Clear All
Manufacturer Manufacturer | Show |
|---|
|
Manufacturer Manufacturer | Hide |
|---|
Container Type Container Type |
|---|
 | Tube |
Thermal Conductivity Thermal Conductivity |
|---|
|
REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) REACH (Registration,Evaluation, Authorization and Restriction of Chemicals) |
|---|
|
Material Material |
|---|
|
Maximum Temperature Maximum Temperature |
|---|
|
Minimum Temperature Minimum Temperature |
|---|
|
Container Size Container Size |
|---|
|
RoHS (Restriction of Hazardous Substances) RoHS (Restriction ofHazardous Substances) |
|---|
|
DFARS (Defense Acquisition Regulations Supplement) DFARS (Defense AcquisitionRegulations Supplement)  |
|---|
Heat Sink Compounds
Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
Container | |||||||
|---|---|---|---|---|---|---|---|
| Thermal Conductivity | Temp. Range, °F | Type | Size, fl. oz. | Manufacturer | Manufacturer Model Number | Each | |
Silicone | |||||||
| 0.68 W/m-K @ 97° F | -40° to 390° | Tube | 5 | Dow Corning | 340 | 00000000 | 000000 |