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    357 Products

    Rosin Flux-Core Solder for Electronics and Electrical Applications

    Rosin flux is quick acting with strong cleaning action, but it leaves residue that requires flux remover. This solder is electrically conductive, so it’s good for electronics and electronic applications.
    Leaded, Flux Core
    Image of Product. Front orientation. Contains Inset. Solder. Rosin Flux-Core Solder for Electronics and Electrical Applications.
    Material
    Composition
    Solder
    Alloy
    Tin
    Silver
    Lead
    Melting
    Temp., ° F
    Dia.
    Wt.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb60Sn4040%60%4600.015"1 lb.7659A131000000
    Pb60Sn4040%60%4600.020"1 lb.7659A13200000
    Pb60Sn4040%60%4600.031"1 lb.7659A13300000
    Pb60Sn4040%60%4600.050"1 lb.7659A13400000
    Pb60Sn4040%60%4600.062"1 lb.7659A1100000
    Pb60Sn4040%60%4600.093"1 lb.7659A100000
    Pb60Sn4040%60%4600.093"5 lb.7659A2000000
    Sn50Pb5050%50%4200.015"1 lb.7659A13500000
    Sn50Pb5050%50%4200.020"1 lb.7659A13600000
    Sn50Pb5050%50%4200.032"1 lb.7659A11100000
    Sn50Pb5050%50%4200.040"1 lb.7659A13700000
    Sn50Pb5050%50%4200.050"1 lb.7659A13800000
    Sn50Pb5050%50%4200.062"1 lb.7659A1200000
    Sn50Pb5050%50%4200.093"1 lb.7659A13900000
    Sn50Pb5050%50%4200.125"1 lb.7659A14100000
    Sn60Pb4060%40%3700.015"1 lb.7659A11200000
    Sn60Pb4060%40%3700.020"1 lb.7659A11300000
    Sn60Pb4060%40%3700.025"1 lb.7659A1500000
    Sn60Pb4060%40%3700.031"1 lb.7659A500000
    Sn60Pb4060%40%3700.040"1 lb.7659A11400000
    Sn60Pb4060%40%3700.050"1 lb.7659A1400000
    Sn60Pb4060%40%3700.062"1 lb.7659A300000
    Sn60Pb4060%40%3700.062"5 lb.7659A4000000
    Sn60Pb4060%40%3700.093"1 lb.7659A1300000
    Sn60Pb4060%40%3700.125"8 oz.7659A5200000
    Sn62Pb36Ag262%2%36%3700.020"1 lb.7659A115000000
    Sn62Pb36Ag262%2%36%3700.031"1 lb.7659A74000000
    Sn63Pb3763%37%3700.010"1 lb.7659A117000000
    Sn63Pb3763%37%3700.015"1 lb.7659A6400000
    Sn63Pb3763%37%3700.020"1 lb.7659A11800000
    Sn63Pb3763%37%3700.025"1 lb.7659A6700000
    Sn63Pb3763%37%3700.031"1 lb.7659A6500000
    Sn63Pb3763%37%3700.040"1 lb.7659A11900000
    Sn63Pb3763%37%3700.050"1 lb.7659A6800000
    Sn63Pb3763%37%3700.062"1 lb.7659A6600000
    Sn63Pb3763%37%3700.093"1 lb.7659A14200000
    Sn63Pb3763%37%3700.125"1 lb.7659A14300000
     
    Lead-Free, Flux Core
    Image of Product. Front orientation. Contains Inset. Solder. Rosin Flux-Core Solder for Electronics and Electrical Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material Composition
    Solder Alloy
    Tin
    Silver
    Antimony
    Copper
    Lead
    Melting
    Temp., ° F
    Dia.
    Wt.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.015"1 lb.7872A1250000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.020"1 lb.7872A31000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.025"1 lb.7872A126000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.031"1 lb.7872A46000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.040"5/8 oz.7872A5700000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.040"1 lb.7872A58000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.062"1 lb.7872A3200000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.093"1 lb.7872A3300000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%4600.125"1 lb.7872A127000000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%4600.015"1 lb.7872A12100000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%4600.025"1 lb.7872A12200000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%4600.050"1 lb.7872A12300000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%4600.125"1 lb.7872A12400000
    Sn97Cu397%3%0%4800.015"1 lb.7872A12800000
    Sn97Cu397%3%0%4800.025"1 lb.7872A12900000
    Sn97Cu397%3%0%4800.031"1 lb.7857A1200000
    Sn97Cu397%3%0%4800.050"1 lb.7872A13100000
    Sn97Cu397%3%0%4800.062"1 lb.7872A11100000
    Sn97Cu397%3%0%4800.093"1 lb.7872A11200000
    Sn97Cu397%3%0%4800.125"1 lb.7857A1600000
    Sn99.3Cu0.799.3%0.7%0%4400.015"1 lb.7872A113000000
    Sn99.3Cu0.799.3%0.7%0%4400.020"1 lb.7872A114000000
    Sn99.3Cu0.799.3%0.7%0%4400.032"1 lb.7872A11500000
    Sn99.3Cu0.799.3%0.7%0%4400.062"1 lb.7872A11600000
    Sn99.3Cu0.799.3%0.7%0%4400.093"1 lb.7872A117000000
     

