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Thermal Conductivity @ Temperature
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Export Control Classification Number (ECCN)
DFARS Specialty Metals
Heat Sink Bonding Compounds
Bond heat sinks to surfaces, eliminating air gaps for maximum heat transfer. These compounds are commonly used with transistors, diodes, rectifiers, and transformers.
Zinc-oxide compounds create a more secure bond than silicone compounds.
Container | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Thermal Conductivity | Temp. Range, °F | Type | Size, fl. oz. | Net Weight, lbs. | Manufacturer | Manufacturer Model Number | Specifications Met | Each | |
Silicone | |||||||||
| 0.68 W/m-K @ 97° F | -40° to 390° | Tube | 5 | __ | Dow Corning | 340 | __ | 00000000 | 000000 |
| 0.75 W/m-K @ 97° F | -40° to 400° | Tube | 8 | __ | __ | __ | __ | 00000000 | 00000 |
| 0.75 W/m-K @ 97° F | -40° to 400° | Pail | __ | 80 | __ | __ | __ | 000000000 | 00000000 |
Zinc Oxide | |||||||||
| 0.92 W/m-K @ 97° F | -40° to 320° | Tube | 2 | __ | __ | __ | MIL-C-47113 | 0000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 320° | Syringe | 1 | __ | __ | __ | MIL-C-47113 | 00000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 390° | Tube | 4 | __ | __ | __ | ASTM D5470 | 00000000 | 00000 |
| 0.92 W/m-K @ 97° F | -40° to 390° | Jar | 16 | __ | __ | __ | ASTM D5470 | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Tube | 2 | __ | __ | __ | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Tube | 4 | __ | __ | __ | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Jar | 16 | __ | __ | __ | __ | 00000000 | 00000 |
| 5 W/m-K @ 97° F | -40° to 500° | Syringe | 1 | __ | __ | __ | __ | 00000000 | 00000 |