Soldering Flux | McMaster-Carr

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84 Products

Soldering Flux for Plumbing


Bottle	Jar

Use this flux for plumbing applications. The residue easily washes away with just water. Do not use it on magnesium or electronics.

Pastes—Paste flux is easy to apply for precision applications. It meets NSF/ANSI 61 safety standards for drinking water.

	Container
For Joining	Size	Type	Form	Cleanup Method	Environment	Mil. Spec.	Food Industry Std.		Each
Steel, Copper, Brass, Zinc Alloy	2 fl. oz.	Jar	Paste	Water	Food and Beverage	MIL-F-4995 Type II	NSF/ANSI 61	0000000	00000
Steel, Copper, Brass, Zinc Alloy	4 fl. oz.	Jar	Paste	Water	Food and Beverage	MIL-F-4995 Type II	NSF/ANSI 61	0000000	0000
Steel, Nickel, Copper, Brass, Zinc Alloy	16 fl. oz.	Bottle	Liquid	Water	—	—	—	0000000	00000
Steel, Copper, Brass, Zinc Alloy	16 fl. oz.	Jar	Paste	Water	Food and Beverage	MIL-F-4995 Type II	NSF/ANSI 61	0000000	00000
Steel, Nickel, Copper, Brass, Zinc Alloy	32 fl. oz.	Bottle	Liquid	Water	—	—	—	0000000	00000
Steel, Nickel, Copper, Brass, Zinc Alloy	1 gal.	Bottle	Liquid	Water	—	—	—	0000000	00000

Easy-Clean Soldering Flux for Electronics


Pen	Syringe	Bottle	Jar

The flux residue easily washes away with water. The flux cleans and prepares electrical assemblies and printed circuit boards for soldering.

Pastes—Paste flux is easy to apply for precision applications.

	Container			Tip
For Joining	Size	Net Wt.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Nickel, Copper, Brass	0.3 fl. oz.	—	Pen	Chisel	0.157"	Liquid	Water	IPC J-STD-004	000000	000000
Nickel, Copper, Brass	0.3 fl. oz.	—	Syringe	Needle	0.031"	Paste	Water	IPC J-STD-004	000000	00000
Nickel, Copper, Brass	2 fl. oz.	—	Bottle	—	—	Liquid	Water	IPC J-STD-004	000000	0000
Nickel, Copper, Brass	4 fl. oz.	—	Bottle	—	—	Liquid	Water	IPC J-STD-004	000000	00000
Nickel, Copper, Brass	16 fl. oz.	—	Bottle	—	—	Liquid	Water	IPC J-STD-004	000000	00000
Nickel, Copper, Brass	32 fl. oz.	—	Bottle	—	—	Liquid	Water	IPC J-STD-004	000000	00000
Nickel, Copper, Brass	1 gal.	—	Bottle	—	—	Liquid	Water	IPC J-STD-004	000000	00000
Nickel, Copper, Brass	—	8 oz.	Jar	—	—	Paste	Water	IPC J-STD-004	0000000	00000
Nickel, Copper, Brass	—	1 lb.	Jar	—	—	Paste	Water	IPC J-STD-004	0000000	00000
Copper, Brass, Bronze	0.3 fl. oz.	—	Pen	Chisel	0.2"	Liquid	Water	IPC J-STD-004	0000000	0000

No-Clean Soldering Flux for Electronics


Pen	Syringe	Jar

This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.

Pastes—Paste flux is easier to apply than liquid flux for precise applications.

	Container			Tip
For Joining	Size, fl. oz.	Net Wt.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met	Features	Cannot Be Sold To		Each
Nickel, Copper, Brass, Bronze	0.3	—	Syringe	—	—	Paste	No Clean	IPC J-STD-004	Luer Lock Connection	—	0000000	000000
Nickel, Copper, Brass, Bronze	—	3 1/2 oz.	Jar	—	—	Paste	No Clean	IPC J-STD-004	—	—	0000000	00000
Nickel, Copper, Brass, Bronze	—	1 lb.	Jar	—	—	Paste	No Clean	IPC J-STD-004	—	—	0000000	000000
Copper, Brass, Bronze	0.3	—	Pen	Chisel	0.2"	Liquid	No Clean	IPC J-STD-004	—	Outside United States and Canada	0000000	0000

Soldering Flux for Stainless Steel


Syringe	Bottle	Jar

Often used on metal that is difficult to solder, this flux works with stainless steel, Monel, and Inconel. Easily wash away residue with water.