    Solder for Drinking Water

    Image of Product. Front orientation. Solder. Solder for Drinking Water.
    This solder meets NSF/ANSI Standard 61 for drinking water. It does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free—Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder Alloy
    Tin
    Silver
    Copper
    Lead
    Melting
    Temp., ° F
    Solder Type
    Dia.
    Wt.,
    lb.
    Each
    For Joining Aluminum, Brass, Bronze, Copper, Nickel, Stainless Steel, Steel, and Zinc Alloy
    Sn95Cu4.8Ag0.295%0.2%4.8%0%440Lead-Free, Flux Required0.118"176805A61000000
     

    No-Clean Flux-Core Solder for Electronics and Electrical Applications

    The flux leaves minimal residue so there's no need for cleanup. All of this solder is electrically conductive.
    Leaded, Flux Core
    Image of Product. Front orientation. Contains Inset. Solder. No-Clean Flux-Core Solder for Electronics and Electrical Applications.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn60Pb4060%40%0.015"3654879N51000000
    Sn60Pb4060%40%0.020"3654879N5200000
    Sn60Pb4060%40%0.031"3654879N5300000
    Sn60Pb4060%40%0.040"3654879N5400000
    Sn60Pb4060%40%0.050"3654879N5500000
    Sn60Pb4060%40%0.062"3654879N5600000
    Sn60Pb4060%40%0.093"3654879N5700000
    Sn60Pb4060%40%0.125"3654879N5800000
    Sn63Pb3763%37%0.015"3657758A600000
    Sn63Pb3763%37%0.020"3657758A100000
    Sn63Pb3763%37%0.031"3657758A200000
    Sn63Pb3763%37%0.040"3654879N6200000
    Sn63Pb3763%37%0.050"3657758A300000
    Sn63Pb3763%37%0.062"3657758A1100000
     
    Lead-Free, Flux Core
    Image of Product. Front orientation. Contains Inset. Solder. No-Clean Flux-Core Solder for Electronics and Electrical Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material Composition
    1 lb.
    Solder Alloy
    Tin
    Silver
    Antimony
    Copper
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.015"4257872A710000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.020"4257872A41000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.025"4254879N65000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.031"4257872A42000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.040"4254879N66000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.062"4257872A4300000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.093"4257872A44000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.125"4254879N67000000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%0.025"4204879N6800000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%0.031"4204879N6900000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%0.050"4204879N7100000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%0.125"4204879N7200000
    Sn97Cu397%3%0%0.025"4454879N7300000
    Sn97Cu397%3%0%0.031"4454879N7400000
    Sn97Cu397%3%0%0.050"4454879N7500000
    Sn97Cu397%3%0%0.062"4454879N7600000
    Sn97Cu397%3%0%0.093"4454879N7700000
    Sn97Cu397%3%0%0.125"4454879N7800000
     

    Paste Solder

    Image of Product. Front orientation. Solder. Paste Solder.
    Use this paste in hard-to-reach areas—apply a thin coat of paste to the surfaces you want joined, apply heat, and wipe with a damp cloth. Paste is made of finely powdered solder combined with a flux paste, so it creates strong welds without needing separate flux.
    Lead-Free—Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder
    Alloy
    Tin
    Antimony
    Lead
    Melting
    Temp., ° F
    Solder Type
    Form
    Wt.,
    lb.
    Each
    For Joining Brass, Copper, Nickel, Steel, and Zinc Alloy
    Sn95Sb595%5%0%470Lead-Free, No Flux RequiredPaste17774A15000000
     

    Quick-Flow No-Clean Flux-Core Solder for Electronics and Electrical Applications

    The five flux cores in this solder allow fast soldering that uses solder efficiently and reduces the heat to your joint. The flux it’s filled with leaves minimal residue so there’s no cleanup. This solder is electrically conductive, making it good for electronics and electrical applications.
    Leaded, Flux Core
    Image of Product. Front orientation. Contains Inset. Solder. Quick-Flow No-Clean Flux-Core Solder for Electronics and Electrical Applications.
    Material Composition
    1 lb.
    Solder
    Alloy
    Tin
    Silver
    Antimony
    Copper
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn60Pb4060%0%0%0%40%0.015"3654879N11000000
    Sn60Pb4060%0%0%0%40%0.020"3654879N1200000
    Sn60Pb4060%0%0%0%40%0.025"3654879N1300000
    Sn60Pb4060%0%0%0%40%0.032"3654879N1400000
    Sn60Pb4060%0%0%0%40%0.050"3654879N1500000
    Sn60Pb4060%0%0%0%40%0.062"3654879N1600000
    Sn60Pb4060%0%0%0%40%0.093"3654879N1700000
    Sn60Pb4060%0%0%0%40%0.125"3654879N1800000
    Sn62Pb36Ag262%2%0%0%36%0.050"3654879N19000000
    Sn62Pb36Ag262%2%0%0%36%0.062"3654879N21000000
    Sn63Pb3763%0%0%0%37%0.015"3654879N2200000
    Sn63Pb3763%0%0%0%37%0.025"3654879N2300000
    Sn63Pb3763%0%0%0%37%0.032"3654879N2400000
    Sn63Pb3763%0%0%0%37%0.050"3654879N2500000
    Sn63Pb3763%0%0%0%37%0.062"3654879N2600000
    Sn63Pb3763%0%0%0%37%0.093"3654879N2700000
    Sn63Pb3763%0%0%0%37%0.125"3654879N2800000
     
