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    29 Products

    Solder for Drinking Water

    Image of Product. Front orientation. Solder. Solder for Drinking Water.
    This solder meets NSF/ANSI Standard 61 for drinking water. It does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free—Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder Alloy
    Tin
    Silver
    Copper
    Lead
    Melting
    Temp., ° F
    Solder Type
    Dia.
    Wt.,
    lb.
    Each
    For Joining Aluminum, Brass, Bronze, Copper, Nickel, Stainless Steel, Steel, and Zinc Alloy
    Sn95Cu4.8Ag0.295%0.2%4.8%0%440Lead-Free, Flux Required0.118"100000000000000
     

    Paste Solder

    Image of Product. Front orientation. Solder. Paste Solder.
    Use this paste in hard-to-reach areas—apply a thin coat of paste to the surfaces you want joined, apply heat, and wipe with a damp cloth. Paste is made of finely powdered solder combined with a flux paste, so it creates strong welds without needing separate flux.
    Lead-Free—Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder
    Alloy
    Tin
    Antimony
    Lead
    Melting
    Temp., ° F
    Solder Type
    Form
    Wt.,
    lb.
    Each
    For Joining Brass, Copper, Nickel, Steel, and Zinc Alloy
    Sn95Sb595%5%0%470Lead-Free, No Flux RequiredPaste10000000000000
     

    Low-Melting-Point Solder for Low-Temperature Applications

    Even as temperatures approach absolute zero, this indium solder remains soft and malleable, allowing it to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. This solder has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core; choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.16 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%0.030"310432,55000000000000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    100% Indium—Solder that is 100% indium has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
    48% Tin—Solder with 48% tin has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
    Material
    Composition
    0.11 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%0.030"245341,72000000000000000
    In100100%0%0.030"315862700000000000000
     

    High-Density Low-Melting-Point Solder

    This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. Do not use this solder on drinking water pipes.
    Lead-Free, No Flux Required
    Image of Product. Front orientation. Solder. High-Density Low-Melting-Point Solder.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    1% Silver—Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
    Material
    Composition
    0.12 oz.
    Solder
    Alloy
    Bismuth
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Lg.
    Each
    For Joining Aluminum, Brass, Bronze, Copper, Nickel, Stainless Steel, Steel, and Zinc Alloy
    Bi57Sn42Ag157%42%1%0%0.030"28536"000000000000000
    Bi58Sn4258%42%0%0.030"28036"00000000000000
     

    Soldering Flux for Plumbing

    Image of Product. Front orientation. Soldering Flux. Soldering Flux for Plumbing, Bottle.
    Image of Product. Front orientation. Soldering Flux. Soldering Flux for Plumbing, Jar.

    Bottle

    Jar

    Use this flux for plumbing applications. The residue easily washes away with just water. Do not use it on magnesium or electronics.
    Pastes—Paste flux is easy to apply for precision applications. It meets NSF/ANSI 61 safety standards for drinking water.
    Container
    For Joining
    Size
    Type
    Form
    Cleanup
    Method
    Environment
    Mil. Spec.
    Food Industry
    Std.
    Each
    Steel, Copper, Brass, Zinc Alloy2 fl. oz.JarPasteWaterFood and Beverage
    MIL-F-4995 Type IINSF/ANSI 61
    000000000000
    Steel, Copper, Brass, Zinc Alloy4 fl. oz.JarPasteWaterFood and Beverage
    MIL-F-4995 Type IINSF/ANSI 61
    00000000000
    Steel, Nickel, Copper, Brass, Zinc Alloy16 fl. oz.BottleLiquidWater000000000000
    Steel, Copper, Brass, Zinc Alloy16 fl. oz.JarPasteWaterFood and Beverage
    MIL-F-4995 Type IINSF/ANSI 61
    000000000000
    Steel, Nickel, Copper, Brass, Zinc Alloy32 fl. oz.BottleLiquidWater000000000000
    Steel, Nickel, Copper, Brass, Zinc Alloy1 gal.BottleLiquidWater000000000000

    Low-Melting-Point Solder Ribbon for Low-Temperature Applications

    Made with indium this solder is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. Thanks to its ribbon shape, this solder is easier to use on large, flat areas than wire solder.
    This solder has a lower melting point than most solders, making it good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so you can also use it in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core, choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%310432,55012"1"0.002"00000000000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%245341,72012"1"0.002"00000000000000
    In100100%0%3158627012"1"0.002"0000000000000
     

    Fully-Activated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Fully-Activated Rosin Soldering Flux for Electronics.
    Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Container
    For Joining
    Size,
    gal.
    Type
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1BottleLiquidFlux RemoverIPC J-STD-0040000000000000

    Mildly-Activated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Bottle.