Pastes—Paste flux is easier to apply than liquid flux, so it is a good choice for precise applications.

	Container			Tip
For Joining	Size, fl. oz.	Net Wt.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Stainless Steel	0.3	—	Syringe	Needle	0.055"	Paste	Water	Fed. Spec. A-A-51145 Type I Form A	0000000	000000
Stainless Steel	16	—	Bottle	—	—	Liquid	Water	Fed. Spec. A-A-51145 Type II Form B	000000	00000
Stainless Steel	32	—	Bottle	—	—	Liquid	Water	Fed. Spec. A-A-51145 Type II Form B	000000	00000
Stainless Steel	—	8 oz.	Jar	—	—	Paste	Water	Fed. Spec. A-A-51145 Type I Form A	0000000	00000
Stainless Steel	—	1 lb.	Jar	—	—	Paste	Water	Fed. Spec. A-A-51145 Type I Form A	0000000	00000

Brazing Flux

Use this flux with silver and copper-based brazing alloys to clean and prepare surfaces. Residue washes off with hot water. Do not use it with titanium.

		Container
	Max. Temp., ° F	Net Wt.	Type	Color	Form	Cleanup Method	Specs. Met		Each
For Joining Brass, Bronze, Copper, Stainless Steel, Steel



		1,600	6 oz.	Applicator-Top Can	White	Paste	Water	AWS A5.31 Type FB3A, Fed. Spec. O-F-499 Type B, SAE AMS3410	00000000	00000


		1,600	8 oz.	Jar	White	Paste	Water	AWS A5.31 Type FB3A, Fed. Spec. O-F-499 Type B, SAE AMS3410	000000	0000
		1,600	1 lb.	Jar	White	Paste	Water	AWS A5.31 Type FB3A, Fed. Spec. O-F-499 Type B, SAE AMS3410	000000	00000

Fluoride-Free Brazing Flux

Since this flux doesn’t contain any fluoride, it’s environmentally friendly and safe if it gets on your hands. Use it with silver- and copper-based brazing alloys to clean and prepare surfaces.

		Container
	Max. Temp., ° F	Net Wt.	Type	Color	Form	Cleanup Method		Each
For Joining Brass, Copper, Silver



		1,600	8 oz.	Jar	White	Paste	Water	0000000	000000


		1,600	1 lb.	Jar	White	Paste	Water	0000000	00000

Nokorode Soldering Flux

Protect the solder joint from corrosion with this flux paste. The residue easily washes away with water. Since this flux meets NSF/ANSI 61, it's safe to use with drinking water. Do not use it on magnesium or electronics. It’s a paste, so it’s easy to apply for precision applications.

	Container
For Joining	Net Wt.	Type	Form	Cleanup Method	Environment	Specs. Met	Mil. Spec.	Food Industry Std.		Each
Nickel, Copper, Zinc Alloy	1.7 oz.	Jar	Paste	Water	Food and Beverage	Fed. Spec. A-A-51145 Type I Form A	MIL-S-6872	NSF/ANSI 61	000000	00000
Nickel, Copper, Zinc Alloy	4 oz.	Jar	Paste	Water	—	Fed. Spec. A-A-51145 Type I Form A	MIL-S-6872	NSF/ANSI 61	0000000	0000
Nickel, Copper, Zinc Alloy	8 oz.	Jar	Paste	Water	—	Fed. Spec. A-A-51145 Type I Form A	MIL-S-6872	NSF/ANSI 61	0000000	00000
Nickel, Copper, Zinc Alloy	1 lb.	Jar	Paste	Water	Food and Beverage	Fed. Spec. A-A-51145 Type I Form A	MIL-S-6872	NSF/ANSI 61	000000	00000

Mildly-Activated Rosin Soldering Flux for Electronics


Pen	Syringe	Bottle	Jar

This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Use this flux to clean and prepare electrical assemblies and printed circuit boards for soldering.