    Lead-Free, Flux Core
    Image of Product. Front orientation. Contains Inset. Solder. Quick-Flow No-Clean Flux-Core Solder for Electronics and Electrical Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material Composition
    1 lb.
    Solder Alloy
    Tin
    Silver
    Antimony
    Copper
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%0%0.5%0%0.015"4254879N290000000
    Sn96.5Ag3Cu0.596.5%3%0%0.5%0%0.020"4254879N31000000
    Sn96.5Ag3Cu0.596.5%3%0%0.5%0%0.025"4254879N32000000
    Sn96.5Ag3Cu0.596.5%3%0%0.5%0%0.032"4254879N33000000
    Sn96.5Ag3Cu0.596.5%3%0%0.5%0%0.040"4254879N34000000
    Sn96.5Ag3Cu0.596.5%3%0%0.5%0%0.062"4254879N35000000
    Sn96.5Ag3Cu0.596.5%3%0%0.5%0%0.125"4254879N36000000
    Sn96Ag496%4%0%0%0%0.032"4304879N37000000
    Sn96Ag496%4%0%0%0%0.040"4304879N38000000
    Sn96Ag496%4%0%0%0%0.062"4304879N39000000
    Sn97Ag397%3%0%0%0%0.032"4304879N4100000
    Sn97Ag397%3%0%0%0%0.040"4304879N4200000
    Sn97Ag397%3%0%0%0%0.062"4304879N4300000
    Sn97Ag397%3%0%0%0%0.093"4304879N4400000
    Sn97Ag397%3%0%0%0%0.125"4304879N4500000
     

    Solder for Electronics and Electrical Applications

    Image of Product. Front orientation. Solder. Solder for Electronics and Electrical Applications.
    Electrically conductive, this solder is best for electronics and electronics applications. It does not have a flux core, so you can choose the flux that works best for your application.
    Leaded, Flux Required
    Material
    Composition
    1 lb.
    5 lb.
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn60Pb4060%40%0.031"3757667A51000000———0
    Sn60Pb4060%40%0.050"3757667A5300000———0
    Sn60Pb4060%40%0.062"3757667A31000007667A350000000
    Sn60Pb4060%40%0.093"3757667A5400000———0
    Sn60Pb4060%40%0.125"3757667A11000007667A15000000
    Sn63Pb3763%37%0.020"3607657A500000———0
    Sn63Pb3763%37%0.031"3607657A400000———0
    Sn63Pb3763%37%0.050"3607657A800000———0
    Sn63Pb3763%37%0.062"3607657A600000———0
    Sn63Pb3763%37%0.093"3607657A900000———0
    Sn63Pb3763%37%0.125"3607657A1000007657A2000000
     
    Lead-Free, Flux Required
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder Alloy
    Tin
    Silver
    Copper
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.020"4207872A210000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.032"4207872A22000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.040"4207872A101000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.062"4207872A2300000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.093"4207872A2400000
    Sn97Cu397%3%0%0.031"4457827A1100000
    Sn97Cu397%3%0%0.062"4457872A10200000
    Sn97Cu397%3%0%0.125"4457827A1500000
    Sn99.3Cu0.799.3%0.7%0%0.015"4407827A2100000
    Sn99.3Cu0.799.3%0.7%0%0.020"4407827A2200000
    Sn99.3Cu0.799.3%0.7%0%0.032"4407827A2300000
    Sn99.3Cu0.799.3%0.7%0%0.062"4407827A2400000
    Sn99.3Cu0.799.3%0.7%0%0.125"4407827A2500000
     

    Solder for Torch Soldering

    This solder does not have a flux core, so you can choose the flux that works best for your application.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Solder for Torch Soldering.
    Material
    Composition
    1 lb.
    5 lb.
    25 lb.
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    Each
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb60Sn4040%60%0.025"3657667A81000000———0———0
    Pb60Sn4040%60%0.031"3657667A61000007667A620000000———0
    Pb60Sn4040%60%0.040"3657667A8200000———0———0
    Pb60Sn4040%60%0.050"3657667A8300000———0———0
    Pb60Sn4040%60%0.062"3657667A34000007667A41000000———0
    Pb60Sn4040%60%0.093"3657667A8400000———0———0
    Pb60Sn4040%60%0.125"4607667A14000007667A21000000———0
    Pb60Sn4040%60%0.148"3657667A8500000———07667A640000000
    Pb60Sn4040%60%0.250"365———07667A860000007667A65000000
     

