead-Free No-Clean Soldering Flux for Electronics

This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering.

	Container		Tip
For Joining	Size, fl. oz.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Copper, Brass, Bronze	0.3	Pen	Chisel	0.2"	Liquid	No Clean	IPC J-STD-004	7893A24	000000

Fully-Activated Rosin Soldering Flux for Electronics

Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.

	Container
For Joining	Size, gal.	Type	Form	Cleanup Method	Specs. Met		Each
Nickel, Copper, Brass, Bronze, Zinc Alloy	1	Bottle	Liquid	Flux Remover	IPC J-STD-004	7798A12	000000

Nonactivated Rosin Soldering Flux for Electronics


Pen	Bottle

This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.

	Container		Tip
For Joining	Size	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met	Cannot Be Sold To		Each
Nickel, Copper, Brass, Bronze, Zinc Alloy	1 gal.	Bottle	—	—	Liquid	Flux Remover	IPC J-STD-004	—	7798A14	000000
Copper, Brass, Bronze	0.3 fl. oz.	Pen	Chisel	0.2"	Liquid	Flux Remover	IPC J-STD-004	Outside United States and Canada	7893A22	0000

Rubyfluid Soldering Flux

Bottle

This flux causes solder to flow in a thin film to create strong joints with minimal solder use. The residue easily washes away with water. Do not use it on magnesium or electronics.

	Container
For Joining	Size	Type	Form	Cleanup Method		Each
Copper	16 fl. oz.	Bottle	Liquid	Water	7699A1	000000
Copper	32 fl. oz.	Bottle	Liquid	Water	7699A2	00000
Copper	1 gal.	Bottle	Liquid	Water	7699A3	00000

Desoldering Iron Nozzle Tip Cleaners

Scrape away solder buildup to keep desoldering nozzles clean.

No. of Cleaners	Cleaner Dia.	Lg.	Material	Case Material		Each
12	0.019" to 0.065"	4 7/8"	Aluminum	Aluminum	4927N11	000000

Flux Removers


Aerosol Can	Pen

For applications such as printed circuit boards, switches, and heat sinks, these removers get rid of any residue left behind by no-clean flux.

Pen—Pens are best for spot cleaning and precise removal.

For Removing—Lead-free and rosin flux removers are designed to remove the flux residue but not impact the remaining solder. It's common to use this remover when soldering with lead-free and tin/lead solders.

Cannot Be Sold To—Flux removers cannot be sold to the listed jurisdictions/areas due to import and product regulations.

	Container			Tip
For Removing	Size, fl. oz.	Net Wt., oz.	Type	Shape	Dia.	Form	Cannot Be Sold To		Each
Easy-Clean Flux, No-Clean Flux	—	12	Aerosol Can	—	—	Aerosol	Outside United States, Canada, and Mexico	7655A31	000000
Easy-Clean Flux, No-Clean Flux	0.3	—	Pen	Chisel	0.2"	Liquid	Outside United States	7655A21	00000
Lead-Free Flux, Rosin Flux	—	12	Aerosol Can	—	—	Aerosol	Outside United States	7655A12	00000
Lead-Free Flux, Rosin Flux	0.3	—	Pen	Chisel	0.2"	Liquid	Outside United States	7655A25	00000