    Bottle

    This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Use this flux to clean and prepare electrical assemblies and printed circuit boards for soldering.
    Container
    For Joining
    Size,
    gal.
    Type
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1BottleLiquidFlux RemoverIPC J-STD-0040000000000000

    Nokorode Soldering Flux

    Image of Product. Front orientation. Soldering Flux. Nokorode Soldering Flux.
    Protect the solder joint from corrosion with this flux paste. The residue easily washes away with water. Since this flux meets NSF/ANSI 61, it's safe to use with drinking water. Do not use it on magnesium or electronics. It’s a paste, so it’s easy to apply for precision applications.
    Container
    For Joining
    Net
    Wt.
    Type
    Form
    Cleanup
    Method
    Environment
    Specs. Met
    Mil.
    Spec.
    Food Industry
    Std.
    Each
    Nickel, Copper, Zinc Alloy1.7 oz.JarPasteWaterFood and Beverage
    Fed. Spec. A-A-51145 Type I Form AMIL-S-6872NSF/ANSI 61
    00000000000
    Nickel, Copper, Zinc Alloy4 oz.JarPasteWaterFed. Spec. A-A-51145 Type I Form AMIL-S-6872NSF/ANSI 61
    00000000000
    Nickel, Copper, Zinc Alloy8 oz.JarPasteWaterFed. Spec. A-A-51145 Type I Form AMIL-S-6872NSF/ANSI 61
    000000000000
    Nickel, Copper, Zinc Alloy1 lb.JarPasteWaterFood and Beverage
    Fed. Spec. A-A-51145 Type I Form AMIL-S-6872NSF/ANSI 61
    00000000000

    Fully-Activated Rosin Soldering Flux for High-Temperature Electronics

    Image of Product. Front orientation. Soldering Flux. Fully-Activated Rosin Soldering Flux for High-Temperature Electronics.
    With the strongest cleaning power, this flux is fully activated to clean and prepare electrical assemblies and printed circuit boards for high-temperature soldering applications. However, it requires flux remover to clean residue for a reliable joint.
    4 fl. oz.
    Container
    16 fl. oz.
    Container
    For Joining
    Form
    Cleanup
    Method
    Application
    Temp. Range, ° F
    Specs. Met
    Each
    Each
    Nickel, Copper, Brass, Bronze, Zinc AlloyLiquidFlux Remover390 to 840IPC J-STD-00400000000000000000000000000

    Nokorode Soldering Flux for High-Temperature Applications

    Image of Product. Front orientation. Soldering Flux. Nokorode Soldering Flux for High-Temperature Applications.
    A special formulation of Nokorode soldering flux, this flux remains thick at temperatures up to 115° F and protects your solder joint from corrosion. It’s a paste, so it’s easy to apply for precision applications. However, you shouldn't use it on magnesium or electronics.
    Container
    For Joining
    Net
    Wt.
    Type
    Form
    Cleanup
    Method
    Specs. Met
    Mil.
    Spec.
    Each
    Nickel, Copper, Zinc Alloy8 oz.JarPasteWaterFed. Spec. A-A-51145 Type I Form AMIL-S-68720000000000000
    Nickel, Copper, Zinc Alloy1 lb.JarPasteWaterFed. Spec. A-A-51145 Type I Form AMIL-S-6872000000000000

    Nonactivated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Nonactivated Rosin Soldering Flux for Electronics, Bottle.

    Bottle

    This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
    Container
    For Joining
    Size,
    gal.
    Type
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1BottleLiquidFlux RemoverIPC J-STD-0040000000000000

    Nokorode Soldering Flux for Low-Temperature Applications

    Image of Product. Front orientation. Soldering Flux. Nokorode Soldering Flux for Low-Temperature Applications.
    Specially formulated, this Nokorode flux remains soft and sticky in temperatures down to -4° F and protects your solder joint from corrosion. It is paste, so it is easy to apply in precise applications. However, this flux is not for use on magnesium or electronics.
    Container
    For Joining
    Net
    Wt.
    Type
    Form
    Cleanup
    Method
    Specs. Met
    Mil.
    Spec.
    Each
    Nickel, Copper, Zinc Alloy8 oz.JarPasteWaterFed. Spec. A-A-51145 Type I Form AMIL-S-68720000000000000
    Nickel, Copper, Zinc Alloy1 lb.JarPasteWaterFed. Spec. A-A-51145 Type I Form AMIL-S-6872000000000000
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