    Quick-Flow Rosin Flux-Core Solder for Electronics and Electrical Applications

    Image of Product. Front orientation. Contains Inset. Solder. Quick-Flow Rosin Flux-Core Solder for Electronics and Electrical Applications.
    The five flux cores allow fast soldering that uses less solder and transmits less heat to the joint. Rosin flux is quick acting with strong cleaning action but leaves residue that requires flux remover. Since this solder is electrically conductive, it’s good for electronics and electrical applications.
    Leaded, Flux Core
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn60Pb4060%40%0.015"3757687A11000000
    Sn60Pb4060%40%0.020"3757687A1200000
    Sn60Pb4060%40%0.025"3757744A300000
    Sn60Pb4060%40%0.032"3757744A600000
    Sn60Pb4060%40%0.050"3757744A500000
    Sn60Pb4060%40%0.062"3757744A100000
    Sn60Pb4060%40%0.093"3757687A1300000
    Sn60Pb4060%40%0.125"3757687A1400000
    Sn62Pb36Ag262%2%36%0.025"4607687A63000000
    Sn62Pb36Ag262%2%36%0.032"4607687A15000000
    Sn62Pb36Ag262%2%36%0.050"4607687A16000000
    Sn62Pb36Ag262%2%36%0.062"4607687A61000000
    Sn63Pb3763%37%0.015"3657745A400000
    Sn63Pb3763%37%0.020"3657687A1700000
    Sn63Pb3763%37%0.025"3657745A300000
    Sn63Pb3763%37%0.032"3657687A1800000
    Sn63Pb3763%37%0.050"3657745A500000
    Sn63Pb3763%37%0.062"3657745A100000
    Sn63Pb3763%37%0.093"3657687A1900000
    Sn63Pb3763%37%0.125"3657687A2100000
     
    Lead-Free, Flux Core
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder Alloy
    Tin
    Silver
    Copper
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.025"4607687A220000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.032"4607687A23000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.040"4607687A24000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.062"4607687A25000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.125"4607687A26000000
    Sn96Ag496%4%0%0.032"4706985N11000000
    Sn96Ag496%4%0%0.062"4706985N12000000
    Sn97Cu397%3%0%0.032"4456985N1500000
    Sn97Cu397%3%0%0.062"4456985N1600000
    Sn97Cu397%3%0%0.125"4456985N1800000
     

    Solder

    Image of Product. Front orientation. Solder. Solder.
    Use this solder for general purpose applications. It does not have a flux core, so you can choose the flux that works best for your application.
    Leaded, Flux Required
    Material
    Composition
    1 lb.
    5 lb.
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn50Pb5050%50%0.025"4207667A91000000———0
    Sn50Pb5050%50%0.032"4207667A71000007667A720000000
    Sn50Pb5050%50%0.040"4207667A9200000———0
    Sn50Pb5050%50%0.050"4207667A9300000———0
    Sn50Pb5050%50%0.062"4207667A32000007667A42000000
    Sn50Pb5050%50%0.093"4207667A73000007667A74000000
    Sn50Pb5050%50%0.125"4207667A12000007667A22000000
    Sn50Pb5050%50%0.250"420———07667A75000000
     

    Bar Solder

    Image of Product. Front orientation. Solder. Bar Solder.
    This solder is commonly used in solder melting pots. Use it for general purpose applications. It does not have a flux core, so you can choose the flux that works best for your application.
    Leaded, Flux Required
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Lead
    Melting
    Temp., ° F
    Lg.
    Wd.
    Ht.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn50Pb5050%50%4206"1"1/2"7663A12000000
     

    No-Flux Solder for Aluminum

    Flux is not required for this solder to form strong joints.
    Lead-Free, No Flux Required
    Image of Product. Front orientation. Solder. No-Flux Solder for Aluminum.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    2 lb.
    Solder
    Alloy
    Zinc
    Aluminum
    Lead
    Dia.
    Melting
    Temp., ° F
    Lg.
    Pkg.
    For Joining Aluminum
    Zn98Al298%2%0%0.125"76018"7664A4000000
     

    Solder Pellets

    Also known as solder slugs, these pellets create strong, electrically conductive connections between battery terminal lugs and cable. They are measured for the precise amount of solder you need. These pellets make stronger connections than those created by crimping or compression. Place a pellet in your lug and heat it until melted. Put your cable in the liquid solder and hold until the solder solidifies for a secure connection. These pellets do not have a flux core, so you can choose the flux that works best for your application.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Solder Pellets.
    Material
    Composition
    For Wire
    Ga.
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Lg.
    Form
    Color
    Pkg.
    Qty.
    Pkg.
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, Steel, and Tin
    6
    Sn63Pb3763%37%0.195"2150.400"PelletGray255282N11000000
    4
    Sn63Pb3763%37%0.240"2150.400"PelletGray255282N1200000
    2
    Sn63Pb3763%37%0.330"2150.500"PelletGreen255282N1300000
    1
    Sn63Pb3763%37%0.330"2150.546"PelletRed255282N1400000
    1/0
    Sn63Pb3763%37%0.410"2150.600"PelletBlack105282N1500000
    2/0
    Sn63Pb3763%37%0.445"2150.600"PelletOrange105282N1600000
    3/0
    Sn63Pb3763%37%0.510"2150.600"PelletPurple105282N1700000
    4/0
    Sn63Pb3763%37%0.585"2150.600"PelletYellow105282N1800000
     

