Clear All
Manufacturer Manufacturer | Show |
---|
|
Manufacturer Manufacturer | Hide |
---|
Container Type Container Type |
---|
![]() | Tube |
Thermal Conductivity Thermal Conductivity |
---|
|
REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) REACH (Registration,Evaluation, Authorization and Restriction of Chemicals) |
---|
|
Material Material |
---|
|
Maximum Temperature Maximum Temperature |
---|
|
Minimum Temperature Minimum Temperature |
---|
|
Container Size Container Size |
---|
|
RoHS (Restriction of Hazardous Substances) RoHS (Restriction ofHazardous Substances) |
---|
|
DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement) |
---|
Heat Sink Compounds

Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
Container | |||||||
---|---|---|---|---|---|---|---|
Thermal Conductivity | Temp. Range, °F | Type | Size, fl. oz. | Manufacturer | Manufacturer Model Number | Each | |
Silicone | |||||||
0.68 W/m-K @ 97° F | -40° to 390° | Tube | 5 | Dow Corning | 340 | 00000000 | 000000 |