McMaster-Carr logo
    Filter by
    Container Type
    Container Net Weight
    Tip Shape
    Specifications Met
    DFARS Specialty Metals
    Export Control Classification Number (ECCN)
    Industrial Info Snippet
    Maximum Temperature
    Minimum Application Temperature
    Maximum Application Temperature
    Minimum Temperature
    Forward
    Enter e-mail addresses in the fields below
    Message
    Cancel
    Print
    How can we improve?
    Comments
    E-mail address (if you would like a response)
    25 Products

    Easy-Clean Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Easy-Clean Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. Easy-Clean Soldering Flux for Electronics, Syringe.
    Image of Product. Front orientation. Soldering Flux. Easy-Clean Soldering Flux for Electronics, Bottle.
    Image of Product. Front orientation. Soldering Flux. Easy-Clean Soldering Flux for Electronics, Jar.

    Pen

    Syringe

    Bottle

    Jar

    The flux residue easily washes away with water. The flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Pastes—Paste flux is easy to apply for precision applications.
    Container
    Tip
    For Joining
    Size
    Net
    Wt.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass0.3 fl. oz.—PenChisel0.157"LiquidWaterIPC J-STD-004000000000000
    Nickel, Copper, Brass0.3 fl. oz.—SyringeNeedle0.031"PasteWaterIPC J-STD-00400000000000
    Nickel, Copper, Brass2 fl. oz.—Bottle——LiquidWaterIPC J-STD-0040000000000
    Nickel, Copper, Brass4 fl. oz.—Bottle——LiquidWaterIPC J-STD-00400000000000
    Nickel, Copper, Brass16 fl. oz.—Bottle——LiquidWaterIPC J-STD-00400000000000
    Nickel, Copper, Brass32 fl. oz.—Bottle——LiquidWaterIPC J-STD-00400000000000
    Nickel, Copper, Brass1 gal.—Bottle——LiquidWaterIPC J-STD-00400000000000
    Nickel, Copper, Brass—8 oz.Jar——PasteWaterIPC J-STD-004000000000000
    Nickel, Copper, Brass—1 lb.Jar——PasteWaterIPC J-STD-004000000000000
    Copper, Brass, Bronze0.3 fl. oz.—PenChisel0.2"LiquidWaterIPC J-STD-00400000000000

    No-Clean Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Syringe.
    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Jar.

    Pen

    Syringe

    Jar

    This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
    Pastes—Paste flux is easier to apply than liquid flux for precise applications.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Net Wt.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Features
    Cannot Be Sold To
    Each
    Nickel, Copper, Brass, Bronze0.3—Syringe——PasteNo CleanIPC J-STD-004Luer Lock Connection—0000000000000
    Nickel, Copper, Brass, Bronze—3 1/2 oz.Jar——PasteNo CleanIPC J-STD-004——000000000000
    Nickel, Copper, Brass, Bronze—1 lb.Jar——PasteNo CleanIPC J-STD-004——0000000000000
    Copper, Brass, Bronze0.3—PenChisel0.2"LiquidNo CleanIPC J-STD-004—Outside United States and Canada00000000000

    Mildly-Activated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Syringe.
    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Bottle.
    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Jar.

    Pen

    Syringe

    Bottle

    Jar

    This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Use this flux to clean and prepare electrical assemblies and printed circuit boards for soldering.
    Pastes—Paste flux is easy to apply in precise applications.
    Container
    Tip
    For Joining
    Size
    Net
    Wt.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1 gal.—Bottle——LiquidFlux RemoverIPC J-STD-0040000000000000
    Nickel, Copper, Brass10 ml—SyringeNeedle0.055"PasteFlux RemoverIPC J-STD-0040000000000000
    Nickel, Copper, Brass—8 oz.Jar——PasteFlux RemoverIPC J-STD-0040000000000000
    Nickel, Copper, Brass—1 lb.Jar——PasteFlux RemoverIPC J-STD-0040000000000000
    Copper1/5 fl. oz.—PenNeedle0.013"LiquidFlux RemoverIPC J-STD-004000000000000

    Lead-Free No-Clean Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Lead-Free No-Clean Soldering Flux for Electronics.
    This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Copper, Brass, Bronze0.3PenChisel0.2"LiquidNo CleanIPC J-STD-0040000000000000

    Fully-Activated Rosin Soldering Flux for High-Temperature Electronics

    Image of Product. Front orientation. Soldering Flux. Fully-Activated Rosin Soldering Flux for High-Temperature Electronics.
    With the strongest cleaning power, this flux is fully activated to clean and prepare electrical assemblies and printed circuit boards for high-temperature soldering applications. However, it requires flux remover to clean residue for a reliable joint.
    4 fl. oz.
    Container
    16 fl. oz.
    Container
    For Joining
    Form
    Cleanup
    Method
    Application
    Temp. Range, ° F
    Specs. Met
    Each
    Each
    Nickel, Copper, Brass, Bronze, Zinc AlloyLiquidFlux Remover390 to 840IPC J-STD-00400000000000000000000000000

    Fully-Activated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Fully-Activated Rosin Soldering Flux for Electronics.
    Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Container
    For Joining
    Size,
    gal.
    Type
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1BottleLiquidFlux RemoverIPC J-STD-0040000000000000

    Nonactivated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Nonactivated Rosin Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. Nonactivated Rosin Soldering Flux for Electronics, Bottle.

    Pen

    Bottle

    This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
    Container
    Tip
    For Joining
    Size
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Cannot Be Sold To
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1 gal.Bottle——LiquidFlux RemoverIPC J-STD-004—0000000000000
    Copper, Brass, Bronze0.3 fl. oz.PenChisel0.2"LiquidFlux RemoverIPC J-STD-004Outside United States and Canada00000000000
    back to top