An alternative to thermal paste, these soft, flexible pads transfer heat from a source to a heat sink. They compress slightly to make up for surface imperfections and roughness. These pads are conformable with a slightly tacky surface that lightly adheres to both smooth and rough surfaces. Pads meet UL 94 V-0 for flame retardance.

Made of indium, this foil is more thermally conductive than thermal interface materials (TIMs) made of plastic. By efficiently pulling heat away from components that produce heat, such as CPUs, this foil lets you use smaller forced cooling systems to extend battery life. It’s also softer and more ductile than paste and putty, covering surfaces better to minimize airflow gaps and increase heat flow. Unlike paste and grease, this foil won’t leach out from between surfaces over time, nor will it dry out and lose effectiveness. It’s clean, easy to install and reposition, and requires no surface preparation. Foil is corrosion resistant and doesn’t need special storage.

Quickly conduct heat away from electronic components. Tape is made of Kapton® polyimide for excellent electrical isolation, and the thermally conductive silicone rubber facing gives it a nonstick surface.