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    27 Products

    No-Clean Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Syringe.
    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Electronics, Jar.

    Pen

    Syringe

    Jar

    This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
    Pastes—Paste flux is easier to apply than liquid flux for precise applications.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Net Wt.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Features
    Cannot Be Sold To
    Each
    Nickel, Copper, Brass, Bronze0.3—Syringe——PasteNo CleanIPC J-STD-004Luer Lock Connection—7206N11000000
    Nickel, Copper, Brass, Bronze—3 1/2 oz.Jar——PasteNo CleanIPC J-STD-004——7206N1200000
    Nickel, Copper, Brass, Bronze—1 lb.Jar——PasteNo CleanIPC J-STD-004——7206N13000000
    Copper, Brass, Bronze0.3—PenChisel0.2"LiquidNo CleanIPC J-STD-004—Outside United States and Canada7893A210000

    Easy-Clean Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Easy-Clean Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. Easy-Clean Soldering Flux for Electronics, Syringe.
    Image of Product. Front orientation. Soldering Flux. Easy-Clean Soldering Flux for Electronics, Bottle.
    Image of Product. Front orientation. Soldering Flux. Easy-Clean Soldering Flux for Electronics, Jar.

    Pen

    Syringe

    Bottle

    Jar

    The flux residue easily washes away with water. The flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Pastes—Paste flux is easy to apply for precision applications.
    Container
    Tip
    For Joining
    Size
    Net
    Wt.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass0.3 fl. oz.—PenChisel0.157"LiquidWaterIPC J-STD-0047755A5000000
    Nickel, Copper, Brass0.3 fl. oz.—SyringeNeedle0.031"PasteWaterIPC J-STD-0047755A600000
    Nickel, Copper, Brass2 fl. oz.—Bottle——LiquidWaterIPC J-STD-0047755A40000
    Nickel, Copper, Brass4 fl. oz.—Bottle——LiquidWaterIPC J-STD-0047755A700000
    Nickel, Copper, Brass16 fl. oz.—Bottle——LiquidWaterIPC J-STD-0047755A100000
    Nickel, Copper, Brass32 fl. oz.—Bottle——LiquidWaterIPC J-STD-0047755A200000
    Nickel, Copper, Brass1 gal.—Bottle——LiquidWaterIPC J-STD-0047755A300000
    Nickel, Copper, Brass—8 oz.Jar——PasteWaterIPC J-STD-0047755A1100000
    Nickel, Copper, Brass—1 lb.Jar——PasteWaterIPC J-STD-0047755A1200000
    Copper, Brass, Bronze0.3 fl. oz.—PenChisel0.2"LiquidWaterIPC J-STD-0047893A230000

    Mildly-Activated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Syringe.
    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Bottle.
    Image of Product. Front orientation. Soldering Flux. Mildly-Activated Rosin Soldering Flux for Electronics, Jar.

    Pen

    Syringe

    Bottle

    Jar

    This flux has strong cleaning action and leaves residue that will not compromise the reliability of the joint. The residue requires flux remover. Use this flux to clean and prepare electrical assemblies and printed circuit boards for soldering.
    Pastes—Paste flux is easy to apply in precise applications.
    Container
    Tip
    For Joining
    Size
    Net
    Wt.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1 gal.—Bottle——LiquidFlux RemoverIPC J-STD-0047798A16000000
    Nickel, Copper, Brass10 ml—SyringeNeedle0.055"PasteFlux RemoverIPC J-STD-0047799A10100000
    Nickel, Copper, Brass—8 oz.Jar——PasteFlux RemoverIPC J-STD-0047799A10200000
    Nickel, Copper, Brass—1 lb.Jar——PasteFlux RemoverIPC J-STD-0047799A10300000
    Copper1/5 fl. oz.—PenNeedle0.013"LiquidFlux RemoverIPC J-STD-0047799A1100000

    Lead-Free No-Clean Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Lead-Free No-Clean Soldering Flux for Electronics.
    This flux leaves minimal residue so there's no cleanup. It cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Copper, Brass, Bronze0.3PenChisel0.2"LiquidNo CleanIPC J-STD-0047893A24000000

    No-Clean Soldering Flux for Low-Melting-Point Solders

    Image of Product. Front orientation. Soldering Flux. No-Clean Soldering Flux for Low-Melting-Point Solders.
    Prepare workpieces for low-temperature lead-free soldering. This flux leaves minimal residue, so there’s no cleanup required. It doesn’t need to be used quickly; it can sit for hours without degrading.
    Container
    Tip
    For Joining
    Size, fl.
    oz.
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Copper, Indium, Indium Alloy4/5SyringeNeedle0.096"LiquidNo CleanIPC J-STD-0048508N11000000
    Copper, Bismuth4/5SyringeNeedle0.096"LiquidNo CleanIPC J-STD-0048508N1200000

    Fully-Activated Rosin Soldering Flux for High-Temperature Electronics

    Image of Product. Front orientation. Soldering Flux. Fully-Activated Rosin Soldering Flux for High-Temperature Electronics.
    With the strongest cleaning power, this flux is fully activated to clean and prepare electrical assemblies and printed circuit boards for high-temperature soldering applications. However, it requires flux remover to clean residue for a reliable joint.
    4 fl. oz.
    Container
    16 fl. oz.
    Container
    For Joining
    Form
    Cleanup
    Method
    Application
    Temp. Range, ° F
    Specs. Met
    Each
    Each
    Nickel, Copper, Brass, Bronze, Zinc AlloyLiquidFlux Remover390 to 840IPC J-STD-0047158N110000007158N12000000

    Fully-Activated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Fully-Activated Rosin Soldering Flux for Electronics.
    Providing the strongest cleaning power, this flux leaves residue that must be removed to ensure the reliability of the joint. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering.
    Container
    For Joining
    Size,
    gal.
    Type
    Form
    Cleanup
    Method
    Specs. Met
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1BottleLiquidFlux RemoverIPC J-STD-0047798A12000000

    Nonactivated Rosin Soldering Flux for Electronics

    Image of Product. Front orientation. Soldering Flux. Nonactivated Rosin Soldering Flux for Electronics, Pen.
    Image of Product. Front orientation. Soldering Flux. Nonactivated Rosin Soldering Flux for Electronics, Bottle.

    Pen

    Bottle

    This flux has less cleaning action, but leaves the least amount of residue. The residue requires flux remover. Flux cleans and prepares electrical assemblies and printed circuit boards for soldering. Product regulations restrict sales to the listed jurisdictions/areas.
    Container
    Tip
    For Joining
    Size
    Type
    Shape
    Dia.
    Form
    Cleanup
    Method
    Specs. Met
    Cannot Be Sold To
    Each
    Nickel, Copper, Brass, Bronze, Zinc Alloy1 gal.Bottle——LiquidFlux RemoverIPC J-STD-004—7798A14000000
    Copper, Brass, Bronze0.3 fl. oz.PenChisel0.2"LiquidFlux RemoverIPC J-STD-004Outside United States and Canada7893A220000
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