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For Joining For Joining | Show |
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For Joining For Joining | Hide |
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Specifications Met Specifications Met |
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Solder Type Solder Type |
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Diameter Diameter |
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Cleanup Method Cleanup Method |
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Activation Activation |
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Solder for Drinking Water
This solder meets NSF/ANSI Standard 61 for drinking water.
Material Composition | ||||||||
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| Tin | Silver | Copper | Lead | Melting Temperature, ° F | Solder Type | Dia. | Each | |
1 lbs. | ||||||||
For Joining Aluminum, Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel, Zinc | ||||||||
| 95% | 0.2% | 4.8% | 0% | 440° | Flux Required | 0.118" | 00000000 | 000000 |
5 lbs. | ||||||||
For Joining Aluminum, Brass, Bronze, Copper, Nickel Alloys, Stainless Steel, Steel, Zinc | ||||||||
| 95% | 0.2% | 4.8% | 0% | 440° | Flux Required | 0.118" | 00000000 | 000000 |
Soldering Flux Paste for Plumbing
This flux meets NSF/ANSI Standard 61 for drinking water. Do not use it on magnesium or electronics.
| For Joining | Container Size, oz. | Form | Cleanup Method | Environment | Specifications Met | Each | |
| Steel, Copper, Brass, Zinc | 2 | Paste | Water | Food Industry | MIL-F-4995, Type II; NSF/ANSI 61 | 0000000 | 00000 |
| Steel, Copper, Brass, Zinc | 4 | Paste | Water | Food Industry | MIL-F-4995, Type II; NSF/ANSI 61 | 0000000 | 0000 |
| Steel, Copper, Brass, Zinc | 16 | Paste | Water | Food Industry | MIL-F-4995, Type II; NSF/ANSI 61 | 0000000 | 00000 |
Soldering Flux Liquid for Plumbing
Use this flux for non-potable (nondrinking) water applications. Do not use it on magnesium or electronics.
Nokorode Soldering Flux
Protect the solder joint from corrosion with this flux paste. Do not use it on magnesium or electronics.
Fast-Flushing Soldering Flux for Plumbing
This flux paste provides the fastest removal of flux from pipe lines. It meets NSF/ANSI 61 safety standards for use with drinking water systems. Do not use it on magnesium or electronics.
| For Joining | Container Size, oz. | Form | Cleanup Method | Specifications Met | Each | |
| Steel, Copper, Brass, Zinc | 4 | Paste | Water | ASTM B813, NSF/ANSI 61 | 00000000 | 00000 |
Mildly-Activated Rosin Soldering Flux for Electronics
This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
Container | |||||||
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| For Joining | Size | Type | Form | Cleanup Method | Specifications Met | Each | |
| Copper, Nickel Alloys, Brass, Bronze, Zinc | 1 gal. | Bottle | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Nonactivated Rosin Soldering Flux for Electronics
This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
Container | |||||||
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| For Joining | Size | Type | Form | Cleanup Method | Specifications Met | Each | |
| Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 gal. | Bottle | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Fully-Activated Rosin Soldering Flux for Electronics
Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
| For Joining | Container Size, gal. | Form | Cleanup Method | Specifications Met | Each | |
| Nickel Alloys, Copper, Brass, Bronze, Zinc | 1 | Liquid | Flux Remover | IPC J-STD-004 | 0000000 | 000000 |
Lead-Free Paste Solder
Use this paste in hard-to-reach areas—apply a thin coat of paste to the surfaces you want joined, apply heat, and wipe with a damp cloth. Paste is made of finely powdered solder combined with a flux paste.
Material Composition | ||||||||
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| Tin | Antimony | Lead | Melting Temperature, ° F | Solder Type | Form | Wt., lbs. | Each | |
For Joining Brass, Copper, Nickel Alloys, Steel, Zinc | ||||||||
| 71.3% | 3.8% | 0% | 470° | No Flux Required | Paste | 1 | 0000000 | 000000 |
Paste Solder
Use this paste in hard-to-reach areas—apply a thin coat of paste to the surfaces you want joined, apply heat, and wipe with a damp cloth. Paste is made of finely powdered solder combined with a flux paste.
Material Composition | |||||||
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| Tin | Lead | Melting Temperature, ° F | Solder Type | Form | Wt., lbs. | Each | |
For Joining Brass, Bronze, Copper, Steel, Zinc | |||||||
| 50% | 50% | 420° | No Flux Required | Paste | 1 | 000000 | 000000 |