Pastes—Paste flux is easy to apply in precise applications.

	Container			Tip
For Joining	Size	Net Wt.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Nickel, Copper, Brass, Bronze, Zinc Alloy	1 gal.	—	Bottle	—	—	Liquid	Flux Remover	IPC J-STD-004	0000000	000000
Nickel, Copper, Brass	10 ml	—	Syringe	Needle	0.055"	Paste	Flux Remover	IPC J-STD-004	00000000	00000
Nickel, Copper, Brass	—	8 oz.	Jar	—	—	Paste	Flux Remover	IPC J-STD-004	00000000	00000
Nickel, Copper, Brass	—	1 lb.	Jar	—	—	Paste	Flux Remover	IPC J-STD-004	00000000	00000
Copper	1/5 fl. oz.	—	Pen	Needle	0.013"	Liquid	Flux Remover	IPC J-STD-004	0000000	00000

Lead-Free No-Clean Soldering Flux for Electronics

This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering.

	Container		Tip
For Joining	Size, fl. oz.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Copper, Brass, Bronze	0.3	Pen	Chisel	0.2"	Liquid	No Clean	IPC J-STD-004	0000000	000000

Soldering Flux for Aluminum

Solder aluminum to itself, copper, or brass. This flux paste is easier to apply precisely than liquid flux. Simply wash the flux residue away with water.

	Container
For Joining	Size, fl. oz.	Type	Form	Cleanup Method	Mil. Spec.		Each
Aluminum	4	Jar	Paste	Water	DOD-STD-1866	000000	000000

Fast-Flushing Soldering Flux for Plumbing

This flux is the fastest to remove from plumbing pipelines. Its residue easily washes away with water. Since it meets NSF/ANSI 61, it’s safe to use in drinking water systems. Do not use it on magnesium or electronics. It’s a paste, so it’s easy to apply in precise applications.

	Container
For Joining	Net Wt.	Type	Form	Cleanup Method	Environment	Specs. Met	Food Industry Std.		Each
Copper	2 oz.	Jar	Paste	Water	Food and Beverage	ASTM B813	NSF/ANSI 61	0000000	00000
Copper	4 oz.	Jar	Paste	Water	Food and Beverage	ASTM B813	NSF/ANSI 61	00000000	00000
Copper	8 oz.	Jar	Paste	Water	Food and Beverage	ASTM B813	NSF/ANSI 61	0000000	00000
Copper	1 lb.	Jar	Paste	Water	Food and Beverage	ASTM B813	NSF/ANSI 61	0000000	00000

Nokorode Soldering Flux for High-Temperature Applications

A special formulation of Nokorode soldering flux, this flux remains thick at temperatures up to 115° F and protects your solder joint from corrosion. It’s a paste, so it’s easy to apply for precision applications. However, you shouldn't use it on magnesium or electronics.

	Container
For Joining	Net Wt.	Type	Form	Cleanup Method	Specs. Met	Mil. Spec.		Each
Nickel, Copper, Zinc Alloy	8 oz.	Jar	Paste	Water	Fed. Spec. A-A-51145 Type I Form A	MIL-S-6872	0000000	000000
Nickel, Copper, Zinc Alloy	1 lb.	Jar	Paste	Water	Fed. Spec. A-A-51145 Type I Form A	MIL-S-6872	0000000	00000

Rubyfluid Soldering Flux


Bottle	Jar

This flux causes solder to flow in a thin film to create strong joints with minimal solder use. The residue easily washes away with water. Do not use it on magnesium or electronics.

Pastes—Paste flux is easy to apply for precision applications.

	Container
For Joining	Size	Net Wt.	Type	Form	Cleanup Method		Each
Copper	16 fl. oz.	—	Bottle	Liquid	Water	000000	000000
Copper	32 fl. oz.	—	Bottle	Liquid	Water	000000	00000
Copper	1 gal.	—	Bottle	Liquid	Water	000000	00000
Copper	—	2 oz.	Jar	Paste	Water	0000000	0000
Copper	—	8 oz.	Jar	Paste	Water	0000000	00000
Copper	—	1 lb.	Jar	Paste	Water	0000000	00000

Soldering Flux for High-Temperature Plumbing

Fortified with tin, this flux protects nondrinking water pipes from oxidation, especially under high temperatures. It’s a paste, so it’s easy to apply for precision applications. Do not use it on magnesium or electronics.

