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    2 Products

    Non-Bonding Heat Transfer Compounds

    Image of Product. Front orientation. Thermal Paste. Non-Bonding Heat Transfer Compounds.
    Also known as thermal paste, these boron-nitride compounds increase heat transfer between parts while preventing them from sticking. Unlike antiseize compounds, they don't conduct electricity, so you won't risk shorting out sensitive electronics. They're often used on thermocouple probes to improve accuracy. You can also use them in 3D printer heating blocks and other high-temperature areas to keep parts from fusing together.
    Container
    Size, fl.
    oz.
    Type
    Chemical
    Max.
    Temp.
    Thermal Conductivity
    @ Temp.
    Color
    Includes
    For Use On
    For Use With
    Each
    0.2SyringeBoron Nitride1,562° F
    850° C
    31.4 W/(m⋅°C) @ 212° FWhiteThree Applicator Brushes3D Printer Extruder Heating Elements, Electrical ComponentsAluminum, Brass, Copper, Iron, Nickel, Stainless Steel, Steel, Titanium0000000000000
    1SyringeBoron Nitride1,562° F
    850° C
    31.4 W/(m⋅°C) @ 212° FWhite3D Printer Extruder Heating Elements, Electrical ComponentsAluminum, Brass, Copper, Iron, Nickel, Stainless Steel, Steel, Titanium000000000000
     
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