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Low-Melting-Point Solder for Low-Temperature Applications
Made with lead and silver, this solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold. Indium is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity, although not as good as solder with greater indium content. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 80% | 15% | 5% | 310° | 43 | 2,550 | 0.030" | 0.16 | 0000000 | 0000000 |
Low-Melting-Point Solder Ribbon for Low-Temperature Applications
Made with lead and silver, this solder ribbon has greater tensile strength and density than other indium-based solders, giving it a stronger hold. Solder ribbon is more easily used on large, flat areas than wire solder. Indium is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity, although not as good as solder with greater indium content. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 80% | 15% | 5% | 310° | 43 | 2,550 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
Low-Melting-Point Lead-Free Solder for Low-Temperature Applications
Made of indium, this solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 0.030" | 0.11 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 0.030" | 0.11 | 0000000 | 000000 |
Low-Melting-Point Lead-Free Solder Ribbon for Low-Temperature Applications
For use on large, flat areas, this indium ribbon solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 12" | 1" | 0.002" | 0.1 | 0000000 | 000000 |
Solder for Drinking Water
This solder meets NSF/ANSI Standard 61 for drinking water.
High-Density Low-Melting-Point Lead-Free Solder
This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. Do not use this solder on drinking water pipes.
Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
No-Flux Solder for Aluminum
Flux is not required for this solder to form strong joints.
Material Composition | ||||||||
|---|---|---|---|---|---|---|---|---|
| Zinc | Aluminum | Lead | Melting Temperature, ° F | Dia. | Lg. | Wt., lbs. | Pkg. of 37 | |
| 98% | 2% | 0% | 760° | 0.125" | 18" | 2 | 000000 | 000000 |
Solder for Aluminum
Without a flux core, this solder allows you to choose the flux that works best for your application.
Soldering Flux for Aluminum
| Container Size, fl. oz. | Form | Cleanup Method | Specifications Met | Each | |
| 4 | Paste | Water | DOD 1866 | 000000 | 000000 |
Brazing Alloys for Joining Aluminum to Copper
Material Composition | |||||||||
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| Zinc | Aluminum | Cadmium | Melting Temperature Range, ° F | Braze Type | Dia. | Lg. | Pkg. Qty. | Pkg. | |
For Joining Aluminum, Brass, Bronze, Copper | |||||||||
| 85% | 15% | 0% | 720° to 845° | Flux Required | 5/64" | 20" | 13 | 0000000 | 00000 |
Brazing Alloys for Aluminum
Material Composition | |||||||||
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| Aluminum | Silicon | Cadmium | Melting Temperature, ° F | Braze Type | Dia. | Wt., oz. | Includes | Each | |
| 88% | 12% | 0% | 1070° | Flux Required | 1/16" | 3/4 | 1/3 oz. Tube of Flux | 0000000 | 000000 |