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REACH
Low-Melting-Point Solder for Low-Temperature Applications
Leaded, Flux Required
Material Composition | 0.16 oz. | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
Solder Alloy | Indium | Silver | Lead | Dia. | Melting Temp., ° F | Thermal Conductivity, W/(m⋅°C) | Tensile Strength, psi | Each | |||
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy | |||||||||||
| In80Pb15Ag5 | 80% | 5% | 15% | 0.030" | 310 | 43 | 2,550 | 6976N11 | 0000000 | ||
Low-Melting-Point Solder Ribbon for Low-Temperature Applications
Leaded, Flux Required
Material Composition | 0.1 oz. | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Solder Alloy | Indium | Silver | Lead | Melting Temp., ° F | Thermal Conductivity, W/(m⋅°C) | Tensile Strength, psi | Lg. | Wd. | Thk. | Each | |||
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy | |||||||||||||
| In80Pb15Ag5 | 80% | 5% | 15% | 310 | 43 | 2,550 | 12" | 1" | 0.002" | 5940N11 | 0000000 | ||
Lead-Free, Flux Required
Material Composition | 0.1 oz. | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Solder Alloy | Indium | Tin | Lead | Melting Temp., ° F | Thermal Conductivity, W/(m⋅°C) | Tensile Strength, psi | Lg. | Wd. | Thk. | Each | |||
For Joining Aluminum, Brass, Bronze, Ceramic, Glass, Gold, Nickel, Quartz, Stainless Steel, Steel, and Zinc Alloy | |||||||||||||
| In52Sn48 | 52% | 48% | 0% | 245 | 34 | 1,720 | 12" | 1" | 0.002" | 7906N12 | 0000000 | ||
| In100 | 100% | — | 0% | 315 | 86 | 270 | 12" | 1" | 0.002" | 7906N11 | 000000 | ||



