    Low-Melting-Point Solder for Low-Temperature Applications

    Even as temperatures approach absolute zero, this indium solder remains soft and malleable, allowing it to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. This solder has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core; choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.16 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%0.030"310432,5506976N110000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    100% Indium—Solder that is 100% indium has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
    48% Tin—Solder with 48% tin has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
    Material
    Composition
    0.11 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%0.030"245341,7208514N130000000
    In100100%0%0.030"315862708514N11000000
     

    Easy-Clean Flux-Core Solder for Electronics and Electrical Applications

    Wash away flux residue from this solder with water. It is electrically conductive, so it is good for electronics and electrical applications.
    Leaded, Flux Core
    Image of Product. Front orientation. Contains Inset, Border. Solder. Easy-Clean Flux-Core Solder for Electronics and Electrical Applications.
    Material
    Composition
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Wt.,
    lb.
    Specs. Met
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn60Pb4060%40%0.015"3651IPC J-STD-0064871N11000000
    Sn60Pb4060%40%0.020"3651IPC J-STD-0064871N1200000
    Sn60Pb4060%40%0.031"3651IPC J-STD-0064871N1300000
    Sn60Pb4060%40%0.040"3651IPC J-STD-0064871N1400000
    Sn60Pb4060%40%0.050"3651IPC J-STD-0064871N1500000
    Sn60Pb4060%40%0.062"3651IPC J-STD-0064871N1600000
    Sn60Pb4060%40%0.125"3651IPC J-STD-0064871N1700000
    Sn63Pb3763%37%0.015"36017756A300000
    Sn63Pb3763%37%0.020"36017756A100000
    Sn63Pb3763%37%0.031"36017756A200000
    Sn63Pb3763%37%0.040"3651IPC J-STD-0064871N1900000
     
    Lead-Free, Flux Core
    Image of Product. Front orientation. Contains Inset, Border. Solder. Easy-Clean Flux-Core Solder for Electronics and Electrical Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder Alloy
    Tin
    Silver
    Copper
    Lead
    Dia.
    Melting
    Temp., ° F
    Wt.,
    lb.
    Specs. Met
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.025"3651IPC J-STD-0064871N210000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.040"3651IPC J-STD-0064871N22000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.125"3651IPC J-STD-0064871N23000000
    Sn97Cu397%3%0%0.025"4451IPC J-STD-0064871N2400000
    Sn97Cu397%3%0%0.031"4451IPC J-STD-0064871N2500000
    Sn97Cu397%3%0%0.050"4451IPC J-STD-0064871N2600000
    Sn97Cu397%3%0%0.125"4451IPC J-STD-0064871N2700000
     

    Bar Solder for Electronics and Electrical Applications

    This solder is commonly used in solder melting pots. It is electrically conductive. Without a flux core, it allows you to choose the flux that works best for your application.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Bar Solder for Electronics and Electrical Applications, Leaded, Bar.

    Bar

    Material
    Composition
    Solder
    Alloy
    Tin
    Lead
    Melting
    Temp., ° F
    Shape
    Lg.
    Wd.
    Ht.
    Wt.,
    lb.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn60Pb4060%40%375Bar7"1"1/2"17663A11000000
    Sn63Pb3763%37%360Bar7"1"1/2"17657A300000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Bar Solder for Electronics and Electrical Applications, Lead-Free, Bar.
    Image of Product. Front orientation. Solder. Bar Solder for Electronics and Electrical Applications, Lead-Free, Triangular Bar.

    Bar

    Triangular Bar

    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material Composition
    Solder Alloy
    Tin
    Silver
    Antimony
    Copper
    Lead
    Melting
    Temp., ° F
    Shape
    Lg.
    Wd.
    Ht.
    Wt.,
    lb.
    Each
    For Joining Brass, Bronze, and Copper
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%465Bar14"1/2"1/2"176805A73000000
     
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%0.5%0%425Triangular Bar12"1"1/2"176805A8100000
    Sn96Ag496%4%0%430Triangular Bar12"1"1/2"176805A8200000
    Sn97Cu397%3%0%445Triangular Bar12"1"1/2"176805A8300000
    Sn99.3Cu0.799.3%0.7%0%445Triangular Bar12"1"1/2"176805A8400000
     

    Bar Solder for Torch Soldering

    Image of Product. Front orientation. Solder. Bar Solder for Torch Soldering.
    This solder is commonly used in solder melting pots. It does not have a flux core, so you can choose the flux that works best for your application.
    Leaded, Flux Required
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Lead
    Melting
    Temp., ° F
    Lg.
    Wd.
    Ht.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb60Sn4040%60%4606"1"1/2"7663A14000000
     

    Solder for Aluminum

    Image of Product. Front orientation. Solder. Solder for Aluminum, Wire.
    Image of Product. Front orientation. Solder. Solder for Aluminum, Rod.

