McMaster-Carr logo
    Filter by
    Container Type
    Soldering Flux Activation
    For Use With
    Form
    Cleanup Method
    Maximum Application Temperature
    Maximum Temperature
    U.S.–Mexico–Canada Agreement (USMCA) Qualifying
    DFARS Specialty Metals
    Export Control Classification Number (ECCN)
    Industrial Info Snippet
    Specifications Met
    Minimum Temperature
    Performance
    Minimum Application Temperature
    Forward
    Enter e-mail addresses in the fields below
    Message
    Cancel
    Print
    How can we improve?
    Comments
    E-mail address (if you would like a response)
    3 Products

    Fully-Activated Rosin Soldering Flux for High-Temperature Electronics

    Image of Product. Front orientation. Soldering Flux. Fully-Activated Rosin Soldering Flux for High-Temperature Electronics.
    With the strongest cleaning power, this flux is fully activated to clean and prepare electrical assemblies and printed circuit boards for high-temperature soldering applications. However, it requires flux remover to clean residue for a reliable joint.
    4 fl. oz.
    Container
    16 fl. oz.
    Container
    For Joining
    Form
    Cleanup
    Method
    Application
    Temp. Range, ° F
    Specs. Met
    Each
    Each
    Nickel, Copper, Brass, Bronze, Zinc AlloyLiquidFlux Remover390 to 840IPC J-STD-0047158N110000007158N12000000

    Fully-Activated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Fully-Activated Rosin Soldering Flux for Electronics.
    Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Container
    For Joining
    Size,
    gal.
    Type
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1BottleLiquidFlux RemoverIPC J-STD-0047798A12000000
    back to top