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    21 Products

    Casting Metals

    Melt and pour these alloys into molds to create metal parts and prototypes.
    Bismuth
    Image of Product. Front orientation. Casting Metals.
    Bismuth alloys expand slightly as they solidify, pushing into the crevices of a mold to produce detailed replicas. These alloys are useful for repairing dies, creating fusible links, and holding delicate parts for machining.
    Material
    Composition
    Approximate
    Melting
    Temp., ° F
    Bismuth
    Lead
    Tin
    Cadmium
    Thick.
    Wd.
    Lg.
    Wt.,
    lb.
    Shape
    Each
    15850%27%13%10%1/2"3"1Hex Ingot0000000000000
    16043%38%11%8%1/2"1 1/2"4 1/2"1Sheet, Bar000000000000
    20353%32%15%3/4"1"3"1Sheet, Bar000000000000
    25556%44%1/2"3"3"1Sheet, Bar000000000000
    28140%60%1/2"1 1/2"4 1/2"1Sheet, Bar000000000000
    28158%42%1/2"1 1/2"5 1/2"1Sheet, Bar000000000000
    Indium Alloy
    Image of Product. Front orientation. Casting Metals.
    Indium alloys expand slightly as they solidify, pushing into the crevices of a mold to produce detailed replicas. These alloys are useful for repairing dies, creating fusible links, and holding delicate parts for machining. They also have a low melting temperature so they can be cast in molds made from glass, quartz, mica, and ceramic.
    Material Composition
    Approximate
    Melting
    Temp., ° F
    Bismuth
    Lead
    Tin
    Cadmium
    Indium
    Thick.
    Wd.
    Lg.
    Dia.
    Wt.,
    lb.
    Shape
    Each
    11745%23%8%5%19%1/4"2"4 1/2"1/2Sheet, Bar00000000000000
    13649%18%12%21%1/4"1 7/8"4 1/2"1/2Sheet, Bar0000000000000
    14048%25%13%9%5%1/2"3 1/2"1Rod, Disc00000000000000
    14748%25%13%10%4%1/2"3 1/2"1Rod, Disc00000000000000

    Conductive Gallium

    Image of Product. Front orientation. Gallium. Conductive Gallium.
    A safe alternative to mercury in thermometers and thermostats, gallium transfers heat and electricity without toxic vapor that can be inhaled. Also known as Galinstan. Its low melting point means it's liquid at room temperature. When used next to parts that generate concentrated heat, it dissipates the heat quickly, making it good thermal interface material. It also allows electricity to pass throughout it, so it's often used in switches and electronics that must bend and flex.
    Gallium clings to both metallic and nonmetallic surfaces such as glass and quartz. However, it eats away at most metal when used at high temperatures and dissolves aluminum even at ambient temperatures.
    When choosing gallium, keep in mind its composition. The higher the gallium and indium content, the better it is at transferring heat. Gallium with tin reduces the melting point, but also decreases how well it transfers heat.
    Material
    Composition
    Container
    Gallium
    Indium
    Tin
    Size, fl.
    oz.
    Type
    Melting
    Temp., ° F
    Max. Temp.,
    ° F
    For Use On
    Each
    66.5%20.5%13%0.1Syringe50930Glass, Nickel, Quartz, Stainless Steel, Steel00000000000000
    75.5%24.5%0.1Syringe60930Glass, Nickel, Quartz, Stainless Steel, Steel0000000000000

    High-Density Low-Melting-Point Solder

    This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. Do not use this solder on drinking water pipes.
    Lead-Free, No Flux Required
    Image of Product. Front orientation. Solder. High-Density Low-Melting-Point Solder.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    1% Silver—Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
    Material
    Composition
    0.12 oz.
    Solder
    Alloy
    Bismuth
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Lg.
    Each
    For Joining Aluminum, Brass, Bronze, Copper, Nickel, Stainless Steel, Steel, and Zinc Alloy
    Bi57Sn42Ag157%42%1%0%0.030"28536"000000000000000
    Bi58Sn4258%42%0%0.030"28036"00000000000000
     

    Bar Solder for Food Service Equipment

    Image of Product. Front orientation. Solder. Bar Solder for Food Service Equipment.
    This solder is commonly used in solder melting pots. It's composed of pure tin, so it is safe for use with food service equipment. This solder does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free—Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder
    Alloy
    Tin
    Lead
    Melting
    Temp., ° F
    Solder Type
    Lg.
    Wd.
    Ht.
    Wt.,
    lb.
    Each
    For Joining Brass, Bronze, Copper, Stainless Steel, and Steel
    Sn100100%0%450Lead-Free, Flux Required11 1/2"1"1/2"10000000000000
     

    Low-Melting-Point Solder for Low-Temperature Applications

    Even as temperatures approach absolute zero, this indium solder remains soft and malleable, allowing it to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. This solder has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core; choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.16 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%0.030"310432,55000000000000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    100% Indium—Solder that is 100% indium has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
    48% Tin—Solder with 48% tin has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
    Material
    Composition
    0.11 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%0.030"245341,72000000000000000
    In100100%0%0.030"315862700000000000000
     

    Low-Melting-Point Solder Ribbon for Low-Temperature Applications

    Made with indium this solder is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. Thanks to its ribbon shape, this solder is easier to use on large, flat areas than wire solder.
    This solder has a lower melting point than most solders, making it good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so you can also use it in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core, choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%310432,55012"1"0.002"00000000000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%245341,72012"1"0.002"00000000000000
    In100100%0%3158627012"1"0.002"0000000000000
     
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