    Wire

    Rod

    Without a flux core, this solder allows you to choose the flux that works best for your application. It is lead-free, so it is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder
    Alloy
    Tin
    Zinc
    Lead
    Melting
    Temp., ° F
    Dia.
    Lg.
    Wt.
    Each
    Wire
    Sn60Zn4060%40%0%6350.125"26 ft.1 lb.7664A31000000
     
    Rod
    Sn60Zn4060%40%0%6350.281"13 1/2"3.4 oz.7664A2100000
    Sn60Zn4060%40%0%6350.562"13 1/2"13.6 oz.7664A1100000
     

    High-Density Low-Melting-Point Solder

    This bismuth-tin solder has similar performance properties to lead solder, but is also safe for use in food-processing equipment and copper water pipes. It has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components, as well as for step soldering with traditional solders. However, it’s less thermally conductive than other metals and more brittle than lead. Flux isn’t required, but for easier cleanup use it with no-clean soldering flux. Do not use this solder on drinking water pipes.
    Lead-Free, No Flux Required
    Image of Product. Front orientation. Solder. High-Density Low-Melting-Point Solder.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    1% Silver—Solder with 1% silver forms stronger bonds than solder without silver. It’s also more malleable and ductile. However, it has a higher melting point, so it takes longer to solder.
    Material
    Composition
    0.12 oz.
    Solder
    Alloy
    Bismuth
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Lg.
    Each
    For Joining Aluminum, Brass, Bronze, Copper, Nickel, Stainless Steel, Steel, and Zinc Alloy
    Bi57Sn42Ag157%42%1%0%0.030"28536"8520N1130000000
    Bi58Sn4258%42%0%0.030"28036"8520N111000000
     

    Acid Flux-Core Solder for Electronics and Electrical Applications

    Acid flux has strong cleaning action, but leaves corrosive residue that washes away with water. This solder is electrically conductive.
    Leaded, Flux Core
    Image of Product. Front orientation. Contains Inset. Solder. Acid Flux-Core Solder for Electronics and Electrical Applications.
    Material
    Composition
    1 lb.
    5 lb.
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb60Sn4040%60%0.015"4607658A301000000———0
    Pb60Sn4040%60%0.020"4607658A30200000———0
    Pb60Sn4040%60%0.031"4607658A30300000———0
    Pb60Sn4040%60%0.050"4607658A30400000———0
    Pb60Sn4040%60%0.062"4607658A30500000———0
    Pb60Sn4040%60%0.093"4607658A30600000———0
    Pb60Sn4040%60%0.125"4607658A1000007658A20000000
    Sn50Pb5050%50%0.015"4207658A30700000———0
    Sn50Pb5050%50%0.020"4207658A30800000———0
    Sn50Pb5050%50%0.031"4207658A30900000———0
    Sn50Pb5050%50%0.050"4207658A31100000———0
    Sn50Pb5050%50%0.062"4207658A31200000———0
    Sn50Pb5050%50%0.093"4207658A31300000———0
    Sn50Pb5050%50%0.125"4207658A400000———0
    Sn60Pb4060%40%0.015"3757658A31400000———0
    Sn60Pb4060%40%0.020"3757658A31500000———0
    Sn60Pb4060%40%0.031"3757658A31600000———0
    Sn60Pb4060%40%0.050"3757658A31700000———0
    Sn60Pb4060%40%0.062"3757658A31800000———0
    Sn60Pb4060%40%0.093"3757658A31900000———0
    Sn60Pb4060%40%0.125"3757658A32100000———0
     
    Lead-Free, Flux Core
    Image of Product. Front orientation. Contains Inset. Solder. Acid Flux-Core Solder for Electronics and Electrical Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material Composition
    1 lb.
    Solder Alloy
    Tin
    Silver
    Antimony
    Copper
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.015"4607658A3220000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.020"4607658A323000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.025"4607658A324000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.031"4607658A325000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.040"4607658A326000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.062"4607658A327000000
    Sn96.5Ag3Cu0.596.5%3%0.5%0%0.125"4607658A328000000
    Sn97Cu2Sb0.8Ag0.297%0.2%0.8%2%0%0.031"4857658A32900000
    Sn97Cu397%3%0%0.025"4857658A33100000
    Sn97Cu397%3%0%0.031"4457844A400000
    Sn97Cu397%3%0%0.050"4857658A33200000
    Sn97Cu397%3%0%0.062"4857658A33300000
    Sn97Cu397%3%0%0.125"4457844A600000
     

    No-Clean Flux-Core Solder for HVAC Applications

    Image of Product. Front orientation. Contains Inset. Solder. No-Clean Flux-Core Solder for HVAC Applications.
    The flux leaves minimal residue so there's no cleanup. The addition of silver in this solder helps it resist vibration to form strong joints in HVAC systems.
    Leaded, Flux Core
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn62Pb36Ag262%2%36%0.031"3707758A40000000
     

    Acid Flux-Core Solder for HVAC Applications

    Image of Product. Front orientation. Contains Inset. Solder. Acid Flux-Core Solder for HVAC Applications.
    Acid flux has strong cleaning action, but leaves corrosive residue that washes away with water. The addition of silver in this solder helps it resist vibration to form strong joints in HVAC systems.
    Lead-Free, Flux Core
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96Ag496%4%0%0.125"4307791A220000000
     

    High-Melting-Point Bar Solder for Electronics and Electrical Applications

    The high melting point prevents remelting when soldering successive joints with another solder. This solder is commonly used in solder melting pots. It is electrically conductive. Without a flux core, it allows you to choose the flux that works best for your application.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. High-Melting-Point Bar Solder for Electronics and Electrical Applications.
    Material
    Composition
    1 lb.
    Solder Alloy
    Tin
    Silver
    Lead
    Melting
    Temp., ° F
    Lg.
    Wd.
    Ht.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb97.5Ag1.5Sn11%1.5%97.5%5807"3/4"1/2"7663A15000000
     

