No-Clean Soldering Flux for Electronics
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This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Paste flux is easier to apply than liquid flux for precise applications.
Container | Tip | |||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
For Joining | Size | Net Weight | Type | Shape | Diameter | Form | Cleanup Method | Specifications Met | Features | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 fl. oz. | __ | Pen | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | __ | Outside United States and Canada | 0000000 | 00000 |
Nickel Alloys, Copper, Brass, Bronze | 0.3 fl. oz. | __ | Syringe | __ | __ | Paste | No Clean | IPC J-STD-004 | Luer Lock Connection | __ | 0000000 | 00000 |
Nickel Alloys, Copper, Brass, Bronze | __ | 3 1/2 oz. | Jar | __ | __ | Paste | No Clean | IPC J-STD-004 | __ | __ | 0000000 | 00000 |
Nickel Alloys, Copper, Brass, Bronze | __ | 1 lbs. | Jar | __ | __ | Paste | No Clean | IPC J-STD-004 | __ | __ | 0000000 | 000000 |
Lead-Free No-Clean Soldering Flux for Electronics
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This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
Tip | |||||||||
---|---|---|---|---|---|---|---|---|---|
For Joining | Container Size, fl. oz. | Shape | Diameter | Form | Cleanup Method | Specifications Met | Cannot Be Sold To | Each | |
Copper, Brass, Bronze | 0.3 | Chisel | 0.2" | Liquid | No Clean | IPC J-STD-004 | Outside United States and Canada | 0000000 | 000000 |
No-Clean Soldering Flux for Low-Melting-Point Solders
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Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.
No-Clean Brazing Flux for Joining Aluminum to Copper
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Clean and prepare surfaces before joining aluminum to copper. With minimal residue, this flux does not require cleanup.