	Container
For Joining	Net Wt.	Type	Form	Cleanup Method	Application Temp. Range, ° F		Each
Copper, Brass	2 oz.	Jar	Paste	Water	200 to 600	0000000	00000
Copper, Brass	8 oz.	Jar	Paste	Water	200 to 600	0000000	00000
Copper, Brass	1 lb.	Jar	Paste	Water	200 to 600	0000000	00000

Flux Removers


Aerosol Can	Pen

For applications such as printed circuit boards, switches, and heat sinks, these removers get rid of any residue left behind by no-clean flux.

Pen—Pens are best for spot cleaning and precise removal.

For Removing—Lead-free and rosin flux removers are designed to remove the flux residue but not impact the remaining solder. It's common to use this remover when soldering with lead-free and tin/lead solders.

Cannot Be Sold To—Flux removers cannot be sold to the listed jurisdictions/areas due to import and product regulations.

	Container			Tip
For Removing	Size, fl. oz.	Net Wt., oz.	Type	Shape	Dia.	Form	Cannot Be Sold To		Each
Easy-Clean Flux, No-Clean Flux	—	12	Aerosol Can	—	—	Aerosol	Outside United States, Canada, and Mexico	0000000	000000
Easy-Clean Flux, No-Clean Flux	0.3	—	Pen	Chisel	0.2"	Liquid	Outside United States	0000000	00000
Lead-Free Flux, Rosin Flux	—	12	Aerosol Can	—	—	Aerosol	Outside United States	0000000	00000
Lead-Free Flux, Rosin Flux	0.3	—	Pen	Chisel	0.2"	Liquid	Outside United States	0000000	00000

Brazing Flux for Nickel and Carbide

Use this flux with silver and copper-based brazing alloys to clean and prepare surfaces. It is boron modified and residue washes off with hot water. Do not use it with titanium.

2,200° F Maximum Temperature—Flux with a 2200° F max. temperature lasts longer during brazing thanks to its low boron content, so it’s great for use on large carbide parts. It works particularly well with RBCuZn brazing alloys.

		Container
	Max. Temp., ° F	Net Wt.	Type	Color	Form	Cleanup Method	Specs. Met		Each
For Joining Nickel, Carbide



		1,700	6 oz.	Applicator-Top Can	Black	Paste	Water	AWS A5.31 Type FB3C, Fed. Spec. O-F-499 Type B, SAE AMS3411	0000000	000000


		1,700	8 oz.	Jar	Black	Paste	Water	AWS A5.31 Type FB3C, Fed. Spec. O-F-499 Type B, SAE AMS3411	0000000	00000
		1,700	1 lb.	Jar	Black	Paste	Water	AWS A5.31 Type FB3C, Fed. Spec. O-F-499 Type B, SAE AMS3411	0000000	00000
		2,200	8 oz.	Jar	Brown	Paste	Water	AWS A5.31 Type FB3D, SAE AMS3417	0000000	00000
		2,200	1 lb.	Jar	Brown	Paste	Water	AWS A5.31 Type FB3D, SAE AMS3417	0000000	00000

Fully-Activated Rosin Soldering Flux for High-Temperature Electronics

With the strongest cleaning power, this flux is fully activated to clean and prepare electrical assemblies and printed circuit boards for high-temperature soldering applications. However, it requires flux remover to clean residue for a reliable joint.

					4 fl. oz. Container		16 fl. oz. Container
For Joining	Form	Cleanup Method	Application Temp. Range, ° F	Specs. Met		Each		Each
Nickel, Copper, Brass, Bronze, Zinc Alloy	Liquid	Flux Remover	390 to 840	IPC J-STD-004	0000000	000000	0000000	000000

Empty Needle-Point Pen Dispenser for Soldering Flux

Fill this dispenser with the flux of your choice to prepare electrical assemblies and printed circuit boards for soldering.

