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    11 Products

    Low-Melting-Point Solder for Low-Temperature Applications

    Even as temperatures approach absolute zero, this indium solder remains soft and malleable, allowing it to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. This solder has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core; choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.16 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%0.030"310432,5506976N110000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    100% Indium—Solder that is 100% indium has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
    48% Tin—Solder with 48% tin has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
    Material
    Composition
    0.11 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%0.030"245341,7208514N130000000
    In100100%0%0.030"315862708514N11000000
     

    Low-Melting-Point Solder Ribbon for Low-Temperature Applications

    Made with indium this solder is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. Thanks to its ribbon shape, this solder is easier to use on large, flat areas than wire solder.
    This solder has a lower melting point than most solders, making it good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so you can also use it in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core, choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%310432,55012"1"0.002"5940N110000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%245341,72012"1"0.002"7906N120000000
    In100100%0%3158627012"1"0.002"7906N11000000
     

    Conductive Adhesives for Electronics

    An alternative to solder, these flexible, silver-filled adhesives accommodate joint movement. Use them to bond electrical components and repair circuits.
    Epoxy
    Image of Product. Single-Use Packet and  Syringe. Front orientation. Conductive Adhesives. Conductive Adhesives for Electronics, Loctite®, Single-Use Packet, Syringe.
    Image of Product. Front orientation. Conductive Adhesives. Conductive Adhesives for Electronics, Single-Use Packet.
    Image of Product. Can. Front orientation. Conductive Adhesives. Conductive Adhesives for Electronics, Can.

    Single-Use Packet and 

    Syringe

    Single-Use

    Packet

    Can

    Epoxy adhesives are two-part adhesives that need to be mixed together. The size listed is the combined total of the two parts.
    ASTM E595—Adhesives that meet ASTM E595, a standard used by NASA, produce almost no volatile emissions that could damage sensitive electronics, even in a vacuum.
    Container
    Mfr. Model
    No.
    Size, fl.
    oz.
    Net Wt.,
    oz.
    Type
    Surface
    Resistivity
    Begins to
    Harden
    Reaches Full
    Strength
    Thermal Conductivity,
    W/(m⋅°C)
    Mix
    Ratio
    Consistency
    Max. Temp.,
    ° F
    Specs.
    Met
    For Joining
    Each
    Loctite®
    29020.09Single-Use Packet, Syringe1× 10^-3Ω⋅cm60 min.24 hr.2.99100:6Paste230ASTM E595Ceramic, Glass, Metal7595A113000000
    29020.35Single-Use Packet, Syringe1× 10^-3Ω⋅cm60 min.24 hr.2.99100:6Paste230ASTM E595Ceramic, Glass, Metal7595A114000000
     
    Other Conductive Adhesives
    0.09Single-Use Packet5× 10^-2Ω⋅cm3 hr.24 hr.1.551:1.15Paste230Ceramic, Glass, Metal7661A1300000
    0.5Can9× 10^-5Ω⋅cm4 hr.5 day7.91:1Paste175ASTM E595Ceramic, Glass, Metal7595A111000000
    1Can9× 10^-5Ω⋅cm4 hr.5 day7.91:1Paste175ASTM E595Ceramic, Glass, Metal7595A112000000
     
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