    Rosin Flux-Core High-Melting-Point Solder for Electronics and Electrical Applications

    Image of Product. Front orientation. Contains Inset. Solder. Rosin Flux-Core High-Melting-Point Solder for Electronics and Electrical Applications.
    Rosin flux is quick acting with strong cleaning action, but leaves residue that requires flux remover. The high melting point of this solder prevents remelting when soldering successive joints with another solder. It is electrically conductive.
    Leaded, Flux Core
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb93Sn5Ag25%2%93%0.032"5357685A21000000
    Rosin Flux-Core High-Melting-Point Solder for Electrical Applications, 5% Tin, 0.032" Diameter, 1 lb.
    EachIn stock
    Pb93Sn5Ag25%2%93%0.050"5807685A1200000
    Pb93Sn5Ag25%2%93%0.062"5657685A11000000
    Pb88Sn10Ag210%2%88%0.031"5707685A2200000
    Pb88Sn10Ag210%2%88%0.062"5707685A2300000
     

    Quick-Flow Easy-Clean Flux-Core Solder for Electronics and Electrical Applications

    Image of Product. Front orientation. Contains Inset. Solder. Quick-Flow Easy-Clean Flux-Core Solder for Electronics and Electrical Applications.
    Electrically conductive and with five flux cores, this solder speeds up the process of soldering electronics, so you use less solder and transmit less heat to the joint. Easily wash away the flux residue with just water.
    Leaded, Flux Core
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn60Pb4060%40%0.025"3654873N11000000
    Sn60Pb4060%40%0.032"3654873N1200000
    Sn60Pb4060%40%0.050"3654873N1300000
    Sn60Pb4060%40%0.062"3654873N1400000
    Sn60Pb4060%40%0.125"3654873N1500000
    Sn63Pb3763%37%0.025"3654873N1600000
    Sn63Pb3763%37%0.032"3654873N1700000
    Sn63Pb3763%37%0.062"3654873N1800000
    Sn63Pb3763%37%0.125"3654873N1900000
     

    Solder for High-Temperature Applications

    Image of Product. Front orientation. Solder. Solder for High-Temperature Applications.
    This solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment. It does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free, Flux Required
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Antimony
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn95Sb595%5%0%0.031"4607668A11000000
    Sn95Sb595%5%0%0.040"4607668A1200000
    Sn95Sb595%5%0%0.050"4607668A1300000
    Sn95Sb595%5%0%0.062"4607668A600000
    Sn95Sb595%5%0%0.093"4607668A1400000
    Sn95Sb595%5%0%0.125"4607668A100000
     

    Bar Solder for Machine Soldering

    Image of Product. Front orientation. Solder. Bar Solder for Machine Soldering.
    This solder is commonly used in solder melting pots. It does not have a flux core, so you can choose the flux that works best for your application.
    Leaded, Flux Required
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Lead
    Melting
    Temp., ° F
    Lg.
    Wd.
    Ht.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb70Sn3030%70%4809"3/4"1/2"7663A17000000
     

    Solder for HVAC Applications

    Image of Product. Front orientation. Solder. Solder for HVAC Applications.
    The silver in this solder helps it resist vibration to form strong joints in HVAC systems. Since it doesn’t have a flux core, you can choose the flux that works best for your application.
    Lead-Free, Flux Required
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96Ag496%4%0%0.031"4457791A120000000
    Sn96Ag496%4%0%0.062"4457791A43000000
    Sn96Ag496%4%0%0.125"4457791A11000000
     

    Bar Solder for High-Temperature Applications

    This solder is commonly used in solder melting pots. It keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment. It does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Bar Solder for High-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Antimony
    Lead
    Melting
    Temp., ° F
    Lg.
    Wd.
    Ht.
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn95Sb595%5%0%46012"1"1/2"7668A16000000
     

    Solder for Machine Soldering

    Image of Product. Front orientation. Solder. Solder for Machine Soldering.
    This solder does not have a flux core, so you can choose the flux that works best for your application.
    Leaded, Flux Required
    Material
    Composition
    1 lb.
    5 lb.
    Solder
    Alloy
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb70Sn3030%70%0.031"4905276N11000000———0
    Pb70Sn3030%70%0.050"4905276N1200000———0
    Pb70Sn3030%70%0.062"4907667A45000007667A460000000
    Pb70Sn3030%70%0.093"4905276N1300000———0
    Pb70Sn3030%70%0.125"4907667A25000007667A26000000
    Pb70Sn3030%70%0.250"490———05276N14000000
     

    Solder for Food Service Equipment

    Image of Product. Front orientation. Solder. Solder for Food Service Equipment.
    Composed of pure tin, this solder is safe for use with food service equipment. It does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free—Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder
    Alloy
    Tin
    Lead
    Melting
    Temp., ° F
    Solder Type
    Dia.
    Wt.,
    lb.
    Each
    For Joining Brass, Bronze, Copper, Stainless Steel, and Steel
    Sn100100%0%450Lead-Free, Flux Required0.050"17656A101000000
    Sn100100%0%450Lead-Free, Flux Required0.062"17656A10200000
    Sn100100%0%450Lead-Free, Flux Required0.093"17656A10300000
    Sn100100%0%450Lead-Free, Flux Required0.125"17656A100000
    Sn100100%0%450Lead-Free, Flux Required0.250"57656A14000000
     

