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Quick-Flow No-Clean Flux-Core Solder for Electronics and Electrical Applications
Lead-Free, Flux Core
Rosin Flux-Core Solder for Electronics and Electrical Applications
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Leaded, Flux Core
Material Composition | |||||||||
|---|---|---|---|---|---|---|---|---|---|
Solder Alloy | Tin | Lead | Melting Temp., ° F | Dia. | Wt., lb. | Each | |||
For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel | |||||||||
| Sn50Pb50 | 50% | 50% | 420 | 0.032" | 1 | 7659A111 | 000000 | ||
Lead-Free, Flux Core
Material Composition | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
Solder Alloy | Tin | Copper | Lead | Melting Temp., ° F | Dia. | Wt., lb. | Each | |||
For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel | ||||||||||
| Sn99.3Cu0.7 | 99.3% | 0.7% | 0% | 440 | 0.032" | 1 | 7872A115 | 000000 | ||
Quick-Flow Rosin Flux-Core Solder for Electronics and Electrical Applications
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Solder
Solder for Electronics and Electrical Applications
Rosin Flux-Core High-Melting-Point Solder for Electronics and Electrical Applications
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Leaded, Flux Core
Material Composition | 1 lb. | ||||||||
|---|---|---|---|---|---|---|---|---|---|
Solder Alloy | Tin | Silver | Lead | Dia. | Melting Temp., ° F | Each | |||
For Joining Brass, Bronze, Copper, Nickel, Stainless Steel, and Steel | |||||||||
| Pb93Sn5Ag2 | 5% | 2% | 93% | 0.032" | 535 | 7685A21 | 000000 | ||
Solder for Stainless Steel
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Leaded, Flux Required
Material Composition | 1 lb. | ||||||||
|---|---|---|---|---|---|---|---|---|---|
Solder Alloy | Tin | Silver | Lead | Dia. | Melting Temp., ° F | Each | |||
For Joining Stainless Steel | |||||||||
| Pb54Sn45Ag1 | 45% | 1% | 54% | 0.032" | 410 | 5275N11 | 000000 | ||





























