Compliant with ASTM E-595, these sealants produce almost no volatile materials in a vacuum.

A combination of hardness and surface tension makes these sealants resistant to punctures, cuts, and abrasion.

Apply these sealants in cold temperatures, on wet surfaces, and even through running water.

Thinner than non-sagging sealants, these flow easily into cracks and have a smooth finish.

These non-sagging sealants will not drip while hardening on vertical and overhead surfaces.

These non-sagging sealants will not drip while hardening on vertical and overhead surfaces.

Thinner than non-sagging sealants, these flow easily into cracks and have a smooth finish.

These coatings are NSF registered H1 for incidental food contact. Designed to protect food-processing equipment from corrosion after washdowns, use them to seal metal surfaces, resist moisture, and lubricate moving parts between processes.

Hide proprietary information on electrical components while also protecting them from moisture, dust, and static. All it takes is a single thin layer of these black coatings.

This thermally conductive coating keeps electrical components cool by dissipating heat.

Thinner than potting compounds, these rigid and wear-resistant coatings flow easily into small spaces between electrical components. Use them to secure and insulate hardware on printed circuit boards.

This coating is formulated for use in sensitive applications such as manufacturing semiconductors.

These compounds dry quickly when exposed to UV light allowing you to handle the potted items sooner.

Handle potted items within minutes—these potting compounds dry quickly when exposed to UV light. For added strength and durability, cure them with heat.

Protect circuit boards and other electronics from fire and heat.

Formulated to draw heat away from sensitive electronic components, these potting compounds have higher thermal conductivity than standard potting compounds.