Casting Metals
Melt and pour these alloys into molds to create metal parts and prototypes.
Bismuth and indium alloys expand slightly as they solidify, pushing into the crevices of a mold to produce detailed replicas. These alloys are useful for repairing dies, creating fusible links, and holding delicate parts for machining. Indium alloys have a low melting temperature so they can be cast in molds made from glass, quartz, mica, and ceramic.
Material Composition | Approximate | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Melting Temperature, °F | Bismuth | Lead | Tin | Cadmium | Thick. | Wd. | Lg. | Wt., lbs. | Shape | Each | |
| 158° | 50% | 27% | 13% | 10% | 1/2" | 3" | __ | 1 1/2 | Hex Ingot | 0000000 | 000000 |
| 160° | 43% | 38% | 11% | 8% | 5/8" | 1 1/2" | 4 1/2" | 1 1/2 | Sheet and Bar | 0000000 | 00000 |
| 203° | 53% | 32% | 15% | __ | 1" | 1" | 3" | 1 1/2 | Sheet and Bar | 0000000 | 00000 |
| 255° | 56% | 44% | __ | __ | 1/2" | 3" | 3" | 1 1/2 | Sheet and Bar | 0000000 | 00000 |
| 281° | 40% | __ | 60% | __ | 1/2" | 1 1/2" | 4 1/2" | 1 1/2 | Sheet and Bar | 0000000 | 00000 |
| 281° | 58% | __ | 42% | __ | 5/8" | 1 1/2" | 5 1/2" | 1 1/2 | Sheet and Bar | 0000000 | 00000 |
Material Composition | Approximate | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Melting Temperature, °F | Bismuth | Lead | Indium | Tin | Cadmium | Thick. | Wd. | Lg. | Dia. | Wt., lbs. | Shape | Each | |
| 117° | 45% | 23% | 19% | 8% | 5% | 1/4" | 2" | 4 1/2" | __ | 1/2 | Sheet and Bar | 0000000 | 0000000 |
| 134° | 48% | 25% | 5% | 13% | 9% | 1/2" | __ | __ | 3 1/2" | 1 1/2 | Rod and Disc | 00000000 | 000000 |
| 136° | 49% | 18% | 21% | 12% | __ | 1/4" | 1 7/8" | 4 1/2" | __ | 1/2 | Sheet and Bar | 0000000 | 000000 |
| 142° | 48% | 25% | 4% | 13% | 10% | 1/2" | __ | __ | 3 1/2" | 1 1/2 | Rod and Disc | 00000000 | 000000 |
Lead-Free Bar Solder for Food Service Equipment
This solder is commonly used in solder melting pots. It's composed of pure tin, so it is safe for use with food service equipment.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Tin | Lead | Melting Temperature, °F | Solder Type | Lg. | Wd. | Ht. | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Stainless Steel, Steel | |||||||||
| 100% | 0% | 450° | Flux Required | 11 1/2" | 1" | 1/2" | 1 | 0000000 | 000000 |
High-Density Low-Melting-Point Lead-Free Solder
This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. Do not use this solder on drinking water pipes.
Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
Low-Melting-Point Solder for Low-Temperature Applications
Made with lead and silver, this solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold. Indium is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity, although not as good as solder with greater indium content. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi  | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 80% | 15% | 5% | 310° | 43 | 2,550 | 0.030" | 0.16 | 0000000 | 0000000 |
Low-Melting-Point Lead-Free Solder for Low-Temperature Applications
Made of indium, this solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 0.030" | 0.11 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 0.030" | 0.11 | 0000000 | 000000 |
Low-Melting-Point Lead-Free Solder Ribbon for Low-Temperature Applications
For use on large, flat areas, this indium ribbon solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 12" | 1" | 0.002" | 0.1 | 0000000 | 000000 |
Low-Melting-Point Solder Ribbon for Low-Temperature Applications
Made with lead and silver, this solder ribbon has greater tensile strength and density than other indium-based solders, giving it a stronger hold. Solder ribbon is more easily used on large, flat areas than wire solder. Indium is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity, although not as good as solder with greater indium content. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 80% | 15% | 5% | 310° | 43 | 2,550 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
Conductive Liquid Gallium
A safe alternative to mercury in thermometers and thermostats, gallium transfers heat and electricity without toxic vapor that can be inhaled. Also known as Galinstan. Its low melting point means it's liquid at room temperature. When used next to parts that generate concentrated heat, it dissipates the heat quickly, making it good thermal interface material. It also allows electricity to pass throughout it, so it's often used in switches and electronics that must bend and flex.
Gallium clings to both metallic and nonmetallic surfaces such as glass and quartz. However, it eats away at most metal when used at high temperatures and dissolves aluminum even at ambient temperatures.
When choosing gallium, keep in mind its composition. The higher the gallium and indium content, the better it is at transferring heat. Gallium with tin reduces the melting point, but also decreases how well it transfers heat.
Material Composition | Container | ||||||||
|---|---|---|---|---|---|---|---|---|---|
| Gallium | Indium | Tin | Size, fl. oz. | Type | Melting Temperature, °F | Maximum Temperature, °F | For Use On | Each | |
| 66.5% | 20.5% | 13% | 0.1 | Syringe | 50° | 930° | Glass, Nickel Alloys, Quartz, Stainless Steel, Steel | 0000000 | 0000000 |
| 75.5% | 24.5% | __ | 0.1 | Syringe | 60° | 930° | Glass, Nickel Alloys, Quartz, Stainless Steel, Steel | 0000000 | 000000 |