Container		Tip
Size, fl. oz.	Type	Shape	Dia.		Each
1/5	Pen	Needle	0.013"	0000000	00000

No-Clean Soldering Flux for Low-Melting-Point Solders

Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.

	Container		Tip
For Joining	Size, fl. oz.	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met		Each
Copper, Indium, Indium Alloy	4/5	Syringe	Needle	0.096"	Liquid	No Clean	IPC J-STD-004	0000000	000000
Copper, Bismuth	4/5	Syringe	Needle	0.096"	Liquid	No Clean	IPC J-STD-004	0000000	00000

Nokorode Soldering Flux for Low-Temperature Applications

Specially formulated, this Nokorode flux remains soft and sticky in temperatures down to -4° F and protects your solder joint from corrosion. It is paste, so it is easy to apply in precise applications. However, this flux is not for use on magnesium or electronics.

	Container
For Joining	Net Wt.	Type	Form	Cleanup Method	Specs. Met	Mil. Spec.		Each
Nickel, Copper, Zinc Alloy	8 oz.	Jar	Paste	Water	Fed. Spec. A-A-51145 Type I Form A	MIL-S-6872	0000000	000000
Nickel, Copper, Zinc Alloy	1 lb.	Jar	Paste	Water	Fed. Spec. A-A-51145 Type I Form A	MIL-S-6872	0000000	00000

Fully-Activated Rosin Soldering Flux for Electronics

Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.

	Container
For Joining	Size, gal.	Type	Form	Cleanup Method	Specs. Met		Each
Nickel, Copper, Brass, Bronze, Zinc Alloy	1	Bottle	Liquid	Flux Remover	IPC J-STD-004	0000000	000000

Desoldering Iron Nozzle Tip Cleaners

Scrape away solder buildup to keep desoldering nozzles clean.

No. of Cleaners	Cleaner Dia.	Lg.	Material	Case Material		Each
12	0.019" to 0.065"	4 7/8"	Aluminum	Aluminum	0000000	000000

Nonactivated Rosin Soldering Flux for Electronics


Pen	Bottle

This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.

	Container		Tip
For Joining	Size	Type	Shape	Dia.	Form	Cleanup Method	Specs. Met	Cannot Be Sold To		Each
Nickel, Copper, Brass, Bronze, Zinc Alloy	1 gal.	Bottle	—	—	Liquid	Flux Remover	IPC J-STD-004	—	0000000	000000
Copper, Brass, Bronze	0.3 fl. oz.	Pen	Chisel	0.2"	Liquid	Flux Remover	IPC J-STD-004	Outside United States and Canada	0000000	0000

Soldering Flux for High-Temperature Aluminum

Often used to solder aluminum to difficult-to-solder metal such as stainless steel and nickel, this flux works in applications up to 800° F. You can also use it with a torch in low-temperature brazing applications. Mix the powder with methanol before use.

	Container
For Joining	Size	Type	Form	Cleanup Method	Application Temp. Range, ° F		Each
Aluminum	1 lb.	Jar	Powder	Water	650 to 800	0000000	0000000
Aluminum	4 fl. oz.	Jar	Powder	Water	650 to 800	0000000	00000
Aluminum	8 fl. oz.	Jar	Powder	Water	650 to 800	0000000	00000

No-Clean Brazing Flux for Joining Aluminum to Copper

Clean and prepare surfaces before joining aluminum to copper. With minimal residue, this flux does not require cleanup.

		Container
	Max. Temp., ° F	Net Wt.	Type	Color	Form	Cleanup Method		Each
For Joining Aluminum, Copper



		985	4 oz.	Jar	Gray	Paste	No Clean	0000000	000000


		985	8 oz.	Jar	Gray	Paste	No Clean	0000000	00000
		985	1 lb.	Jar	Gray	Paste	No Clean	0000000	000000

Brazing Flux for Aluminum

Clean and prepare surfaces for brazing jobs that require you to join aluminum.

		Container
	Max. Temp., ° F	Net Wt., oz.	Type	Color	Form	Cleanup Method		Each
For Joining Aluminum



		1,280	6	Jar	White	Powder	Water	0000000	000000


		1,280	12	Jar	White	Powder	Water	0000000	00000