McMaster-Carr logo
    Forward
    Enter e-mail addresses in the fields below
    Message
    Cancel
    Print
    How can we improve?
    Comments
    E-mail address (if you would like a response)
    21 Products

    Thermal Interface Foil

    Image of Product. Front orientation. Thermal Interface Material. Thermal Interface Foil.
    Made of indium, this foil is more thermally conductive than thermal interface materials (TIMs) made of plastic. By efficiently pulling heat away from components that produce heat, such as CPUs, this foil lets you use smaller forced cooling systems to extend battery life. It’s also softer and more ductile than paste and putty, covering surfaces better to minimize airflow gaps and increase heat flow. Unlike paste and grease, this foil won’t leach out from between surfaces over time, nor will it dry out and lose effectiveness. It’s clean, easy to install and reposition, and requires no surface preparation. Foil is corrosion resistant and doesn’t need special storage.
    48% Tin—Foil with 48% tin has greater tensile and shear strength than foil without tin, but is less thermally conductive.
    Each
    Package
    Thk.
    Tensile Strength,
    psi
    Shear Strength,
    psi
    Max. Temp.,
    ° F
    Thermal Conductivity
    @ Temp.
    Electrical
    Resistivity
    For Use
    Outdoors
    Each
    Pkg.
    Qty.
    Pkg.
    2" × 2"
     
    Indium
    0.004"27089025586 W/(m⋅°C) @ 185° F7.2 × 10^-6Ω⋅cmNo8898N18000000208898N120000000
    0.01"27089025586 W/(m⋅°C) @ 185° F7.2 × 10^-6Ω⋅cmNo8898N1600000208898N14000000
     
    Indium Alloy (48% Tin)
    0.004"1,7301,62019024 W/(m⋅°C) @ 185° F1.5 × 10^-5Ω⋅cmNo8898N1700000208898N11000000
    0.01"1,7301,62019024 W/(m⋅°C) @ 185° F1.5 × 10^-5Ω⋅cmNo8898N1500000208898N13000000
     

    Low-Melting-Point Solder for Low-Temperature Applications

    Even as temperatures approach absolute zero, this indium solder remains soft and malleable, allowing it to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. This solder has a lower melting point than most solders, so it’s good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so it’s good for use in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core; choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.16 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%0.030"310432,5506976N110000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    100% Indium—Solder that is 100% indium has better thermal conductivity than solder that contains tin, and will cold weld more easily. However, it has lower tensile and shear strength than solder with tin.
    48% Tin—Solder with 48% tin has greater tensile and shear strength than 100% indium solder, but lower thermal and electrical conductivity.
    Material
    Composition
    0.11 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Dia.
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%0.030"245341,7208514N130000000
    In100100%—0%0.030"315862708514N11000000
     

    No-Clean Soldering Flux for Low-Melting-Point Solders

    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Low-Melting-Point Solders.
    Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Copper, Indium, Indium Alloy4/5SyringeNeedle0.096"LiquidNo CleanIPC J-STD-0048508N11000000

    Casting Metals

    Melt and pour these alloys into molds to create metal parts and prototypes.
    Indium Alloy
    Image of Product. Front orientation. Casting Metals.
    Indium alloys expand slightly as they solidify, pushing into the crevices of a mold to produce detailed replicas. These alloys are useful for repairing dies, creating fusible links, and holding delicate parts for machining. They also have a low melting temperature so they can be cast in molds made from glass, quartz, mica, and ceramic.
    Material Composition
    Approximate
    Melting
    Temp., ° F
    Bismuth
    Lead
    Tin
    Cadmium
    Indium
    Thick.
    Wd.
    Lg.
    Dia.
    Wt.,
    lb.
    Shape
    Each
    11745%23%8%5%19%1/4"2"4 1/2"—1/2Sheet, Bar88635K2000000
    13649%18%12%—21%1/4"1 7/8"4 1/2"—1/2Sheet, Bar88635K400000
    14048%25%13%9%5%1/2"——3 1/2"1Rod, Disc88635K26000000
    14748%25%13%10%4%1/2"——3 1/2"1Rod, Disc88635K28000000

    Low-Melting-Point Solder Ribbon for Low-Temperature Applications

    Made with indium this solder is soft and malleable—even as temperatures approach absolute zero—allowing this solder to form an airtight seal between metal and certain non-metal materials. It’s often used in cryogenic applications, including those with liquid nitrogen. Thanks to its ribbon shape, this solder is easier to use on large, flat areas than wire solder.
    This solder has a lower melting point than most solders, making it good for sensitive assemblies, such as semiconductors and electronic components. Unlike commonly used tin-based solders, this solder won’t damage gold plating on circuit boards. It’s also a good conductor of heat and electricity. More durable than standard tin-lead solder, this solder is less likely to crack from repeated temperature swings. It’s low outgassing, so you can also use it in high-vacuum applications.
    This indium-based solder can be cold welded, meaning it will bond to itself without heat. You can also use it for step soldering with traditional solders. It does not have a flux core, choose soldering flux to prepare workpieces for this solder.
    Leaded, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Leaded solder has greater tensile strength and density than other indium-based solders, giving it a stronger hold.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Silver
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In80Pb15Ag580%5%15%310432,55012"1"0.002"5940N110000000
     
    Lead-Free, Flux Required
    Image of Product. Front orientation. Solder. Low-Melting-Point Solder Ribbon for Low-Temperature Applications.
    Lead-free solder is safer to use than leaded solder and helps meet industry regulations.
    Material
    Composition
    0.1 oz.
    Solder
    Alloy
    Indium
    Tin
    Lead
    Melting
    Temp., ° F
    Thermal Conductivity,
    W/(m⋅°C)
    Tensile Strength,
    psi
    Lg.
    Wd.
    Thk.
    Each
    For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy
    In52Sn4852%48%0%245341,72012"1"0.002"7906N120000000
    In100100%—0%3158627012"1"0.002"7906N11000000
     

    Conductive Gallium

    Image of Product. Front orientation. Gallium. Conductive Gallium.
    A safe alternative to mercury in thermometers and thermostats, gallium transfers heat and electricity without toxic vapor that can be inhaled. Also known as Galinstan. Its low melting point means it's liquid at room temperature. When used next to parts that generate concentrated heat, it dissipates the heat quickly, making it good thermal interface material. It also allows electricity to pass throughout it, so it's often used in switches and electronics that must bend and flex.
    Gallium clings to both metallic and nonmetallic surfaces such as glass and quartz. However, it eats away at most metal when used at high temperatures and dissolves aluminum even at ambient temperatures.
    When choosing gallium, keep in mind its composition. The higher the gallium and indium content, the better it is at transferring heat. Gallium with tin reduces the melting point, but also decreases how well it transfers heat.
    Material
    Composition
    Container
    Gallium
    Indium
    Tin
    Size, fl.
    oz.
    Type
    Melting
    Temp., ° F
    Max. Temp.,
    ° F
    For Use On
    Each
    66.5%20.5%13%0.1Syringe50930Glass, Nickel, Quartz, Stainless Steel, Steel6244N110000000
    75.5%24.5%—0.1Syringe60930Glass, Nickel, Quartz, Stainless Steel, Steel6244N12000000
    back to top