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DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement) |
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Electrical Properties Electrical Properties |
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Solder for Drinking Water
This solder meets NSF/ANSI Standard 61 for drinking water.
Low-Melting-Point Lead-Free Solder for Low-Temperature Applications
Made of indium, this solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 0.030" | 0.01 | 0000000 | 0000000 |
| 52% | 48% | 0% | 245° | 34 | 1,720 | 0.030" | 8.8 | 0000000 | 00000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 0.030" | 0.01 | 0000000 | 000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 0.030" | 8.8 | 0000000 | 00000000 |
Low-Melting-Point Solder Ribbon for Low-Temperature Applications
Made with lead and silver, this solder ribbon has greater tensile strength and density than other indium-based solders, giving it a stronger hold. Solder ribbon is more easily used on large, flat areas than wire solder. Indium is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity, although not as good as solder with greater indium content. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 80% | 15% | 5% | 310° | 43 | 2,550 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
Low-Melting-Point Solder for Low-Temperature Applications
Made with lead and silver, this solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold. Indium is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity, although not as good as solder with greater indium content. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Indium | Lead | Silver | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Diameter | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||
| 80% | 15% | 5% | 310° | 43 | 2,550 | 0.030" | 0.01 | 0000000 | 0000000 |
| 80% | 15% | 5% | 310° | 43 | 2,550 | 0.030" | 8.8 | 0000000 | 00000000 |
Low-Melting-Point Lead-Free Solder Ribbon for Low-Temperature Applications
For use on large, flat areas, this indium ribbon solder is soft and malleable—even as temperatures approach absolute zero—to form an airtight seal between metal and certain non-metal materials. It’s commonly used in cryogenic applications, including with liquid nitrogen. Unlike tin-based solders, this solder won’t damage gold plating on circuit boards. It’s a good conductor of heat and electricity, as well. Indium-based solder can be cold welded, meaning it will bond to itself without heat. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications. Use soldering flux to prepare workpieces for this solder.
100% indium solder has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
48% tin solder has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
Material Composition | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Indium | Tin | Lead | Melting Temperature, °F | Thermal Conductivity, W/m-°C | Tensile Strength, psi | Length | Width | Thickness | Weight, oz. | Each | |
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel Alloys, Quartz, Stainless Steel, Steel, Zinc | |||||||||||
| 52% | 48% | 0% | 245° | 34 | 1,720 | 12" | 1" | 0.002" | 0.1 | 0000000 | 0000000 |
| 100% | __ | 0% | 315° | 86 | 270 | 12" | 1" | 0.002" | 0.1 | 0000000 | 000000 |
High-Density Low-Melting-Point Lead-Free Solder
This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. Do not use this solder on drinking water pipes.
Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Bismuth | Tin | Silver | Lead | Melting Temperature, °F | Diameter | Length | Weight | Each | |
For Joining Aluminum, Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel, Zinc | |||||||||
| 57% | 42% | 1% | 0% | 285° | 0.030" | 36" | 0.12 oz. | 00000000 | 0000000 |
| 57% | 42% | 1% | 0% | 285° | 0.030" | 380ft. | 1 lbs. | 00000000 | 000000 |
| 58% | 42% | __ | 0% | 280° | 0.030" | 36" | 0.12 oz. | 00000000 | 000000 |
| 58% | 42% | __ | 0% | 280° | 0.030" | 380ft. | 1 lbs. | 00000000 | 000000 |
Soldering Flux Paste for Plumbing
This flux meets NSF/ANSI Standard 61 for drinking water. Do not use it on magnesium or electronics.
| For Joining | Container Size, oz. | Form | Cleanup Method | Environment | Specifications Met | Each | |
| Steel, Copper, Brass, Zinc | 2 | Paste | Water | Food Industry | MIL-F-4995 Type II; NSF/ANSI 61 | 0000000 | 00000 |
| Steel, Copper, Brass, Zinc | 4 | Paste | Water | Food Industry | MIL-F-4995 Type II; NSF/ANSI 61 | 0000000 | 0000 |
| Steel, Copper, Brass, Zinc | 16 | Paste | Water | Food Industry | MIL-F-4995 Type II; NSF/ANSI 61 | 0000000 | 00000 |
Soldering Flux Liquid for Plumbing
Use this flux for non-potable (nondrinking) water applications. Do not use it on magnesium or electronics.
Fast-Flushing Soldering Flux for Plumbing
This flux paste provides the fastest removal of flux from pipe lines. It meets NSF/ANSI 61 safety standards for use with drinking water systems. Do not use it on magnesium or electronics.
| For Joining | Container Size, oz. | Form | Cleanup Method | Specifications Met | Each | |
| Steel, Copper, Brass, Zinc | 4 | Paste | Water | ASTM B813, NSF/ANSI 61 | 00000000 | 000000 |
Nokorode Soldering Flux
Protect the solder joint from corrosion with this flux paste. Do not use it on magnesium or electronics.
Mildly-Activated Rosin Soldering Flux for Electronics
This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
Container | |||||||
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| For Joining | Size | Type | Form | Cleanup Method | Specifications Met | Each | |
| Copper, Nickel Alloys, Brass, Bronze, Zinc | 1 gal. | Bottle | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Fully-Activated Rosin Soldering Flux for Electronics
Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
| For Joining | Container Size, gal. | Form | Cleanup Method | Specifications Met | Each | |
| Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Nonactivated Rosin Soldering Flux for Electronics
This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
Container | |||||||
|---|---|---|---|---|---|---|---|
| For Joining | Size | Type | Form | Cleanup Method | Specifications Met | Each | |
| Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 gal. | Bottle | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Lead-Free Paste Solder
Use this paste in hard-to-reach areas—apply a thin coat of paste to the surfaces you want joined, apply heat, and wipe with a damp cloth. Paste is made of finely powdered solder combined with a flux paste.
Material Composition | ||||||||
|---|---|---|---|---|---|---|---|---|
| Tin | Antimony | Lead | Melting Temperature, ° F | Solder Type | Form | Wt., lbs. | Each | |
For Joining Brass, Copper, Nickel Alloys, Steel, Zinc | ||||||||
| 71.3% | 3.8% | 0% | 470° | No Flux Required | Paste | 1 | 0000000 | 000000 |