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    20 Products

    Bar Solder for High-Temperature Applications

    This solder is commonly used in solder melting pots. It keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment. It does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Bar Solder for High-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Antimony
    Lead
    Melting
    Temp., ° F
    Lg.
    Wd.
    Ht.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn95Sb595%5%0%46012"1"1/2"7668A16000000
     

    Bar Solder for Electronics and Electrical Applications

    This solder is commonly used in solder melting pots. It is electrically conductive. Without a flux core, it allows you to choose the flux that works best for your application.
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Bar Solder for Electronics and Electrical Applications, Lead-Free, Bar.
    Image of Product. Front orientation. Solder. Bar Solder for Electronics and Electrical Applications, Lead-Free, Triangular Bar.

    Bar

    Triangular Bar

    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material Composition
    Solder Alloy
    Tin
    Silver
    Antimony
    Copper
    Lead
    Melting
    Temp., ° F
    Shape
    Lg.
    Wd.
    Ht.
    Wt.,
    lb.
    Each
    For Joining Brass, Bronze, and Copper
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%465Bar14"1/2"1/2"176805A73000000
     
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%—0.5%0%430Triangular Bar12"1"1/2"176805A8100000
    Sn96Ag496%4%——0%450Triangular Bar12"1"1/2"176805A8200000
    Sn97Cu397%——3%0%365Triangular Bar12"1"1/2"176805A8300000
    Sn99.3Cu0.799.3%——0.7%0%440Triangular Bar12"1"1/2"176805A8400000
     

    Bar Solder for Food Service Equipment

    Image of Product. Front orientation. Solder. Bar Solder for Food Service Equipment.
    This solder is commonly used in solder melting pots. It's composed of pure tin, so it is safe for use with food service equipment. This solder does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free—Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder
    Alloy
    Tin
    Lead
    Melting
    Temp., ° F
    Solder Type
    Lg.
    Wd.
    Ht.
    Wt.,
    lb.
    Each
    For Joining Brass, Bronze, Copper, Stainless Steel, and Steel
    Sn100100%0%450Lead-Free, Flux Required11 1/2"1"1/2"18886K11000000
     

    Casting Metals

    Melt and pour these alloys into molds to create metal parts and prototypes.
    Tin-Base Babbitt
    Image of Product. Front orientation. Casting Metals.
    Tin-base babbitt is used to cast bearings for high-speed, high-wear applications and can withstand heavy, sustained loads. It has a higher melting temperature than lead-base babbitt.
    Material
    Composition
    Approximate
    Melting
    Temp., ° F
    Tin
    Antimony
    Copper
    Thick.
    Wd.
    Lg.
    Wt.,
    lb.
    Shape
    Each
    66989%7%4%1 1/2"2"5 1/2"4 1/2Sheet, Bar8900K110000000

    Tin

    Image of Product. Front orientation. Tin.
    With 99.9% tin content, this material is considered commercially pure. It's commonly used to make gaskets and filters.
    6" × 6"
    12" × 12"
    12" × 24"
    24" × 24"
    Thk.
    Thk. Tolerance
    Each
    Each
    Each
    Each
    1/32"-0.007" to 0.007"8906K1310000008906K12100000008906K14100000008906K1610000000
    1/16"-0.008" to 0.008"8906K2310000008906K2210000008906K2410000008906K26100000000
    1/8"-0.012" to 0.012"8906K4310000008906K421000000———0———0

    High-Density Low-Melting-Point Solder

    This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. Do not use this solder on drinking water pipes.
    Lead-Free, No Flux Required
    Image of Product. Front orientation. Solder. High-Density Low-Melting-Point Solder.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    1% Silver—Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
    Material
    Composition
    0.12 oz.
    Solder
    Alloy
    Bismuth
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Lg.
    Each
    For Joining Aluminum, Brass, Bronze, Copper, Nickel, Stainless Steel, Steel, and Zinc Alloy
    Bi57Sn42Ag157%42%1%0%0.030"28536"8520N1130000000
    Bi58Sn4258%42%—0%0.030"28036"8520N111000000
     
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