    Solder for Stainless Steel

    Image of Product. Front orientation. Solder. Solder for Stainless Steel.
    Without a flux core, this solder allows you to choose the flux that works best for your application.
    Leaded, Flux Required
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Stainless Steel
    Pb54Sn45Ag145%1%54%0.032"4105275N11000000
    Pb54Sn45Ag145%1%54%0.050"4105275N1200000
    Pb54Sn45Ag145%1%54%0.062"4105275N1300000
    Pb54Sn45Ag145%1%54%0.093"4105275N1400000
    Pb54Sn45Ag145%1%54%0.125"4107656A400000
     

    Bar Solder for Food Service Equipment

    Image of Product. Front orientation. Solder. Bar Solder for Food Service Equipment.
    This solder is commonly used in solder melting pots. It's composed of pure tin, so it is safe for use with food service equipment. This solder does not have a flux core, so you can choose the flux that works best for your application.
    Lead-Free—Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    Solder
    Alloy
    Tin
    Lead
    Melting
    Temp., ° F
    Solder Type
    Lg.
    Wd.
    Ht.
    Wt.,
    lb.
    Each
    For Joining Brass, Bronze, Copper, Stainless Steel, and Steel
    Sn100100%0%450Lead-Free, Flux Required11 1/2"1"1/2"18886K11000000
     

    No-Clean Flux-Core Solder for High-Temperature Applications

    Image of Product. Front orientation. Contains Inset. Solder. No-Clean Flux-Core Solder for High-Temperature Applications.
    The flux leaves minimal residue so there's no cleanup. The solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment.
    Lead-Free, Flux Core
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Antimony
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn95Sb595%5%0%0.031"4607837A34000000
    Sn95Sb595%5%0%0.040"4607837A10100000
    Sn95Sb595%5%0%0.050"4607837A10200000
    Sn95Sb595%5%0%0.062"4607837A10300000
    Sn95Sb595%5%0%0.093"4607837A10400000
    Sn95Sb595%5%0%0.125"4607837A3800000
     

    High-Melting-Point Solder for Electronics and Electrical Applications

    The high melting point prevents remelting when soldering successive joints with another solder. This solder is electrically conductive. Without a flux core, it allows you to choose the flux that works best for your application.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. High-Melting-Point Solder for Electronics and Electrical Applications.
    Material
    Composition
    1 lb.
    5 lb.
    Solder Alloy
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Pb97.5Ag1.5Sn11%1.5%97.5%0.062"5807667A430000007667A440000000
    Pb97.5Ag1.5Sn11%1.5%97.5%0.125"5807667A23000007667A24000000
     

    Low-Melting-Point Solder Ribbon for Low-Temperature Applications

    Made with indium this solder is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. Thanks to its ribbon shape, this solder is easier to use on large, flat areas than wire solder.
    This solder has a lower melting point than most solders, making it good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so you can also use it in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core, choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%310432,55012"1"0.002"5940N110000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%245341,72012"1"0.002"7906N120000000
    In100100%0%3158627012"1"0.002"7906N11000000
     

    Easy-Clean Flux-Core Solder for High-Temperature Applications

    Image of Product. Front orientation. Contains Inset. Solder. Easy-Clean Flux-Core Solder for High-Temperature Applications.
    The flux residue easily washes away with water. The solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment.
    Lead-Free, Flux Core
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Antimony
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn95Sb595%5%0%0.031"4607843A42000000
    Sn95Sb595%5%0%0.125"4607843A4600000
     

    Rosin Flux-Core Solder for HVAC Applications

    Image of Product. Front orientation. Contains Inset. Solder. Rosin Flux-Core Solder for HVAC Applications.
    Rosin flux is quick acting with strong cleaning action, but leaves residue that requires flux remover. The addition of silver in this solder helps it resist vibration to form strong joints in HVAC systems.
    Lead-Free, Flux Core
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn96Ag496%4%0%0.031"4307859A23000000
    Sn96Ag496%4%0%0.062"4307859A2600000
    Sn96Ag496%4%0%0.125"4307859A2500000
     

    Rosin Flux-Core Solder for High-Temperature Applications

    Image of Product. Front orientation. Contains Inset. Solder. Rosin Flux-Core Solder for High-Temperature Applications.
    Rosin flux is quick acting with strong cleaning action, but leaves residue that requires flux remover. The solder keeps its strength in applications where vibration and frequent and extreme temperature changes occur, such as in water lines and refrigeration equipment.
    Lead-Free, Flux Core
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    1 lb.
    Solder
    Alloy
    Tin
    Antimony
    Lead
    Dia.
    Melting
    Temp., ° F
    Each
    For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel
    Sn95Sb595%5%0%0.031"4607830A21000000
    Sn95Sb595%5%0%0.125"4607830A2500000
     
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